DOWSIL 96-083
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- 10:1 Silicone Mixing
- 30-Minute Cure at 150 deg C
- Low-Viscosity Self-Leveling Flow
Product Description
DOWSIL 96-083 Silicone Adhesive Kit is a two-part, translucent silicone adhesive mixed at 10:1 for heat-cured component bonding. The low-viscosity formulation can flow, fill, or self-level after dispensing and contains no added solvents. The addition-cure system is processed above 100 deg C, with a cure schedule of 30 minutes at 150 deg C. Typical cured hardness is 55 Shore A. Documented substrates include ceramics, plastics, glass, and metals.
Key features
- Two-part mix ratio: The two-part adhesive is mixed at a 10:1 ratio.
- Elevated-temperature cure: The cure schedule is 30 minutes at 150 deg C.
- Self-leveling flow: The low-viscosity adhesive can flow, fill, or self-level after dispensing.
Applications
Component fixing and bonding on ceramics, plastics, glass, and metals.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
ColorColor
TranslucentComponent SystemComponent System
Two (Base | Catalyst)Mechanical Properties
ElongationElongation
125 %Electrical Properties
Dielectric StrengthDielectric Strength
1 kV/mmVolume ResistivityVolume Resistivity
1.7E+15 Ohms⋅cmAdditional Information
Technical properties
Before-processing adhesive properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio | 10:1 | Two-part system; basis not stated | |
| Flow behavior | Low viscosity | Flows, fills, or self-levels after dispensing | |
| Heat cure | 30 | min | 150 deg C |
