ITW Performance Polymers

ITW Performance Polymers logo placeholder

ITW Performance Polymers Adhesives, Encapsulation & Industrial Repair Solutions

ITW Performance Polymers develops structural and semi-structural adhesives, potting and encapsulation compounds, industrial repair materials, protective polymer coatings, and epoxy grouting and chocking systems. Relevant technology platforms include Plexus® structural adhesives, Insulcast® electrical and electronic encapsulation materials, Devcon® repair and maintenance compounds, and Chockfast® and Epocast® grouting and chocking solutions for demanding industrial assemblies and equipment.

As an authorized ITW Performance Polymers distributor, Krayden supports customers evaluating materials for bonding, electrical protection, equipment repair, wear protection, and machinery foundation applications. Our team can help compare chemistries, substrates, processing requirements, application conditions, and other product-specific selection factors before a material is specified.

Markets Served by ITW Performance Polymers

Industrial OEM Industrial MRO Electronics & Electrical Transportation & Electric Vehicles Marine & Shipbuilding Wind Energy Mining & Aggregates Oil, Gas & Petrochemical Power Generation & Utilities Construction & Architecture

Featured ITW Performance Polymers Brands

Key technology platforms relevant to structural bonding, electrical encapsulation, industrial repair, and machinery grouting and chocking.

Plexus logo placeholder

Plexus®

Structural and semi-structural adhesive technologies for bonding composites, thermoplastics, metals, and mixed-material assemblies across manufacturing applications.

Insulcast logo placeholder

Insulcast®

Epoxy and silicone potting and encapsulation compounds for electrical and electronic assemblies, including general-purpose and thermal-management applications.

Devcon logo placeholder

Devcon®

Industrial repair, rebuilding, wear-protection, corrosion-control, and adhesive technologies for OEM and maintenance applications.

Chockfast logo placeholder

Chockfast®

Epoxy grouting and chocking systems used to support alignment, foundation, and machinery-installation requirements in industrial and marine environments.

Epocast logo placeholder

Epocast®

Chocking compounds and related materials associated with machinery mounting and marine equipment-installation applications.

 
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Structural & Semi-Structural Bonding

Structural Adhesives

ITW Performance Polymers supports structural bonding through Plexus methacrylate and polyurethane technologies and Devcon epoxy adhesive systems. These materials are used across composite, thermoplastic, metal, and mixed-material assemblies where the adhesive must be selected around substrate condition, bondline geometry, working time, fixturing, production method, and the mechanical and environmental demands of the finished assembly.

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Chemistry

Methacrylate Structural Adhesives

Plexus methacrylate adhesives are designed for structural bonding across composite, thermoplastic, coated-metal, and raw-metal assemblies. Product selection should account for the exact substrate combination, working time, required gap fill, surface preparation, cure behavior, and assembly process.

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Chemistry

Polyurethane Structural Adhesives

Plexus polyurethane structural adhesives extend the portfolio into applications that balance structural bonding with flexibility and thermal or mechanical stress management. Exact suitability depends on the product, substrate set, bondline, processing conditions, and service environment.

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Chemistry

Epoxy Structural Adhesives

Devcon epoxy adhesives provide a structural-bonding option for industrial assemblies, particularly where metal bonding, toughness, gap filling, or chemical and environmental exposure are important considerations. Confirm product-specific cure, mix, packaging, and substrate requirements before selection.

 
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Insulcast® Electrical Protection Materials

Potting and Encapsulation Compounds

Insulcast epoxy and silicone compounds are used to pot, cast, and encapsulate electrical and electronic assemblies where protection, insulation, thermal management, flow, flexibility, or production processing requirements influence material choice. Applications include printed circuit boards, power supplies, transformers, batteries, ignition components, and other electrical equipment; the appropriate chemistry depends on the assembly design and product-specific electrical, thermal, mechanical, and processing requirements.

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Chemistry

Epoxy Potting & Casting Compounds

Insulcast epoxy systems cover general-purpose and specialty potting or casting requirements. Selection variables can include viscosity, cure schedule, mix ratio, hardness, thermal conductivity, chemical exposure, electrical properties, and the size and geometry of the encapsulated assembly.

Insulcast silicone potting compound image placeholder
Chemistry

Silicone Potting & Encapsulation Compounds

Insulcast silicone systems provide a more flexible encapsulation option for assemblies where stress relief, thermal cycling, repairability, or low-viscosity flow may be important. Cure mechanism, viscosity, thermal properties, adhesion requirements, and service environment should be checked for the exact formulation.

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Function

Thermal-Management & Specialty Encapsulation

Selected Insulcast epoxy and silicone formulations are engineered for applications where heat transfer, flow around components, flame performance, electrical insulation, or other specialized requirements are part of the encapsulation design. Confirm the required properties against the exact product data before use.

 
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Devcon® Maintenance & Repair Solutions

Repair Compounds and Protective Coatings

Devcon repair compounds and coating technologies are used to rebuild damaged surfaces, repair metal or rubber components, and protect industrial equipment against wear, abrasion, corrosion, erosion, and related maintenance challenges. Choosing the right material depends on the base substrate, damage mechanism, application thickness, surface preparation, equipment geometry, cure window, and the mechanical, chemical, or wear conditions expected in service.

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Repair Type

Metal Rebuilding & Repair Compounds

Metal-filled and related polymer repair compounds can be used to rebuild worn or damaged equipment surfaces, fill voids, restore geometry, or prepare components for continued service. Material choice should reflect substrate condition, repair depth, application orientation, machining or finishing needs, and expected service exposure.

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Repair Type

Rubber & Belt Repair Compounds

Flexible urethane repair materials support maintenance of conveyor belts, rubber linings, rolls, and related components where tears, gouges, worn areas, or localized damage must be repaired. Selection depends on repair geometry, flexibility, surface preparation, cure time, abrasion conditions, and return-to-service requirements.

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Coating Type

Wear & Abrasion Protective Coatings

Devcon wear-resistant epoxy compounds and coatings are used on industrial equipment exposed to sliding abrasion, impact, and material handling. Product selection should consider wear mechanism, particle size, impact severity, surface profile, coating thickness, equipment geometry, and the required maintenance window.

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Coating Type

Corrosion & Erosion Protective Coatings

Ceramic-filled and other protective epoxy coatings can be used to repair or protect pumps, tanks, pipes, shafts, and process equipment exposed to corrosive or erosive conditions. Confirm substrate preparation, chemical exposure, application method, coating build, cure schedule, and service-temperature requirements for the selected system.

