DOWSIL 1-4174
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Controlled 180 um Bondline
- 1.8 W/(m K) Thermal Conductivity
- 20-Minute Cure at 150 deg C
Product Description
DOWSIL 1-4174 Thermally Conductive Adhesive is a one-part, gray silicone adhesive for bonding and transferring heat between electronic components and thermal-management hardware. The self-leveling, self-priming material uses 180 um glass spacer beads for bondline control. Cure schedules are 90 minutes at 100 deg C, 30 minutes at 125 deg C, or 20 minutes at 150 deg C. Typical thermal conductivity is 1.8 W/(m K), and typical unprimed aluminum lap shear is 4.5 MPa. Applications include integrated circuits, lids and housings, baseplates, and heat sinks.
Key features
- Glass-bead bondline control: Embedded 180 um glass spacer beads control adhesive bondline thickness.
- Thermal conductivity: Typical thermal conductivity is 1.8 W/(m K).
- Elevated-temperature cure: The shortest listed cure schedule is 20 minutes at 150 deg C.
Applications
Bonding and sealing integrated circuits, lids and housings, baseplates, and heat sinks where thermal transfer is required.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Electrical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Color | Gray | - | As supplied |
| Number of parts | 1 | part | As supplied |
| Specific gravity | 2.7 | - | As supplied |
| Viscosity | 62,300 | cP | As supplied |
| Thixotropy | 3.7 | - | As supplied |
| Spacer bead size | 180 | um | Glass beads |
| Heat-cure schedule | 90; 30; 20 | minutes | At 100; 125; 150 deg C, respectively |
Cured thermal adhesive properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 1.8 | W/(m K) | Cured adhesive |
| Hardness | 90 | Shore A | Cured adhesive |
| Lap shear | 4.5 | MPa | Unprimed aluminum joint |
