Name: TECHNOMELT 1X
Brand: Henkel Corporation
SKU: TECHNOMELT 1X

Main features

Fast 15-Second Open Time
Porous-Substrate Hot-Melt Bonding
High Dielectric Strength

Product Description

TECHNOMELT 1X is an EVA-based, medium-to-fast-setting hot-melt adhesive recommended for porous substrates. Its one-part format bonds paper, wood, fabric, nonwovens, and foam, with a typical open time of 15 seconds. At 350 deg F, typical viscosity is 2,000 cP, while the softening point is 216 deg F. Typical material properties include 370 psi tensile strength, 90% elongation, and dielectric strength above 1,300 V/mil. This short-open-time profile is tailored to paper, wood, fabric, nonwoven, and foam bonding.

Key features

Fast open time: Typical open time is 15 seconds.
Porous-substrate bonding: Recommended substrates include paper, wood, fabric, nonwovens, and foam.
Dielectric strength: Typical dielectric strength is above 1,300 V/mil by ASTM D149.

Applications

Bonding paper, wood, fabric, nonwovens, and foam.

TDS, SDS & Technical Documents

Technical Specifications

Physical Properties

Open time

0.25 minutes

Viscosity

2,000 mPa.s

General Properties

Specific Gravity

0.96

Mechanical Properties

Elongation

90 %

Additional Information

Technical properties

As-supplied / before-processing properties

Values are typical product-selection data and are not specifications.

Property	Value	Unit	Method / condition
Softening point	216	deg F	ASTM E28-67; typical
Viscosity	2,000	cP	350 deg F; ASTM D3236; typical
Open time	15	sec	Typical
Specific gravity	0.96		77 deg F; ASTM D792; typical

Technical properties

After-processing / final-state properties

Values describe the cured material and are typical product-selection data, not specifications.

Property	Value	Unit	Method / condition
Heat resistance	150	deg F	ASTM D4498; typical
Tensile strength	370	psi	ASTM D638; typical
Elongation	90	%	ASTM D638; typical
Glass transition temperature	-21	deg F	ASTM E1640; typical
Dielectric strength	Above 1,300	V/mil	ASTM D149; typical