ABLESTIK 2126
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 30-Minute Pot Life
- 40,000 mPa s Mixed Viscosity
- -50 to 145 deg C Operation
Product Description
LOCTITE ABLESTIK 2126 BIPAX is a black, opaque, thixotropic two-part epoxy adhesive supplied in BIPAX packaging for electrically insulating bonding and laminating. The solvent-free resin and hardener mix 100:12 by weight, giving a typical mixed viscosity of 40,000 mPa s at 25 deg C. Pot life is 30 minutes. Guideline curing is 24 hours at 25 deg C, or four hours at 25 deg C followed by four hours at 65 deg C. Typical cured properties include 390 V/mil dielectric strength, Shore D hardness 90, and a linear thermal-expansion coefficient of 33 ppm/deg C. The operating-temperature range is -50 to 145 deg C.
Key features
- Thixotropic mixed paste: The resin and hardener mix 100:12 by weight, producing typical mixed viscosity of 40,000 mPa s at 25 deg C.
- Cured dielectric performance: Typical dielectric strength is 390 V/mil; volume resistivity at 25 deg C is 3.80 x 10^16 ohm-cm.
- 33 ppm/deg C linear thermal expansion: This typical cured-material coefficient accompanies a glass transition temperature of 95 deg C.
Applications
Photographic applications; industrial bonding; laminating.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Values are typical and not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Two-part epoxy | - | Non-conductive adhesive |
| Appearance | Black opaque paste | - | Mixed material |
| Mix ratio by weight | 100:12 | resin:hardener | BIPAX package |
| Mixed viscosity | 40,000 | mPa s | 25 deg C |
| Specific gravity | 1.6 | - | Mixed material |
| Pot life | 30 | min | Mixed material |
| Cure schedule | 24 h at 25 deg C or 4 h at 25 deg C plus 4 h at 65 deg C | - | Guideline schedule |
After-processing / final-state properties
Values are typical and not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -50 to 145 | deg C | Cured adhesive |
| Shore D hardness | 90 | - | Cured material |
| Glass transition temperature | 95 | deg C | Cured material |
| Coefficient of linear thermal expansion | 33 | ppm/deg C | Cured material |
| Heat distortion temperature | 102 | deg C | Cured material |
| Dielectric strength | 390 | V/mil | Cured material |
| Volume resistivity | 3.80 x 10^16 | ohm-cm | 25 deg C |
| Aluminum lap shear | 19 | N/mm2 | 2 h cure at 65 deg C |