 
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Chockfast® & Epocast® Foundation Systems

Epoxy Grouts and Chocking Compounds

ITW Performance Polymers supplies epoxy grouting and chocking technologies for machinery foundations, alignment, mounting, and load-transfer applications. Chockfast systems span industrial grouting and chocking, while Epocast products are associated with machinery and marine chocking. Material selection and installation should be based on equipment type, load path, foundation condition, placement geometry, grout or chock dimensions, application temperature, and the product-specific installation procedure.

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Material Type

Epoxy Machinery Grouts

Chockfast epoxy grouts are used in foundation and machinery-installation work where equipment alignment, load transfer, dimensional stability, and installation conditions must be controlled. The appropriate system depends on the equipment, foundation, grout depth, pour geometry, temperature, and installation procedure.

Selection Considerations
  • Equipment load, foundation condition, and alignment requirements
  • Grout depth, pour geometry, and installation temperature
  • Surface preparation, placement method, and specified cure procedure
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Material Type

Machinery Chocking Compounds

Chockfast and Epocast chocking compounds support machinery mounting where the material must fill the interface between equipment and its foundation or support structure. Selection should be based on equipment configuration, chock dimensions, load, installation environment, and the exact product procedure.

Selection Considerations
  • Machinery type, load path, and required chock geometry
  • Chock thickness, surrounding structure, and application temperature
  • Installation accessories, release provisions, and cure verification

Talk to our Experts

Krayden can help compare ITW Performance Polymers materials for structural bonding, potting and encapsulation, industrial repair and protection, and machinery grouting or chocking. Our team can support product selection, substrate and application requirements, processing considerations, and comparison of candidate materials for your assembly or maintenance application.

Contact our team Call +1 (800) 448-0406

ITW Performance Polymers Quick Reference

Brands Carried
Plexus, Insulcast, Devcon, Chockfast, Epocast
Core Technology
Structural Bonding, Encapsulation & Industrial Polymer Systems
Top Categories
Structural Adhesives, Potting & Encapsulation, Repair & Protective Coatings, Grouts & Chocking
Key Markets
Industrial OEM & MRO, Electronics, Transportation, Marine, Energy, Mining & Petrochemical

1200 products

  • Carnauba Wax Aerosol Spray | All Grades
    No longer available

    Permasil 909C | Carnauba Wax Mold Release Spray

    • Carnauba wax Mold Release Spray
    • Solvent-based, non-flammable
    • Compatible with Epoxy Mold Compound
  • 1mil Antistatic ESD Polyimide X-Section

    PIT1A-ESD | 1mil Antistatic ESD Polyimide (Kapton) Tape with Acrylic Adhesive

    • 1 mil polyimide film
    • Acrylic adhesive
    • >6000V breakdown voltage
  • Bi57Sn42Ag1 Near-Eutectic Leadfree Solder Spheres

    LINQALLOY Bi57Sn42Ag1 | Near-Eutectic Pbfree Solder Spheres

    • Leadfree Solder Spheres
    • 1% Agg adds mechanical strength to bismuth-tin alloy
    • Low-temperature near-eutetic Solder
  • NanoClear Stencil Treatment - Results

    NanoClear Fluxophobic Stencil Treatment Wipes

    • Best-in-class stencil treatment technology
    • Better quality printing
    • Reduce underside cleaning
  • Metal Repellency Treatment

    Metal Repellency Treatment

    • Renders metal surfaces hydrophobic/oleophobic
    • 2-4 nm thickness
    • Repellent to nearly any liquid
  • Glass Repellency Treatment

    Glass Repellency Treatment

    • For making glass surfaces hydrophobic and oleophobic
    • 2-20 nm thickness
    • Easy to apply, optically clear and ultra thin
  • Multi-Surface Hydrophobic Treatment - Water Contact Angles on Aluminum

    Multi Surface Hydrophobic Treatment

    • General purpose hydrophobic treatment
    • 20-100 nm thickness
    • Repels most aqueous liquids
  • Multi-Surface Oleophobic Treatment - Oil Contact Angles

    Multi Surface Oleophobic Treatment

    • General purpose hydrophobic/oleophobic treatment
    • 30 - 300 nm thickness
    • Reduces surface friction
  • NanoProof 1.0 PCB Waterproofing Surface Treatment

    NanoProof 1.0 PCB Waterproofing Surface Treatment

    • Provides basic protection for accidental water damage
    • 10-100 nm thickness
    • IPX3
  • NanoProof 5.1 PCB Waterproofing Surface Treatment

    NanoProof 5.1 PCB Waterproofing Surface Treatment

    • Hydrophobic/Oleophobic treatment
    • 6-9 µm thickness
    • IPX5
  • 905 Specialty Cleaner

    905 Specialty Cleaner

    • Water based specialty cleaner
    • Enhances adhesion of Aculon coatings
    • For almost all metallic and oxide containing surfaces
  • NanoProof 5.0 PCB Waterproofing Surface Treatment

    NanoProof 5.0 PCB Waterproofing Surface Treatment

  • Solder Sphere Tape & Reel Packaging

    Solder Sphere Tape & Reel Packaging

    • Suitable for BGA and flip chip packaging techniques
    • Available for our complete range of solder sphere alloys and diameters
    • Compatible with almost all existing pick and place feeders
  • Melamine Compression-Grade Mold Cleaning Compounds

    MCL-C10 | Melamine Compression Cleaning Material

    • 0.07% Formaldehyde
    • Compression grade
    • Suitable for transfer mold equipment
  • RCS320 | Rubber Cleaning Sheets

    RCS 320 | Rubber Cleaning Sheets

    • Optimal cleaning performance
    • Good flow characteristics
    • No mold abrasion
  • SAC305 on 13

    SAC305 on 13" Tape & Reel

    • Lowest cost Sn/Ag/Cu alloy on tape & reel
    • Suitable for BGA and flip chip packaging techniques
    • Compatible with almost all existing pick and place feeders
  • MCL-C11 | Melamine Compression Cleaning Tablets

    MCL-C11 | Melamine Compression Cleaning Tablets

    • 3.6% Formaldehyde
    • Compression Grade
    • Suitable for EMC
  • BMI-689 Low Viscosity Liquid Bismaleimide

    BMI-689 Low Viscosity Liquid Bismaleimide

    • Hydrophobic
    • High adhesion to various substrates
    • Superior thermal stability
  • SAC305 on 7

