ECCOBOND EO 1080
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 20-Minute Cure at 150 deg C
- 12-Month Shelf Life at 4 deg C
- 177 deg C Continuous Service
Product Description
LOCTITE ECCOBOND EO1080 is a one-part, black heat-cure epoxy encapsulant and casting compound for ICs, transistors, and similar semiconductor devices. Typical uncured properties include 60,000 mPa s Brookfield viscosity at 25 deg C, 1.56 specific gravity, and a 3.1-minute gel time at 121 deg C. Shelf life is typically 12 months at 4 deg C. Recommended cure is 20 minutes at 150 deg C, with lower-temperature alternatives available. After cure, typical properties include a Tg of 121 deg C, Shore D 86 hardness, 9,200 N/mm^2 flexural modulus, and 0.05% water absorption after 24 hours at 25 deg C. Continuous service is listed to 177 deg C.
Key features
- 20-Minute Cure at 150 deg C: Recommended heat-cure condition applies to the one-part epoxy.
- 12-Month Shelf Life at 4 deg C: Typical shelf life applies to the uncured material under refrigerated storage.
- About 3.1-Minute Gel Time at 121 deg C: Gel time is an intermediate processing milestone distinct from the full cure schedule.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Chemical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Viscosity | 60,000 | mPa s | Brookfield RVF, spindle 7, 4 rpm, 25 deg C; typical |
| Specific gravity | 1.56 | - | 25 deg C; typical |
| Gel time | 3.1 | min | 121 deg C; typical |
| Shelf life | 12 | months | 4 deg C; typical |
| Recommended cure | 20 | min | 150 deg C; guideline |
| Alternative cure | 90 min / 2 h | - | 140 / 110 deg C respectively; guideline |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| CTE below Tg | 35 | ppm/deg C | Typical |
| CTE above Tg | 125 | ppm/deg C | Typical |
| Glass transition temperature | 121 | deg C | Typical |
| Shore hardness | 86 | Shore D | ISO 868; typical |
| Flexural modulus | 9,200 | N/mm^2 | ASTM D790; typical |
| Flexural strength | 135 | N/mm^2 | ASTM D790; typical |
| Water absorption | 0.05 | % | ISO 62; 24 h immersion at 25 deg C; typical |
