Name: DOWSIL SE 4422
Brand: Dow Silicones Corporation
SKU: DOWSIL SE 4422

Main features

11-Minute Tack-Free Time
0.9 W/(m K) Thermal Conductivity
Semi-Flowable One-Part Application

Product Description

DOWSIL SE 4422 Thermally Conductive Adhesive is a one-part, gray, moisture-cure silicone adhesive for thermal-transfer bonding in electronics. Its semi-flowable consistency and typical 11-minute tack-free time at 25 deg C provide a defined room-temperature processing profile. Typical cured properties include 2.2 specific gravity, Shore A 68 hardness, 740 psi tensile strength, 130% elongation, and about 206 psi unprimed lap shear on aluminum. Thermal conductivity is typically 0.9 W/mK. It is designed to provide thermal transfer for cooling modules, including home-appliance devices.

Key features

11-Minute Tack-Free Time: This surface-dry milestone is distinct from full moisture cure.
About 0.9 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured adhesive.
740 psi Cured Tensile Strength: Typical cured elongation is 130%.

Applications

Thermal-transfer bonding and sealing in electronics, including cooling modules and appliance assemblies.

TDS, SDS & Technical Documents

Technical Specifications

General Properties

Color

Gray

Specific Gravity

2.2

Physical Properties

Tack-Free Time

11 minutes

Mechanical Properties

Elongation

130 %

Thermal Properties

Temperature Range

-45 to 200 °C

Thermal Conductivity

0.9 W/m.K

Additional Information

Technical properties

As-supplied / before-processing properties

Property	Value	Unit	Method / condition
Fluidity	42	mm	Typical
Nonvolatile content	99.4	%	Typical
Tack-free time	11	min	25 deg C