    SAC305 on 7" Tape & Reel

    • SAC 305 on 7 in Tape & Reel
    • Designed for Pick & Place
    • Available for all sizes of solder spheres
  • NanoProof 2.1 PCB Waterproofing Surface Treatment

    NanoProof 2.1 PCB Waterproofing Surface Treatment

    • Hydrophobic treatment
    • 30-50 μm thickness
    • IPX7, IPX8
  • BMI-3000 CG Low Cost Bismaleimide (Imide Extended) in Powder Form

    BMI-3000 CG Low Cost Bismaleimide (Imide Extended) in Powder Form

    • Superior thermal stability
    • High adhesion to various substrates
    • Hydrophobic toughener
  • BMI-1400 Low Viscosity Bismaleimide Oligomer

    BMI-1400 Low Viscosity Bismaleimide Oligomer

    • Soluble in many reactive diluents
    • High adhesion to various substrates
    • Superior thermal stability
  • BMI-1500 Low Molecular Weight Bismaleimide Oligomer

    BMI-1500 Low Molecular Weight Bismaleimide Oligomer

    • Soluble in many reactive diluents
    • High adhesion to various substrates
    • Superior thermal stability
  • BMI-1700 Amorphous, Low Molecular Weight Bismaleimide Oligomer

    BMI-1700 Amorphous, Low Molecular Weight Bismaleimide Oligomer

    • Soluble in many reactive diluents
    • High adhesion to various substrates
    • Superior thermal stability
  • BMI-5000 P Imide-extended Bismaleimide Oligomer

    BMI-5000 P Imide-extended Bismaleimide Oligomer

    • Additive to enhance toughness in thermoset compositions
    • Cures to a tough thermoset
    • Low cross-link density
  • BMI-6000 Imide-extended Bismaleimide Oligomer

    BMI-6000 Imide-extended Bismaleimide Oligomer

    • Superior thermal stability
    • Good dielectric properties
    • Toughener
  • BMI-3000 Gel Bismaleimide (Imide Extended)

    BMI-3000 Gel Bismaleimide (Imide Extended)

    • Superior thermal stabilty
    • Hydrophobic
    • Toughener
  • BMI-3000 J Bismaleimide (Imide Extended) in Powder Form

    BMI-3000 J Bismaleimide (Imide Extended) in Powder Form

    • Superior thermal stability
    • High adhesion to various substrates
    • Hydrophobic toughener
  • NanoClear Test Pen

    NanoClear Test Pen

    • Best-in-class stencil treatment technology
    • Simple and effective test
    • No training required
  • NanoProof 8.4 PCB Waterproofing Surface Treatment

    NanoProof 8.4 PCB Waterproofing Surface Treatment

    • Hydrophobic treatment
    • Application dependent thickness
    • Adheres to multiple substrates
  • CHEMLINQ MRE-C909 | Carnauba Wax Mold Release Spray

    CHEMLINQ MRE-C909 | Carnauba Wax Mold Release Spray

    • Alternative to MJ Gordon #909C
    • Carnauba wax mold release Spray
    • Compatible with Epoxy Mold Compound
  • AcuWet 470 Hydrophilic coating

    AcuWet ON-470 Hydrophilic coating

    • Provides a hydrophilic coating
    • Excellent chemical bonding to many surfaces
    • Easy to apply
  • EC Nanoscale Epoxy control

    EC Nanoscale Epoxy control

    • Eliminating Die Attach Epoxy bleed
    • Epoxy control in Semiconductor packaging
    • Excellent chemical bonding to many surfaces
  • Loctite Ablestik 8008HT
    No longer available

    LOCTITE ABLESTIK 8008

    • Snap curable after B stage
    • Low modulus
    • Void free bondline without bleed
  • Loctite Ablestik ABP 8068TB

    LOCTITE ABLESTIK ABP 8068TB

    • Good workability
    • High thermal stability
    • Solder replacement
  • Loctite Ablestik ABP 8068TA
    No longer available

    LOCTITE ABLESTIK ABP 8068TA

    • Excellent workability
    • Dispensable
    • Printable
  • Loctite Ablestik SSP 2020

    LOCTITE ABLESTIK SSP 2020

    • High thermal conductivity
    • High electrical conductivity
    • High die shear strength
  • LOCTITE 3128

    LOCTITE 3128

    • One component
    • Low temperature cure
    • Bonding heat sensitive components
  • MCN-T20 | Wax Conditioning Pellet

    MCN-T20 | Transfer-Grade Wax Conditioning Pellets

    • Wax Compound
    • Filling deep cavities
    • Transfer Molding
  • MCL-C12 Melamine Compression Cleaning Tablets

    MCL-C12 | Melamine Compression Cleaning Tablets

    • 1.7% Formaldeheyde
    • Compression Grade
    • Suitable for Semiconductor EMC
  • TIP1500 | Thermal insulator pad

    TIP 1500 | Thermal insulator pad

    • 0.54 - 0.61 Thermal Impedance
    • 1.5 Thermal Conductivity
    • 0.23mm Thickness
  • TIP3500 | Thermal insulator pad

    TIP 3500 | Thermal insulator pad

    • 0.18 - 0.23 Thermal Impedance
    • 3.5 Thermal Conductivity
    • 0.25 - 0.50 mm Thickness
  • HT3500 | One part Hybrid Gap Filler

    HT 3500 | One part Hybrid Thermal Gel

    • Dark Red
    • 3.5 Thermal Conductivity
    • High flow rate
  • LOCTITE ECCOBOND LUX OGR150THTG

    LOCTITE ECCOBOND LUX OGR150THTG

    • Non conductive
    • Photocurable
    • Cures in shadowed areas
  • A1050 | Anti bleed Additive

    A1050 | Anti bleed Additive

    • Silver filled systems
    • 100 mPa-s Viscosity
    • Non halogenated
  • HLT 2000| Two part Hybrid Thermal Gel

    HLT 2000 | Two part Hybrid Thermal Gel

    • Yellow + White
    • 2.0 Thermal Conductivity
    • Cost Effectiveness
  • TG2000I | Thermal Grease

    TG 2000I | Thermal Grease

    • 0.02 Thermal Impedance
    • 2.0 Thermal Conductivity
    • 30μm BLT
  • LTM6300-SP | Phase Change Paste

    LTM 6300-SP | Phase Change Paste

    • 0.12 - 0.14 Thermal Impedance
    • 1.8 - 2.4 Thermal Conductivity
    • Highest volume resistivity
  • Sn63Pb37 on 13inch tape and reel

