EPOCAP 49174
Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide
Main features
- 55,000 cP Part A Viscosity
- 100:30 49174/59174 Weight Mix
- Electrical Potting System Component
Product Description
EPOCAP 49174 Part A is the black resin component of the EPOCAP 49174/59174 electrical potting and encapsulation system. At 25 deg C, Part A has a typical viscosity of 55,000 cP and specific gravity of 1.69. In the paired system, 49174 Part A combines with amber 59174 Part B at 100:30 by weight or 100:50 by volume. The mixed system is used for room-temperature potting of tightly wound coils, transformers, time-delay relays, and low- or medium-voltage devices. Cured-system properties apply to the complete 49174/59174 system rather than Part A alone.
Key features
- Part A Viscosity: Typical viscosity is 55,000 cP at 25 deg C, with specific gravity of 1.69 for the black resin component.
- 49174/59174 Mix Ratio: The paired system uses 100:30 by weight or 100:50 by volume.
- Electrical Potting System Component: The 49174/59174 system is used for coils, transformers, time-delay relays, and low- or medium-voltage devices.
Applications
Part A resin for the 49174/59174 electrical potting and encapsulation system used with coils, transformers, time-delay relays, and low- or medium-voltage devices.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
Legacy-source typical values for EPOCAP 49174 Part A only.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Color | Black | - | Legacy source; Part A; as supplied |
| Viscosity | 55,000 | cP | Legacy source; Part A; 25 deg C |
| Weight per gallon | 14.1 | lb/gal | Legacy source; Part A |
| Specific gravity | 1.69 | - | Legacy source; Part A; 25 deg C |
| Filler type | Non-abrasive | - | Legacy source; Part A |
| Shelf life | 12 | months | Legacy source; Part A in a separate sealed container |
