LAIRD TPCM910
Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg
Main features
- Phase Change Near 50 deg C
- Naturally Tacky Without Added Adhesive
- Pressure-Qualified Thermal Impedance
Product Description
Tpcm 910 is a 0.010 in (0.25 mm) freestanding thermal phase-change film for component-to-heat-sink interfaces. It remains a flexible solid at room temperature, then begins to soften near 50 deg C to wet microscopic surface irregularities and reduce interface resistance. The yellow, non-reinforced boron nitride-filled film is naturally tacky, so no separate pressure-sensitive adhesive is required. Laird specifies a 70 deg C, five-minute burn-in condition and publishes pressure-specific thermal-impedance data for the installed interface. The material is supplied with release liners for manual, automated, or die-cut placement.
Key features
- Phase change near 50 deg C: Softens to wet mating surfaces and reduce interface resistance.
- Naturally tacky film: Requires no separate pressure-sensitive adhesive.
- Freestanding construction: Non-reinforced film supports manual, automated, or die-cut placement.
Applications
Graphic Cards; Hard Disk Drives; IGBTs; Memory Modules; Notebooks/Tablets/Portable Devices; Servers; Smart Home Devices; Wireless infrastructure
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Construction | Non-reinforced boron nitride-filled film | Laird Tpcm 900 datasheet | |
| Nominal thickness | 0.25 (0.010) | mm (in) | Tpcm 910 grade |
| Thickness tolerance | +/- 0.025 (+/- 0.001) | mm (in) | Tpcm 910 grade |
| Color | Yellow | Visual | |
| Density | 1.39 | g/cc | Helium pycnometer |
| Room-temperature form | Flexible freestanding solid | Exact product family |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Phase-change softening temperature | 50 to 70 | deg C | Laird Tpcm 900 datasheet |
| Burn-in condition | 70 for 5 minutes | deg C | Laird Tpcm 900 datasheet |
| Thermal impedance | 0.14 | deg C in^2/W | 10 psi; Tpcm 910 |
| Thermal impedance | 0.083 | deg C in^2/W | 50 psi; Tpcm 910 |
| Operating temperature range | -25 to 125 | deg C | Laird Tpcm 900 datasheet |
| Dielectric constant | 3.1 | 1 MHz; ASTM D150 | |
| Volume resistivity | 2 x 10^13 | ohm-cm | ASTM D257 |
