ECCOBOND FP4530SF

LOCTITE ECCOBOND FP4530SF is a one-part blue heat-cure epoxy underfill for flip-chip-on-flex assemblies with gaps around 25 um. Typical uncured viscosity is 3,300 mPa s at 25 deg C, and pot life is 24 hours at 25 deg C. Henkel lists a snap-cure schedule of 8 minutes at 160 deg C and recommends a 90 deg C substrate temperature to support flow. During cure, the material changes from blue to green as a visual cure-status indicator. After cure, typical Tg is 145 deg C with a flexural modulus of 5,600 N/mm^2.

Key features

• 25 um Flip-Chip Gap: The underfill is designed for flip-chip-on-flex assemblies at this gap size.
• Blue-to-Green Cure Indicator: The color change occurs during cure to indicate cure status.
• 8-Minute Snap Cure at 160 deg C: The guideline schedule is paired with a 90 deg C substrate temperature for flow.

Applications

Underfilling flip-chip devices on flex substrates, including approximately 25 um gap assemblies.