DOWSIL EE-9000

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

DOWSIL EE-9000

Main features

  • 130-Minute Pot Life at 25 deg C
  • 23 kV/mm Dielectric Strength
  • 0.2 W/(m K) Thermal Conductivity

Product Description

DOWSIL EE-9000 Primerless RTV Encapsulant is a two-part, white, flowable polydimethylsiloxane encapsulant for protecting PCB and electrical assemblies. The system uses a 10:1 mix ratio, with typical Part A viscosity of 3,600 cP and mixed viscosity of 2,600 cP. Pot life is 130 minutes at 25 deg C. The mixed material cures at room temperature to a flexible elastomer and requires no post-cure. Typical properties include Shore A 16 hardness, 23 kV/mm dielectric strength, and 0.2 W/(m K) thermal conductivity. The primerless grade requires good cleaning but no additional priming step for adhesion.

Key features

  • Two-part mix ratio: The two-part system uses a 10:1 mix ratio; the ratio basis is not specified.
  • Room-temperature pot life: Typical pot life is 130 minutes at 25 deg C.
  • Dielectric strength: Typical dielectric strength is 23 kV/mm.

Applications

Protection and encapsulation of printed circuit boards and electrical/electronic assemblies.

Product Family

DOWSIL EE-9000

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
ColorColor
White
Component SystemComponent System
Two Part (A/B)
Pot LifePot Life
130 minutes
Thermal Properties
Thermal ConductivityThermal Conductivity
0.2 W/m.K
Electrical Properties
Dielectric StrengthDielectric Strength
23 kV/mm
Volume ResistivityVolume Resistivity
5E+15 Ohms⋅cm

Additional Information

Technical properties

Before-processing encapsulant properties

PropertyValueUnitMethod / condition
Mix ratio10:1Two-part system; basis not stated
Viscosity, Part A3,600cPTypical
Viscosity, mixed2,600cPTypical
Pot life130minTypical; at 25 deg C; time for viscosity to double after mixing
Technical properties

Cured encapsulant properties

PropertyValueUnitMethod / condition
Thermal conductivity0.2W/(m K)Typical
Durometer16Shore ATypical
Dielectric strength23kV/mmTypical
Volume resistivity5 x 10^15ohm cmTypical
Dissipation factor0.002Typical; 1 MHz; JIS K 6249
Dielectric constant3.2Typical; 1 MHz; JIS K 6249

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