ABLESTIK C990
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Silver-Filled Conductive Die Attach
- Stamping-Compatible C 990 333
- C 990 333 20-Second Hot-Plate Cure
Product Description
LOCTITE ABLESTIK C 990 Series is a die-attach adhesive series represented by distinct C 990 333 and C990J 333M1 subgrades. Within the series, C 990 333 is a one-component, silver-filled, electrically conductive heat-cure epoxy for die and component bonding in microelectronic applications. That subgrade contains 71 wt% silver, has 24,000 cP viscosity at 25 deg C, and is formulated for stamping application. Cure, electrical, ionic, and mechanical values remain tied to the selected C 990/C990J subgrade rather than applying uniformly across the series.
Key features
- Silver-filled conductive option: C 990 333 is a one-component silver-filled electrically conductive epoxy die-attach grade.
- Stamping-process option: C 990 333 is formulated for stamping application.
- 20-second hot-plate cure: C 990 333 has a 20-second cure at 270 deg C on a hot plate, with a 1-hour convection-oven cure at 150 deg C.
Applications
Die and component bonding in microelectronic applications within the selected C 990/C990J subgrade scope.
