DOWSIL 3-1818

Harmonization Code : 5906100000 | Adhesive tape of a width not exceeding 20cm

DOWSIL 3-1818

Main features

  • Glass-Bead Bondline Control
  • 1.68 W/(m K) Thermal Conductivity
  • 10-Minute Cure at 150 deg C

Product Description

DOWSIL 3-1818 Thermally Conductive Adhesive is a one-part, gray, flowable silicone adhesive for thermally conductive bonding in electronic assemblies. The material contains glass beads for bondline control and has a typical viscosity of 758,000 cP with a thixotropy value of 3.4. Cure schedules include 60 minutes at 100 deg C, 45 minutes at 125 deg C, and 10 minutes at 150 deg C. Typical cured thermal conductivity is 1.68 W/(m K), with typical unprimed aluminum adhesion of 560 psi.

Key features

  • Glass-bead bondline control: The adhesive contains glass beads for controlled bondline thickness.
  • Cured thermal conductivity: Typical cured thermal conductivity is 1.68 W/(m K).
  • Elevated-temperature cure: The shortest listed cure schedule is 10 minutes at 150 deg C.

Applications

Thermally conductive bonding in electronic assemblies where controlled bondline thickness and heat transfer are required.

Product Family

DOWSIL 3-1818

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
Gray
Specific GravitySpecific Gravity
2.63
Physical Properties
Thixotropic indexThixotropic index
3.4
ViscosityViscosity
76,000 mPa.s
Electrical Properties
Dielectric StrengthDielectric Strength
16 kV/mm
Volume ResistivityVolume Resistivity
6.85 E+13 Ohms⋅cm
Thermal Properties
Temperature RangeTemperature Range
-45°C to 200 °C
Thermal ConductivityThermal Conductivity
1.7 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
ColorGray-As supplied
Number of parts1partAs supplied
Flow behaviorFlowable-As supplied
Viscosity758,000cPAs supplied
Thixotropy3.4-As supplied
Bondline controlGlass beads-As supplied
Heat-cure schedule60; 45; 10minutesAt 100; 125; 150 deg C, respectively

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