COOLTHERM 6744
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Low-Viscosity 1:1 Processing
- Two-Hour Room-Temperature Cure
- Flame-Retardant Silicone Encapsulation
Product Description
Circalok 6744 Silicone Encapsulant is a two-component, low-viscosity, flame-retardant silicone for potting and encapsulating electrical and electronic assemblies. The product is black and has a typical viscosity of 2,700 cP at 25 deg C with a 1:1 mix ratio by weight. It can cure in 2 hours at 25 deg C or 45 minutes at 65 deg C, giving processors a room-temperature or accelerated heat-cure option. Typical cured data include Shore A 55 hardness and 17.7 kV/mm (450 V/mil) dielectric strength. The system combines flowable processing with flexible silicone encapsulation and electrical insulation.
Key features
- Low-Viscosity 1:1 Processing: Typical viscosity is 2,700 cP at 25 deg C with a 1:1 mix ratio by weight.
- Dual-Temperature Cure: Cures in 2 hours at 25 deg C or 45 minutes at 65 deg C.
- Flexible Electrical Protection: Typical cured hardness is Shore A 55 and dielectric strength is 17.7 kV/mm (450 V/mil).
Applications
Potting and encapsulation of electrical and electronic assemblies requiring silicone flexibility and flame-retardant performance.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Mechanical Properties
Electrical Properties
Additional Information
As-Supplied Properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black | Typical | |
| Viscosity | 2,700 | cP | Typical; 25 deg C |
| Mix ratio by weight | 1:1 | 6744 A resin to 6744 B hardener |
