ABLESTIK E3503-1
Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm
Main features
- Thin-Bondline Thermal Adhesive
- Electrically Non-Conductive Thermal Adhesive
- Low-Temperature Heat Cure
Product Description
LOCTITE ABLESTIK E 3503-1 is a one-component, off-white heat-cure epoxy adhesive for thin-bondline thermal-management bonding. It is thermally conductive while remaining electrically non-conductive. The adhesive is intended for LED and display assemblies and other heat-sensitive-device bonding applications, using a low-temperature heat-cure process.
Key features
- Thin-bondline thermal adhesive: The one-component epoxy is intended for thin bond lines in thermal-management bonding.
- Electrically non-conductive: The thermal adhesive is specified as electrically non-conductive.
- Low-temperature heat cure: The heat-cure profile is positioned for heat-sensitive-device assembly applications.
Applications
Assembly and thermal-management bonding, including LED/display and heat-sensitive-device applications.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
AppearanceAppearance
Off-whiteSpecific GravitySpecific Gravity
1.2Thermal Properties
Glass Transition Temperature (Tg)Glass Transition Temperature (Tg)
90 to100 °COperating TemperatureOperating Temperature
-45 to125 °CThermal ConductivityThermal Conductivity
0.8 W/m.KPhysical Properties
ViscosityViscosity
60,000 mPa.sOther Properties
Storage TemperatureStorage Temperature
-25ºC to -18 °C
