DOWSIL TC-4040

DOWSIL TC-4040 Dispensable Thermal Pad is a two-part, blue, thermally conductive dispensable thermal pad for filling gaps between electronic components and heat-transfer surfaces. The system can be dispensed or printed by manual or automated processes and has a typical 3-hour working time at 25 deg C. Cure is available at room temperature or can be accelerated to less than 5 minutes at 120 deg C. The cured pad has a typical thermal conductivity of 4.0 W/(m K), Shore 00 hardness of 60, and minimum bond-line thickness of 60 um. It is used as a thermal interface and gap-filling material where heat dissipation is required.

Key features

• 4.0 W/(m K) Thermal Conductivity: Typical thermal-conductivity value applies to the cured dispensable pad.
• Less Than 5-Minute Cure at 120 deg C: Alternative schedules are 60 minutes at 80 deg C and 24 hours at 25 deg C.
• Around 60 um Minimum Bondline: Documented minimum bond-line guidance applies to the dispensable thermal pad.

Applications

Thermal interface and gap filling where heat dissipation is required.