ABLESTIK 8177
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- 4-Minute 130 deg C Cure
- 3.0 W/(m K) Thermal Conductivity
- 0.0001 ohm cm Volume Resistivity
Product Description
LOCTITE ABLESTIK 8177 is a one-component silver-filled heat-cure epoxy die-attach adhesive for chip attachment requiring thermal and electrical conductivity, including thermally sensitive devices. Typical cured thermal conductivity is 3.0 W/(m K), volume resistivity is 0.0001 ohm cm, and die-shear strength is 6,300 psi for silicon die bonded to silver at 25 deg C. For assembly, the adhesive has a typical 24-hour work life at 25 deg C and a recommended cure schedule of 4 minutes at 130 deg C. Typical viscosity is 12,000 cP at 25 deg C, measured with Brookfield CP51 at 5 rpm.
Key features
- Thermal conductivity: Cured material has a typical thermal conductivity of 3.0 W/(m K).
- Low volume resistivity: The typical cured value is 0.0001 ohm cm.
- Si-to-Ag die shear: Typical die shear is 6,300 psi for silicon die to silver at 25 deg C.
Applications
Chip attach requiring high thermal conductivity, including thermally sensitive devices.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As supplied
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Silver | As supplied | |
| Thixotropic index | 5.0 | 0.5/5 rpm | |
| Viscosity | 12,000 | cP | Brookfield CP51; 25 deg C; 5 rpm |
| Specific gravity | 3.91 | As supplied | |
| Work life | 24 | hours | 25 deg C |
| Shelf life | 365 | days | -40 deg C |
Cured material
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 3.0 | W/(m K) | Typical cured material |
| Extractable chloride | 10 | ppm | 100 deg C |
| Extractable sodium | 5 | ppm | 100 deg C |
| Extractable potassium | 5 | ppm | 100 deg C |
| Volume resistivity | 0.0001 | ohm cm | Typical cured material |
| Die shear | 6,300 | psi | Silicon die to silver; 25 deg C |