    Sn63Pb37 on 13" Tape & Reel

    • Sn63Pb37 alloy on tape & reel
    • Suitable for BGA and flip chip packaging techniques
    • Compatible with almost all existing pick and place feeders
  • BMI-3000-C | Gel Catalyzed Bismaleimide oligomer

    BMI-3000-C | Gel Catalyzed Bismaleimide oligomer

    • Precatalyzed
    • Toughener
    • Hydrophobic
  • BMI-2500 | Imide extended Bismaleimide powder

    BMI-2500 | Imide extended Bismaleimide powder

    • Hydrophobic
    • Toughener
    • Increased modulus and Tg
  • GDS180S | 0.18mm Carbon Paper

    LINQCELL GDP180 | 180um Carbon Paper

    • 0.18 mm - 180 um - 7 mil
    • Alternative to Spectracarb 0850
    • Gas diffusion layer and electrode
  • LPK-20 | LINQPAK Blue Ice Shipping pack

    LPK-20 | LINQPAK Blue Ice Shipping pack

    • Outer Box
    • 3 layer insulation foil
    • Double Foam Barrier
  • LOCTITE ABLESTIK 16-1LV
    No longer available

    LOCTITE ABLESTIK 16-1LV

    • Two components
    • Room temperature cure
    • Low volume resistivity
  • LOCTITE SI 5404

    LOCTITE SI 5404

    • Electrical isolation
    • Thermally conductive
    • Bond metallic heat sinks
  • LOCTITE SI 5140

    LOCTITE SI 5140

    • Non corrosive
    • Room temperature vulcanization
    • Alkoxy Silicone
  • LOCTITE SI 5145

    LOCTITE SI 5145

    • Non corrosive
    • Room temperature vulcanization
    • No slumping
  • LOCTITE SF 7387

    LOCTITE SF 7387

    • Activator
    • Very low viscosity
    • Promote cure of acrylic adhesives
  • Bi58Sn42 on 7

    Bi58Sn42 on 7" Tape & Reel

    • Bi58Sn42 on 7 in Tape & Reel
    • Designed for Pick & Place
    • Available for all sizes of solder spheres
  • Bi58Sn42 on 13

    Bi58Sn42 on 13" Tape & Reel

    • Bi58Sn42 on 13inch Tape & Reel
    • Suitable for BGA and flip chip packaging techniques
    • Compatible with almost all existing pick and place feeders
  • PEMION+™ - PF1-HL8-15

    PEMION - PF1-HLF8-15

    • PFAS-free Proton Exchange Membrane with Hydrocarbon reinforcement
    • 15 µm thickness
    • Optimized for heavy duty fuel cell applications
  • SAC305 on 12

    SAC305 Solder Preforms on Tape & Reel

    • SAC 305 on Tape & Reel
    • Designed for Pick & Place
    • Available for all sizes of solder spheres
  • WS810 | Wax Conditioning Sheets

    WS810 | Wax Conditioning Sheets

    • High flow
    • Excellent elastic properties
    • Homogeneous waxing
  • LOCTITE 3619

    LOCTITE 3619

    • SMD components on PCB
    • Chipbonder
    • Very High dispense speed
  • LOCTITE ABLESTIK 8370C

    LOCTITE ABLESTIK 8370C

    • Gold Filled
    • High electrical conductivity
    • Works on Noble finished substrates
  • FM-0411P | Reactive PDMS - Monoterminal Hydroxy

    FM-0411P | Reactive PDMS - Monoterminal Hydroxy

    • Mono terminal
    • 1,000 g/mol | 15 mPas
    • Hydroxy functional group
  • TIP 5000 | Thermal insulator pad

    TIP 5000 | Thermal insulator pad

    • 0.15 - 0.18 Thermal Impedance
    • 5.0 Thermal Conductivity
    • 0.25 - 0.50 mm Thickness
  • XVCF-XS50P | LINQSTAT - 50 Ω/sq Conductive Film

    XVCF-XS50P | LINQSTAT - 50 Ω/sq Conductive Film

    • 2.6 mil - 2.75mil
    • ±50 Ohms/sq Surface resistivity
    • Polyurethane film
  • LOCTITE ABLESTIK 550K

    LOCTITE ABLESTIK 550K

    • Low cure temperature
    • Hard to bond metals
    • Thermally conductive
  • LOCTITE ECCOBOND F113SC

    LOCTITE ECCOBOND F113SC

    • Two component
    • High Tg
    • Fiber optic assembly
  • LINQCELL CF350 | 350um Carbon Fabric

    LINQCELL CF350 | 350um Carbon Fabric

    • 0.35mm - 350um - 14mil
    • Comes in roll form
    • 5 TP Resistance
  • LINQCELL CF400-MP | 400um Carbon Fabric

    LINQCELL CF400-MP | 400um Carbon Fabric

    • 0.4mm - 400um - 16mil
    • Comes in roll form
    • 13 TP Resistance
  • LOCTITE 401

    LOCTITE 401

    • Instant adhesive
    • Very high adhesion strength
    • Bond dissimilar substrates
  • LOCTITE ECCOBOND LUX OGRFI146T

    LOCTITE ECCOBOND LUX OGRFI146T

    • Low refractive index
    • Photocurable
    • Cures in shadowed areas
  • LINQSOL EMC-7560 | Black Epoxy Mold Compound

    LINQSOL EMC-7560 | Black Epoxy Mold Compound

    • High Glass Transition Temperature (205 °C)
    • Designed for high voltage, high power discrete packages
    • New Epoxy System To Pass HTRB Tests
  • Copper Core SAC305 on 13

    Copper Core SAC305 on 13" Tape & Reel

    • Copper core Sn/Ag/Cu alloy on tape & reel
    • Suitable for BGA and flip chip packaging techniques
    • Compatible with almost all existing pick and place feeders
  • LOCTITE ABLESTIK NCA 2350

    LOCTITE ABLESTIK NCA 2350

    • Fast cure
    • Good adhesion
    • Heat sensitive components
  • Aculon Nanoproof 3-001X

    Aculon Nanoproof 3-001X

    • 0.1% Fluoroacrylate Solids
    • 1 um Thickness
    • 3M Novec 1720 replacement
  • A6165 | Electrical conductivity Enhancer

