STYCAST US 5529

Harmonization Code : 3907.30.00.40 | Epoxy Mold Compounds containing by weight more than 70 % silicon dioxide

HYSOL US5529

Main features

  • Low-Viscosity Potting Flow
  • Extended 45-Minute Working Time
  • Flexible Cured Polyurethane

Product Description

LOCTITE STYCAST US 5529 is a two-component, mineral-filled polyurethane potting compound with flexible cured behavior, low viscosity, and a long working time. Part A and Part B mix at 1:4.81 by volume or 15:85 by weight. The mixed system has a typical viscosity of 2,400 cP and a 45-minute working time at 23 deg C for a 300 g mass. Recommended cure is 12 to 24 hours at 22 to 30 deg C, with an alternate 1-to-3-hour cure at 65 to 85 deg C. The cured black material reaches Shore A85 hardness, 540 psi tensile strength, and 0.335 W/(m K) thermal conductivity for potting and encapsulation.

Key features

  • Low mixed viscosity: Typical mixed viscosity is 2,400 cP at 23 deg C.
  • Forty-five-minute working time: A 300 g mass provides 45 minutes of working time at 23 deg C.
  • Flexible cured polyurethane: The cured potting compound is flexible and reaches Shore A85 hardness.

Applications

Potting and encapsulation.

Product Family

STYCAST US 5529

Catalog Product

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
AppearanceAppearance
Black
Component SystemComponent System
Two Part (A/B)
Density (g)Density (g)
1.5 g/cm3
Thermal Properties
Thermal ConductivityThermal Conductivity
0.335 W/m.K
Chemical Properties
Moisture absorptionMoisture absorption
0.01 %
Electrical Properties
Volume ResistivityVolume Resistivity
4.5×10¹³ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical reference data, not specifications. Cure conditions are guideline recommendations.

PropertyValueUnitMethod / condition
Mix ratio1:4.81Part A:Part B; by volume
Mix ratio15:85Part A:Part B; by weight
Mixed viscosity2,400cP23 deg C; typical
Working time45min300 g mass; 23 deg C; typical
Gel time90min300 g mass; 23 deg C; typical
Recommended cure12 to 24h22 to 30 deg C; guideline
Alternative cure1 to 3h65 to 85 deg C; guideline
Technical properties

After-processing / final-state properties

Values describe the cured material and are typical product-selection data, not specifications.

PropertyValueUnitMethod / condition
ColorBlackCured material
Density1.5g/cm^3Cured material; typical
Hardness85Shore ACured material; typical
Thermal conductivity0.335W/(m K)Cured material; typical
Coefficient of thermal expansion150ppm/deg CCured material; typical
Moisture absorption0.01%24 h at 25 deg C; cured material; typical
Tensile strength540psiCured material; typical
Dielectric strength972V/milCured material; typical

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