DOWSIL OR-2000
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- 1:1 Parts A/B Mix Ratio
- 425 mPa s Viscosity
- Multiple Heat-Cure Schedules
Product Description
DOWSIL OR-2000 Standard Hard Gel Parts A & B is a two-part, translucent silicone hard gel for PCB potting and electronic encapsulation. Parts A and B use a 1:1 mix ratio, and the material has a typical viscosity of 425 mPa*s with a 10-minute working time at 25 deg C. Heat cure options include 10 minutes at 50 deg C, 5 minutes at 75 deg C, and 3 minutes at 100 deg C. After cure, the gel has Shore 00 hardness of 62, dielectric strength of 420 V/mil, and thermal conductivity of 0.15 W/m*K. Applications include stress relief, mechanical protection, electrical insulation, and environmental protection.
Key features
- 1:1 Two-Part Mixing: Parts A and B form an equal-ratio hard-gel system.
- About 425 cP Viscosity: Typical viscosity characterizes the hard-gel system before cure.
- About Shore 00 62 Cured Hardness: Typical hardness characterizes the final hard-gel state.
Applications
Potting PCB assemblies; encapsulation and stress relief; mechanical protection; electrical insulation; environmental protection.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Mechanical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio | 1:1 | - | Parts A:B; basis not stated |
| Viscosity | 425 | mPa*s | Typical |
| Working time | 10 | min | 25 deg C |
| Heat cure | 10 min at 50 deg C; 5 min at 75 deg C; 3 min at 100 deg C | - | Typical product-page values |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Durometer | 62 | Shore 00 | Typical |
| Dielectric strength | 420 | V/mil | Typical |
| Thermal conductivity | 0.15 | W/m*K | Typical |