    A6165 | Electrical conductivity Enhancer

    • Improves electrical conductivity
    • Soluble in most resin systems
    • May improve thermal conductivity
  • MCP-5260 | Motor Coating Powder

    MCP-5260 | Motor Coating Powder

    • Light Green Color
    • Good Edge Coverage
    • Insulation Class F
  • PEM-665 | Methacrylate terminated polyester

    PEM-665 | Methacrylate terminated polyester

    • Low color
    • Low shrinkage
    • Thermal stability
  • DMI-3850 | Low Outgassing Adhesive

    DMI-3850 | Low Outgassing Adhesive

    • UV Cure
    • Space applications
    • Virtually no outgassing
  • OLS-1000HF | Liquid Encapsulant - Two part Epoxy

    OLS-1000HF | Liquid Encapsulant - Two part Epoxy

    • Liquid epoxy encapsulant
    • LED applications
    • Low Halogen
  • HW-HSPS | Heat Spreader - Progressive Stamping

    HW-HSPS | Heat Spreader - Progressive Stamping

    • Nickel plated / Au Spot
    • Small and medium form factors
    • Simplified parts - Lower volumes
  • HW-HSTD | Heat Spreader - Transfer die stamping

    HW-HSTD | Heat Spreader - Transfer die stamping

    • Nickel plated / Au Spot
    • Wide range form factor
    • Complex designs - Higher volumes
  • OPTOLINQ BMC-1100| Black Mold Compound

    OPTOLINQ BMC-1100| Black Mold Compound

    • Black
    • Excellent heat resistance
    • Long spiral flow
  • JNC PI-6643-004 | Insulating Polyimide Ink

    JNC PI-6643-004 | Insulating Polyimide Ink

    • Thermal Curable
    • High Heat Resistance
    • Inkjet Printing
  • JNC PI-6302-004 | Insulating Polyimide Ink

    JNC PI-6302-004 | Insulating Polyimide Ink

    • Thermal Curable
    • Low Temperature Curing
    • High Heat Resistance
  • JNC PI-6322-001 | Insulating Polyimide Ink
    No longer available

    JNC PI-6322-001 | Insulating Polyimide Ink

    • Thermal Curable
    • Heat Resistance
    • Low Temperature Curing
  • JNC PI-6673-002 | Insulating Polyimide Ink

    JNC PI-6673-002 | Insulating Polyimide Ink

    • Thermal Curable
    • Low Temperature Curing
    • Low Warpage
  • JNC PA-1210-020 | Insulating Polyacrylate Ink
    No longer available

    JNC PA-1210-020 | Insulating Polyacrylate Ink

    • UV Curable/ Solvent free
    • Standard
    • Optoelectronics
  • JNC PA-1210-034 | Insulating Polyacrylate Ink
    No longer available

    JNC PA-1210-034 | Insulating Polyacrylate Ink

    • UV Curable/ Solvent free
    • High Insulation reliability for fine pitch devices
    • Advance Sensors
  • JNC PA-1210-035 | Insulating Polyacrylate Ink

    JNC PA-1210-035 | Insulating Polyacrylate Ink

    • UV Curable/ Solvent free
    • High Insulation reliability for thin film devices
    • Optical Devices
  • OLS-1305 | Liquid Encapsulant - Two part Epoxy

    OLS-1305 | Liquid Encapsulant - Two part Epoxy

    • Extremely low viscosity
    • Rapid cure at moderate temperatures
    • Excellent mechanical properties
  • OLS-1557 | Liquid Encapsulant - Two part Epoxy

    OLS-1557 | Liquid Encapsulant - Two part Epoxy

    • Low viscosity
    • Good workability
    • High temperature resistance
  • FM-0815J | Reactive PDMS - Monoterminal Alkoxysilyl

    FM-0815J | Reactive PDMS - Monoterminal Alkoxysilyl

    • Mono terminal
    • 3,000 g/mol | 26 mPas
    • Alkoxysilyl functional group
  • Hysol GR720 | Black Epoxy Mold Compound

    Hysol GR720 | Black Epoxy Mold Compound

    • High reliability
    • Green and halogen-free
    • Designed for SOT applications
  • Hysol KL1000-3LX | Black Epoxy Mold Compound

    Hysol KL1000-3LX | Black Epoxy Mold Compound

    • High reliability
    • High moldability
    • Decreased cost-of-use
  • COOLINQ SG-25
    No longer available

    COOLINQ SG-25 | Graphite heat spreader

    • 25um Graphite
    • Light weight and flexible
    • Excellent thermal conductivity
  • COOLINQ SG-90 | Graphite Heat Spreader
    No longer available

    COOLINQ SG-90 | Graphite Heat Spreader

    • 90um Graphite
    • Light weight and flexible
    • Excellent thermal conductivity
  • JNC PA-1510-003| Insulating Polyacrylate Ink

    JNC PA-1510-003| Insulating Polyacrylate

    • UV curable
    • Heat Resistance
    • Removable process material
  • JNC PA-1510-005| Insulating Polyacrylate Ink

    JNC PA-1510-005| Insulating Polyacrylate

    • UV curable
    • Dissolutes in 5 minutes
    • Removable process material
  • OLS-3712 | Liquid encapsulant - two part silicone

    OLS-3712 | Liquid encapsulant - Two part silicone

    • low-temperature resistance
    • Excellent thermal and light resistance
    • Excellent adhesion to various materials
  • OLS-5812 | Liquid encapsulant - two part silicone

    OLS-5812 | Liquid encapsulant - Two part silicone

    • High reliability
    • Excellent thermal and light resistance
    • Excellent adhesion to different materials
  • RD-A primer | Isopropanol solvent

    RD-A primer | Isopropanol solvent

    • Provides basic protection for accidental water damage
    • Coating Thickness 5-100 nm
    • For coatings that react with metal alkoxide functional groups
  • Aculon HB | Hydrophilic based

    Aculon HB | Hydrophilic Treatment

    • Used as provided for wipe applications
    • Use for dip treatment applications
    • Gentle enough for many substrates.
  • LOCTITE EDAG 452SS E&C

    LOCTITE EDAG 452SS E&C

    • Screen printable
    • Fast UV cure
    • Excellent adhesion
  • SACQ | Pb-free Solder Spheres

    SACQ | Pb-free Solder Spheres

    • Leadfree Solder Spheres
    • Excellent Solder Joint Reliability for small devices
    • Excellent fatigue resistance
  • OPTOLINQ LE-5031 | Two part epoxy resin

