COOLTHERM SC-252
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 2.5 W/(m K) Thermal Conductivity
- 8.7 kV/mm Dielectric Strength
- 1:1 Weight or Volume Mixing
Product Description
CoolTherm SC-252 Thermally Conductive Silicone Encapsulant is a two-part, gray silicone encapsulant for potting electrical and electronic components where thermal conductivity and electrical insulation are required. Resin and hardener mix 1:1 by weight or volume, and mixed viscosity is typically 18,000 cP at 25 deg C at a 10 s^-1 shear rate. Cure schedules are 24 hours at 25 deg C, 45 minutes at 85 deg C, or 30 minutes at 120 deg C. Typical cured thermal conductivity is 2.5 W/(m K) and dielectric strength is 8.7 kV/mm. The material also provides improved adhesion to aluminum without primer.
Key features
- Cured thermal conductivity: Typical cured thermal conductivity is 2.5 W/(m K).
- Cured dielectric strength: Typical cured dielectric strength is 8.7 kV/mm.
- Equal-ratio mixing: Resin and hardener mix 1:1 by weight or volume.
Applications
Potting and encapsulation of electrical and electronic components where thermal conductivity and electrical insulation are required.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
Resin and hardener are supplied separately; mixed values apply after the 1:1 combination.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio, resin:hardener | 1:1 | by weight or volume | Before application |
| Viscosity, resin | 18,000 | cP | Typical; 25 deg C; 10 s^-1 shear rate |
| Viscosity, hardener | 17,000 | cP | Typical; 25 deg C; 10 s^-1 shear rate |
| Viscosity, mixed | 18,000 | cP | Typical; 25 deg C; 10 s^-1 shear rate |
| Specific gravity, mixed | 2.93 | Typical; mixed material | |
| Working life | 45 | min | Typical; mixed material; 25 deg C |
Cured encapsulant properties
Typical cured values use a cure schedule of 60 minutes at 121 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 2.5 | W/(m K) | Typical; Hot Disc Transient Method; ISO 22007-2 |
| Hardness | 60 | Shore A | Typical; ASTM D2240 |
| Tensile strength | 1 | MPa | Typical |
| Volume resistivity | >1 x 10^14 | ohm-cm | Typical; ASTM D257; 25 deg C |
| Dielectric strength | 8.7 | kV/mm | Typical; ASTM D149 |
| Dielectric constant | 5 | Typical; ASTM D150; 25 deg C; 1 MHz |
