DEVCON 10

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DEVCON 10

Main features

  • 20-Minute Fixture Time
  • Equal-Ratio Epoxy Mixing
  • 2,400 psi Lap Shear Strength

Product Description

Devcon 10 Minute Epoxy is a flexible, two-component liquid epoxy adhesive and encapsulant supplied in black and clear variants. It mixes 1:1 by volume or weight and provides about 10 minutes of working time, about 20 minutes to fixture, and about 12 hours to full cure. The self-leveling material bonds supported combinations of metals, fabrics, ceramics, glass, wood, and concrete. Typical cured properties after seven days at 24 deg C include 2,400 psi lap shear strength and 20 to 25 pli T-peel strength. Availability is limited to North and South America.

Key features

  • Fixture-to-full-cure profile: Typical fixture time is about 20 minutes; full cure is about 12 hours.
  • Equal-ratio epoxy mixing: Resin and hardener mix 1:1 by weight or volume.
  • Cured lap shear strength: Typical lap shear strength is 2,400 psi after seven days at 24 deg C.

Applications

Bonding metals and dissimilar substrates in signage and display, appliance, metalworking, and furniture assemblies; self-leveling encapsulation of components.

Product Family

DEVCON 10

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.

TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Black or Clear
Density (g)Density (g)
1.13 g/cm3
Curing Conditions
Fixture TimeFixture Time
20 minutes
Mechanical Properties
ElongationElongation
5 %
Electrical Properties
Dielectric StrengthDielectric Strength
31.5 kV/mm
Thermal Properties
Service temperatureService temperature
-40°C to 93 °C

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Mix ratio1:1ratioBy volume or weight
Mixed density1.13g/cm^3Mixed material at 23 deg C
Mixed viscosity80,000 to 90,000cPMixed material at 23 deg C
Working time10minutesAt 23 deg C
Fixture time20minutesAt 23 deg C
Functional cure1.5hoursAt 23 deg C
Full cure12hoursAt 23 deg C
Gap fill0.01 to 0.05inAdhesive joint
Technical properties

Cured epoxy properties

Typical physical properties are for material cured seven days at 24 deg C unless otherwise stated.

PropertyValueUnitMethod / condition
Lap shear2,400psiASTM D1002
Dielectric strength800V/milASTM D149
Hardness75Shore DASTM D2240
Impact resistance10ft-lb/in^2Cured epoxy
Service temperature-40 to 93deg CCured epoxy
Tensile elongation5%Cured epoxy
T-peel20 to 25pliCured epoxy

Leading Brands Trust in Our Products and Services

  • Jabil
  • Linxens
  • Magna
  • Medtronic
  • NXP
  • Philips
  • Semikron
  • Teledyne
  • Thales
  • Vishay
  • ZF
  • AMS
  • Apple
  • Audi
  • Broadcom
  • Borgwarner
  • Bosch
  • Eaton
  • Henkel
  • Honeywell
  • Hysol
  • Intel
Products that Perform|Knowledge that Serves|Service that Delivers