    OPTOLINQ LE-5031 | Two part epoxy resin

    • Low viscosity
    • High transparency
    • Excellent solvent, aging, and thermal resistance
  • AEMION+™-AF3-HWC9-70

    AEMION+™-AF3N-HWC9-75

    • Recommended for AEM Water Electrolysis, Acid Recovery, and Salt Splitting
    • Single-Step Activation for Reduced Membrane Processing Time
    • 75-µm thick membrane with woven PEEK reinforcement
  • LOCTITE EDAG 456

    LOCTITE EDAG 456

    • Non conductive
    • screen printable
    • Thermoformable
  • LOCTITE ECI 8001 E&C

    LOCTITE ECI 8001 E&C

    • Rapid heating with fast, defined cut-off temperatures, no external control devices needed
    • Printable on most common substrates
    • Screen printable
  • OPTOLINQ GT-W170MG | White Epoxy Mold Compound

    OPTOLINQ GT-W170MG | White Epoxy Mold Compound

    • High light reflectance and excellent light shielding
    • Low yellowing at high temperature
    • High MSL performance
  • LOCTITE M4100 E&C

    LOCTITE M4100 E&C

    • Conductive
    • screen printable
    • Electroless nickel plateable
  • LOCTITE ABLESTIK 8700E

    LOCTITE ABLESTIK 8700E

    • Electrically conductive
    • Retains high shear strength after thermal cycling
    • Thermally conductive
  • EMC-7535 | Black Epoxy Mold Compound

    LINQSOL EMC-7535 | Black Epoxy Mold Compound

    • Green molding compound
    • Designed for high-power TO packages
    • High Tg, low water absorption, low modulus, and excellent thermal stability
  • LOCTITE ABLESTIK ABP 8068TD

    LOCTITE ABLESTIK ABP 8068TD

    • Good workability
    • ±50 W/mK Thermal Conductivity
    • High electrical conductivity
  • LINQSOL EMC-7142 | Black Epoxy Mold Compound

    LINQSOL EMC-7142 | Black Epoxy Mold Compound

    • Green epoxy molding compound
    • Designed for SOP and QFP
    • Low water absorption, low stress, and excellent moldability
  • LOCTITE ECCOBOND D125 F DR
    No longer available

    LOCTITE ECCOBOND D125 F DR

    • Low water absorption
    • Low exotherm
    • Non-sag
  • LOCTITE ECI 7004HR E&C

    LOCTITE ECI 7004HR E&C

    • High Resistivity
    • Screen Printable
    • Flexible low temperature drying cycles
  • LOCTITE NCI 7002 E&C

    LOCTITE NCI 7002 E&C

    • Non-Conductive
    • Screen Printable
    • Flexible low temperature drying cycles
  • OPTOLINQ LE-5031HY | Two part epoxy resin

    OPTOLINQ LE-5031HY | Two part epoxy resin

    • Low viscosity
    • High transparency
    • Excellent solvent, aging, anti yellowing, and thermal resistance
  • OPTOLINQ LE-2161 | Two part epoxy resin

    OPTOLINQ LE-2161 | Two part epoxy resin

    • Low viscosity
    • Fast curing
    • High transparency and good electrical properties
  • FM-4411 | Reactive PDMS - Bi terminal Hydroxy

    FM-4411 | Reactive PDMS - Bi terminal Hydroxy

    • Bi terminal
    • 1,000 g/mol | 35 mPas
    • Hydroxy functional groups
  • LINQCELL NWM 300 | 0.3mm Nickel Wire Mesh

    LINQCELL NWM 300 | 0.3mm Nickel Wire Mesh

    • 0.30 mm wire diameter
    • Excellent chemical stability and anti-corrosion resistance
    • High electrical conductivity
  • LINQCELL NWM250 | 0.25mm Nickel Wire Mesh roll

    LINQCELL NWM 250 | 0.25mm Nickel Wire Mesh

    • 0.25 mm wire diameter
    • Excellent chemical stability and anti-corrosion resistance
    • High electrical conductivity
  • LINQSOL EMC-7535MF | High Tg Mold Compound

    LINQSOL EMC-7535MF | Black Epoxy Mold Compound

    • Green molding compound
    • Designed for high-power TO packages
    • High Tg, low water absorption, low modulus, and excellent thermal stability
  • LINQTAPE HDT1SR | Hydrogen detection tape

    LINQTAPE HDT1SR | Hydrogen detection tape

    • 100 um film thickness
    • Visual H2 leak detection
    • 3,000V Breakdown voltage
  • LINQPAK Foil

    LINQPAK Foil | Thermal insulation material

    • Multi-layered
    • Enhanced Dry Ice Efficiency
    • Size customization
  • LOCTITE ABLESTIK E 8502-1

    LOCTITE ABLESTIK E 8502-1

    • One component
    • Low stress
    • Thermally conductive
  • OPTOLINQ TMC-3282 | Transparent Mold Compound

    OPTOLINQ TMC-3282 | Transparent Mold Compound

    • Exceptional moldability with long spiral flow
    • Excellent performance at high temperature and high humidity conditions
    • Excellent adhesion and low stress
  • LOCTITE ABLESTIK NCA 2286AE

    LOCTITE ABLESTIK NCA 2286AE

    • Dual Cure
    • High elongation strength
    • Active alignment in lens holder attach
  • Hysol GR350HT | Black Epoxy Mold Compound

    Hysol GR350HT | Black Epoxy Mold Compound

    • High Thermal Conductivity GR30
    • Designed for TO92 and TO220 packages
    • Excellent reliability under high temperature and bias
  • WS830 | Wax Conditioning Sheets

    WS830 | Wax Conditioning Sheets

    • High flow
    • Excellent elastic properties
    • Homogeneous waxing
  • LOCTITE ECI 1006 E&C

    LOCTITE ECI 1006 E&C

    • Halogen free
    • High conductivity
    • Fine line screen printable
  • MCL-T20 | Melamine Transfer Cleaning Pellets
    No longer available

    MCL-T20 | Melamine Transfer Cleaning Pellets

    • Excellent Cleaning Efficiency
    • Ideal for High-Precision Industries (Electronics and Automotive)
    • Enhanced Mold Lifespan and Minimized Downtime
  • LINQCELL GFP2000 | Graphite Felt

    LINQCELL GFP2000 | Graphite Felt

    • 2.00 mm - 2000 µm - 78 mil
    • High chemical resistance, electrical conductivity, and open porosity
    • Electrode materials for high-temperature batteries
  • OPTOLINQ TMC-3282SF | Transparent Mold Compound

