ECCOBOND SF40
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 0.64 g/cm^3 Mixed Density
- 30-Minute Work Life
- Up to 14.5 MPa Aluminum Lap Shear at 25 deg C
Product Description
LOCTITE ABLESTIK SF 40 is a two-part low-density syntactic-foam epoxy/amine adhesive for non-conductive bonding in aerospace and hydrospace assemblies. Parts A and B mix 100:9 by weight, with a typical mixed density of 0.64 g/cm^3 and a 30-minute work life at 25 deg C. The thixotropic, non-sag material can cure at room temperature for 48 to 72 hours or with heat for 2 to 4 hours at 65 deg C. After cure, typical Shore D hardness is 70, dielectric strength is 13.8 kV/mm, and aluminum-to-aluminum lap shear is up to 14.5 MPa at 25 deg C.
Key features
- 0.64 g/cm^3 Mixed Density: Typical mixed density characterizes the low-density syntactic-foam adhesive.
- 30-Minute Work Life at 25 deg C: The typical work-life value is based on a 100 g mixed mass.
- Up to 14.5 MPa Aluminum Lap Shear: Measured for aluminum-to-aluminum joints at 25 deg C.
Applications
Non-conductive bonding and repair in aerospace and hydrospace assemblies; bonding ceramics, metals, and plastics.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Chemical Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio, Part A:Part B | 100:9 | by weight | Recommended mix ratio |
| Part A density | 0.61 | g/cm^3 | ASTM D792; typical |
| Part B viscosity | 95 | mPa s | ASTM D2393; typical |
| Mixed density | 0.64 | g/cm^3 | Typical |
| Work life | 30 | minutes | 100 g mass; 25 deg C; typical |
| Shelf life | 365 | days | 25 deg C; typical |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 70 | Shore D | ASTM D2240; cured; typical |
| Tg | 107 | deg C | ASTM D3418; cured; typical |
| Dielectric strength | 13.8 | kV/mm | ASTM D149; cured; typical |
| Volume resistivity | 1E12 | ohm-cm | ASTM D257; 25 deg C; cured; typical |
| Total mass loss | 0.23 | % | ASTM E595; cured; typical |
| Collected volatile condensable material | 0.04 | % | ASTM E595; cured; typical |
| Aluminum-to-aluminum lap shear | 14.5 | N/mm^2 | 25 deg C; cured; typical |
