ABLESTIK 2130
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 20-Minute Pot Life
- 12,000 mPa s Mixed Viscosity
- 420 V/mil Dielectric Strength
Product Description
LOCTITE ABLESTIK 2130 is a clear, transparent, solvent-free two-part epoxy adhesive for rigid laminating, sealing, and electrically insulating bonds. Resin and hardener mix 100:25 by weight; typical mixed viscosity is 12,000 mPa s at 25 deg C. Pot life is 20 minutes. Guideline cure schedules are 24 hours at 25 deg C or four hours at 65 deg C. Typical cured properties include Shore D hardness 87, 420 V/mil dielectric strength, and a linear thermal-expansion coefficient of 52 ppm/deg C. The cured operating range is -60 to 125 deg C.
Key features
- 12,000 mPa s mixed viscosity: This typical value applies at 25 deg C after mixing resin and hardener 100:25 by weight.
- Cured electrical properties: Typical dielectric strength is 420 V/mil; volume resistivity at 25 deg C is 6 x 10^13 ohm-cm.
- 52 ppm/deg C linear thermal expansion: The typical coefficient applies to the cured epoxy, which has Shore D hardness 87.
Applications
Rigid laminating; sealing; bonding ceramics, glass, glass fabrics, metals, plastic laminates, wood, and most rigid plastics.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Physical Properties
Electrical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
Values are typical and not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Technology | Two-part epoxy | - | Non-conductive adhesive |
| Appearance | Clear, transparent | - | Mixed material |
| Mix ratio by weight | 100:25 | resin:hardener | Two-component system |
| Mixed viscosity | 12,000 | mPa s | 25 deg C |
| Thixotropic index | 1.0 | - | Mixed material |
| Specific gravity | 1.21 | - | Mixed material |
| Pot life | 20 | min | Mixed material |
| Cure schedule | 24 h at 25 deg C or 4 h at 65 deg C | - | Guideline schedule |
After-processing / final-state properties
Values are typical and not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Operating temperature | -60 to 125 | deg C | Cured adhesive |
| Shore D hardness | 87 | - | Cured material |
| Coefficient of linear thermal expansion | 52 | ppm/deg C | Cured material |
| Izod impact strength | 0.2 | ft-lb/in | Notched specimen |
| Reactive solids content | 100 | % | Cured system |
| Dielectric strength | 420 | V/mil | Cured material |
| Volume resistivity | 6 x 10^13 | ohm-cm | 25 deg C |
| NASA outgassing | Pass | - | Cured material |