    OPTOLINQ TMC-3282SF | Transparent Mold Compound

    • Exceptional moldability with long spiral flow
    • Excellent performance at high temperature and high humidity conditions
    • Excellent adhesion and low stress
  • OPTOLINQ LE-8011HT | Two part epoxy resin

    OPTOLINQ LE-8011HT | Two part epoxy resin

    • Excellent thermal stability
    • Excellent UV stability
    • High light transmittance
  • LINQSOL EMC-6043 | Black Epoxy Mold Compound

    LINQSOL EMC-6043 | Black Epoxy Mold Compound

    • High Spiral flow
    • Designed for SOT and Modules
    • Low stress and Low Moisture Absorption
  • LINQSOL EMC-9012 | Black Epoxy Mold Compound

    LINQSOL EMC-9012 | Black Epoxy Mold Compound

    • Green epoxy molding compound
    • Designed for Ball Grid Array (BGA) and Land Grid Array (LGA) packages.
    • Ultra low water absorption, low stress, and excellent reliability performance.
  • MM304 | Methacrylate adhesion promoter Additive

    MM304 | Methacrylate adhesion promoter Additive

    • Mild pleasant odor
    • Hydrolytic resistance
    • Lower weight loss on cure than IBOMA
  • LINQCELL GDL1000 | 1.0mm Carbon Plate

    LINQCELL GDL1000 | 1.0mm Carbon Plate

    • 1.00 mm – 1000 µm – 39 mil
    • High electrical conductivity and tunable compressibility
    • Porous transport and gas diffusion layers for water electrolyzers and fuel cells
  • BMI-689M Low Viscosity Liquid Bismaleimide

    BMI-689M Low Viscosity Liquid Bismaleimide

    • Hydrophobic
    • High adhesion to various substrates
    • Superior thermal stability
  • OPTOLINQ LE-2161HT | Two part BPA-free epoxy resin

    OPTOLINQ LE-2161HT | Two part BPA-free epoxy resin

    • Low viscosity
    • Non-yellowing
    • High transparency and good mechanical properties
  • LinqSil MRE-S101 | Silicone Mold Release Spray

    Chemlinq MRE-S101 | Silicone Mold Release Spray

    • Silicone based Mold Release spray
    • Green label
    • Compatible with Epoxy Mold Compound
  • Hysol GR910-K | Black Epoxy Mold Compound

    Hysol GR910-K | Black Epoxy Mold Compound

    • Halogen free
    • High fluidity to avoid W/S issue
    • Designed for BGA/LGA
  • OLS-1000LV | Liquid encapsulant - Two part Epoxy

    OLS-1000LV | Liquid encapsulant - Two part Epoxy

    • Extremely Low viscosity
    • Rapid Cure
    • Visible Light Blocking
  • OLS-1000HV | Liquid encapsulant - Two part Epoxy

    OLS-1000HV | Liquid encapsulant - Two part Epoxy

    • Excellent Mechanical Properties
    • Halogen Free
    • Rapid Cure
  • MM220 | mono-acrylate monomer

    MM220 | Mono-acrylate monomer

    • Low Viscosity
    • Low weight loss on cure
    • Minimizes cure shrinkage
  • Benzimidazole CAS #51-17-2

    Benzimidazole CAS #51-17-2

    • Enhanced Thermal Stability
    • Versatile Chemical Base
    • Corrosion Protection
  • OPTOLINQ OLS-5812M | Liquid encapsulant - Two part silicone

    OPTOLINQ OLS-5812M | Liquid encapsulant - Two part silicone

    • High reliability
    • Excellent thermal and light resistance
    • Excellent adhesion to different materials
  • LINQSOL EMC-9131 | Black Epoxy Mold Compound

    LINQSOL EMC-9131 | Black Epoxy Mold Compound

    • High Spiral flow
    • Designed for SOT and Modules
    • Low stress and Low Moisture Absorption
  • LOCTITE ABLESTIK 2025DNP

    LOCTITE ABLESTIK 2025DNP

    • Excellent dispense capabilities
    • For mother die in array packaging
    • 260ºC reflow capability for Pb-free applications
  • LOCTITE ECI 1014 E&C

    LOCTITE ECI 1014 E&C

    • Low temperature drying
    • High conductivity
    • Compatible for use with polycarbonate, polyester and polyurethane
  • LOCTITE ABLESTIK FS 849-TI

    LOCTITE ABLESTIK FS 849-TI

    • Low outgassing
    • Low electrical resistance
    • High thermal conductivity - 7.8 W/mK
  • DCT-PET115 | Polyethylene Die Cutting Tape
    No longer available

    DCT-PET115 | Polyethylene Die Cutting Tape

    • 115 µm film thickness
    • Acrylic adhesive
    • Specifically tailored for glass and ceramic
  • DCT-PO165 | Polyolefin Die Cutting Tape
    No longer available

    DCT-PO165 | Polyolefin Die Cutting Tape

    • 165 µm film thickness
    • UV removable acrylic adhesive
    • Gentle adhesion for packaging substrates and glass
  • DCT-PO200 | Polyolefine Die Cutting Tape
    No longer available

    DCT-PO200 | Polyolefin Dicing Tape

    • 200 µm film thickness
    • UV removable acrylic adhesive
    • Gentle adhesion for packaging substrates and glass
  • DCT-PVC95 | Polymerized Vinyl Chloride Dicing Tape
    No longer available

    DCT-PVC95 | Polymerized Vinyl Chloride Dicing Tape

    • 95 µm film thickness
    • UV removable acrylic adhesive
    • Strong adhesion for silicon wafer applications
  • DCT-PVC80NUV | Polymerized Vinyl Chloride Dicing Tape
    No longer available

    DCT-PVC80NUV | Polymerized Vinyl Chloride Dicing Tape

    • 80 µm film thickness
    • Translucent Film
    • Acrylic non UV adhesive
  • BGT-PO130 | Polyolefine Back Grinding Tape
    No longer available

    BGT-PO130 | Polyolefin Back Grinding Tape

    • 130 µm film thickness
    • UV Removable acrylic adhesive
    • Back grinding compatible, general purpose
  • BGT-PO180 | Polyolefine Back Grinding Tape
    No longer available

    BGT-PO180 | Polyolefin Back Grinding Tape

    • 180 µm film thickness
    • Urethane UV removable adhesive
    • High accuracy and easy to peel
  • WS800 | Wax Conditioning Sheets

