DOWSIL EC-8425
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- Below 0.01 ohm cm Resistivity
- Low-Temperature Conductive Adhesive Cure
- Greater Than 20% Elongation
Product Description
DOWSIL EC-8425 Electrically Conductive Adhesive uses a one-part, silver-filled, solvent-free polydimethylsiloxane formulation for grounding, bonding, EMI/EMC connections, and electrical interconnects. The conductive adhesive is dispensable and uses a low-temperature cure. Typical volume resistivity is below 0.01 ohm cm, while elongation is greater than 20% and tensile strength is greater than 425 psi. Typical Shore D hardness is 42 and specific gravity is 2.2 g/cm^3. UV traceability is included for inspection. Dow also lists solder replacement as an application for the exact product.
Key features
- Cured volume resistivity: Typical volume resistivity is below 0.01 ohm cm for the silver-filled adhesive used in grounding, bonding, and EMI/EMC connections.
- One-part low-temperature cure: The dispensable adhesive uses a low-temperature cure without component mixing.
- UV inspection traceability: Built-in UV traceability provides an inspection aid after dispensing.
Applications
Grounding and bonding; EMC/EMI connections; electrical interconnects; solder replacement.
