ABLESTIK 2105

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

ABLESTIK 2105

Main features

  • 20-Minute Pot Life
  • 6,000 mPa s Mixed Viscosity
  • 420 V/mil Dielectric Strength

Product Description

LOCTITE ABLESTIK 2105 is a clear, colorless, solvent-free two-part epoxy adhesive for electrically insulating bonds to glass, ceramics, plastics, and metals. Resin and hardener mix 100:25 by weight. At 25 deg C, typical mixed viscosity is 6,000 mPa s and pot life is 20 minutes. Guideline cure schedules are 24 hours at 25 deg C or one to four hours at 65 deg C. Typical cured dielectric strength is 420 V/mil; volume resistivity at 25 deg C is 2 x 10^14 ohm-cm. The cured operating-temperature range is -70 to 140 deg C, with a typical glass transition temperature of 120 deg C.

Key features

  • 100:25 resin-to-hardener ratio: The two components are proportioned by weight; typical mixed viscosity is 6,000 mPa s at 25 deg C.
  • Cured electrical insulation properties: Typical dielectric strength is 420 V/mil; volume resistivity at 25 deg C is 2 x 10^14 ohm-cm.
  • 120 deg C glass transition: The typical glass transition temperature applies to the cured epoxy, which has a -70 to 140 deg C operating range.

Applications

Fiber-optic connectors; medical-device assembly; structural laminating; aerospace and electronic applications.

Product Family

ABLESTIK 2105

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
Component SystemComponent System
Two (Resin | Hardener)
Pot LifePot Life
20 minutes
Specific GravitySpecific Gravity
1.12
Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
120 °C
Operating TemperatureOperating Temperature
-70 to 140 °C
Physical Properties
Thixotropic indexThixotropic index
1.0
Mechanical Properties
ElongationElongation
4 %
Chemical Properties
Water AbsorptionWater Absorption
0.24 %
Electrical Properties
Dielectric StrengthDielectric Strength
16.5 kV/mm
Volume ResistivityVolume Resistivity
2×10¹⁴ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
TechnologyTwo-part epoxy-Non-conductive adhesive
AppearanceClear, colorless-Mixed material
Mix ratio by weight100:25resin:hardenerTwo-component system
Mixed viscosity6,000mPa s25 deg C
Specific gravity1.12-Mixed material
Pot life20min25 deg C
Cure schedule24 h at 25 deg C or 1 to 4 h at 65 deg C-Guideline schedule
Technical properties

After-processing / final-state properties

Values are typical and not specifications.

PropertyValueUnitMethod / condition
Operating temperature-70 to 140deg CCured adhesive
Shore D hardness84-1 h cure at 65 deg C
Glass transition temperature120deg CCured material
Water absorption0.24%24 h immersion
Dielectric strength420V/milCured material
Volume resistivity2 x 10^14ohm-cm25 deg C
Aluminum lap shear15N/mm21 h cure at 65 deg C

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