STYCAST US 0138
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Extended 40-to-60-Minute Working Time
- Ambient or Accelerated Cure
- Electrically Insulating Electronic Potting
Product Description
LOCTITE STYCAST US 0138 is a two-component polyurethane potting and encapsulation system for environmental protection of electronics and devices. Part A and Part B mix at 1:4 by volume or 21:100 by weight, producing a typical mixed viscosity of 3,000 cP at 25 deg C. Working time is 40 to 60 minutes for a 140 g mass at 25 deg C, followed by a recommended 24-to-48-hour cure at 25 deg C or a 2-to-4-minute heat cure at 60 to 85 deg C. The cured material combines Shore A60 hardness with 0.569 W/(m K) thermal conductivity and 1,119 V/mil dielectric strength.
Key features
- Defined dual-basis mixing: The system mixes at 1:4 by volume or 21:100 by weight.
- Extended working time: Working time is 40 to 60 minutes for a 140 g mass at 25 deg C.
- Ambient or accelerated cure: Use 24 to 48 hours at 25 deg C or 2 to 4 minutes at 60 to 85 deg C.
Applications
Potting and encapsulation of electronics and devices for environmental protection.
TDS, SDS & Technical Documents
Technical Specifications
Physical Properties
General Properties
Additional Information
As-supplied / before-processing properties
Values are typical reference data, not specifications. Cure conditions are guideline recommendations.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Mix ratio | 1:4 | Part A:Part B; by volume | |
| Mix ratio | 21:100 | Part A:Part B; by weight | |
| Viscosity | 3,000 | cP | Mixed material; 25 deg C; typical |
| Density | 1.46 | g/cm^3 | Mixed material; 25 deg C; typical |
| Working time | 40 to 60 | min | 140 g mass; 25 deg C; typical |
| Gel time | 90 to 120 | min | 100 g mass; 25 deg C; typical |
| Recommended cure | 24 to 48 | h | 25 deg C; guideline |
| Alternative cure | 2 to 4 | min | 60 to 85 deg C; guideline |
After-processing / final-state properties
Values describe the cured material and are typical product-selection data, not specifications.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Hardness | 60 | Shore A | Cured material; typical |
| Glass transition temperature | -60 | deg C | Cured material; typical |
| Thermal conductivity | 0.569 | W/(m K) | Cured material; typical |
| Moisture absorption | Less than 0.2 | % | 24 h immersion; cured material; typical |
| Dielectric strength | 1,119 | V/mil | 0.02 in thickness; cured material; typical |
| Volume resistivity | 2.08 x 10^13 | ohm-cm | 25 deg C; cured material; typical |