    WS800 | Wax Conditioning Sheets

    • Excellent conditioning for green EMCs
    • Fast cure time
    • No lead frame and preheating required
  • OPTOLINQ LE-EP123 | One-Part Epoxy encapsulant

    OPTOLINQ LE-EP123 | One-Part Epoxy encapsulant

    • Excellent thermal stability
    • Excellent UV stability
    • High light transmittance
  • LOCTITE ABLESTIK EMI 8890SB

    LOCTITE ABLESTIK EMI 8890SB

    • Conformal EMI shielding
    • Excellent adhesion on EMC
    • Spray coating
  • LINQCELL GDP090 | 90um Carbon Paper

    LINQCELL GDP090 | 90um Carbon Paper

    • Ultra-thin thickness (0.09 mm - 90 µm - 3.54 mil)
    • High graphitization temperature (2000 °C)
    • Optimized as gas diffusion layers in fuel cells
  • LINQCELL GDP250 | 250um Carbon Paper

    LINQCELL GDP250 | 250um Carbon Paper

    • 0.25 mm – 120 µm – 9.84 mil
    • Customizable with PTFE Coating and Available in Roll Form
    • Optimized as gas diffusion layers in fuel cells
  • LINQCELL GDP310 | 310um Carbon Paper

    LINQCELL GDP310 | 310um Carbon Paper

    • 0.31 mm - 310 µm - 12.20 mil
    • Customizable with PTFE Coating and Available in Roll Form
    • Optimized as gas diffusion layers in fuel cells
  • LINQCELL GDP120 | 120um Carbon Paper

    LINQCELL GDP120 | 120um Carbon Paper

    • 0.12 mm - 120 µm - 4.72 mil
    • High graphitization temperature with enhanced hydrophobicity from MPL coating
    • Optimized as gas diffusion layers in fuel cells
  • Hysol GR700 | Black Epoxy Mold Compound

    Hysol GR700 | Black Epoxy Mold Compound

    • Low stress
    • For high power devices
    • Good electrical performance
  • LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound

    LINQSOL EMC-5013 | Thermally conductive Epoxy Mold Compound

    • Green epoxy molding compound
    • Thermally conductive molding compound
    • Designed for transistor outline (TO) and fullpack power packages
  • VRB-MEM50 | 50μm VRB membrane

    VRB-MEM50 | 50μm VRB membrane

    • Designed as cation (proton) exchange membranes for redox flow batteries
    • High acid capacity and conductivity for improved performance
    • Extended service life
  • VRB-MEM75 | 75μm VRB membrane

    VRB-MEM75 | 75μm VRB membrane

    • Designed as cation (proton) exchange membranes for redox flow batteries
    • High acid capacity and conductivity for improved performance
    • Extended service life
  • LINQCELL GDP280 | 280um Carbon Paper

    LINQCELL GDP280 | 280um Carbon Paper

    • 0.28 mm - 280 µm - 11.0 mil
    • Enhanced hydrophobicity from MPL/PTFE and Available in Roll Form
    • Optimized as gas diffusion layers in fuel cells
  • LOCTITE ABLESTIK ABP 8068TH

    LOCTITE ABLESTIK ABP 8068TH

    • Robust reliability
    • 150 W/mK Thermal Conductivity
    • Low stress
  • LINQCELL GDP340-MP | 340 um Carbon Paper

    LINQCELL GDP340-MP | 340 um Carbon Paper

    • 0.34 mm - 340 um - 13.4 mil
    • Enhanced hydrophobicity from MPL/PTFE and Available in Roll Form
    • Optimized as gas diffusion layers in fuel cells
  • LINQSOL EMC-9023 | Epoxy Mold Underfill

    LINQSOL EMC-9023 | Epoxy Mold Underfill

    • Green epoxy molding compound
    • Epoxy mold undefill
    • Designed for FCBGA, FCCSP, SiP
  • LOCTITE ABLESTIK ABP 6395T

    LOCTITE ABLESTIK ABP 6395T

    • High reliability
    • 30 W/(m-K) Thermal Conductivity
    • Good adhesion to Ag, Cu, PPF, Non-BSM, and BSM die
  • LOCTITE ABLESTIK ATB 125GR

    LOCTITE ABLESTIK ATB 125GR

    • Low ionic content
    • Excellent adhesion on both metal lead frames and BGAs
    • High modulus
  • LOCTITE ECCOBOND LCM 1000-AG1

    LOCTITE ECCOBOND LCM 1000AG-1

    • High Toughness
    • Ultra Low warpage
    • CTE matching Silica
  • LOCTITE ABLESTIK ABP 6392TEA

    LOCTITE ABLESTIK ABP 6392TEA

    • High electrical conductivity
    • High thermal conductivity
    • Good adhesion to a variety of substrates
  • CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane

    CS-783 | Methacrylated Epoxy Functional Hybrid Cyclosiloxane

    • Low viscosity
    • Dual cure mechanism
    • Multifunctional
  • U-847 | Dimer Diisocyanate Urethane Dimethacrylate

    U-847 | Dimer Diisocyanate Urethane Dimethacrylate

    • Low color
    • Low cure shrinkage
    • BPA-free
  • LINQSOL EMC-G135 | Thermally Conductive Epoxy Mold Compound

    LINQSOL EMC-G135 | Thermally Conductive Epoxy Mold Compound

    • Green epoxy molding compound
    • Low cost thermally conductive molding compound
    • Designed for rectifier bridges and SMX packages
  • PET1S-UT-Clear | 1-mil Clear Polyester (PET) Tape with ultra thin Silicone Adhesive

    PET1S-UT-Clear | 1-mil Clear Polyester (PET) Tape with ultra thin Silicone Adhesive

    • 1 mil thick polyester film
    • Ultra thin silicone adhesive
    • 4200V breakdown voltage
  • LOCTITE ABLESTIK ABP 8068TI

    LOCTITE ABLESTIK ABP 8068TI

    • High thermal and electrical properties
    • Low sintering temperature
    • High reliability
  • LOCTITE ABLESTIK NCA 2280

    LOCTITE ABLESTIK NCA 2280

    • Non-conductive
    • Fast cure at low temperature
    • High thixotropic index
  • LOCTITE ABLESTIK NCA 2390

    LOCTITE ABLESTIK NCA 2390

    • High dispense aspect ratio
    • Fast cure at low temperature
    • High thixotropic index
  • LINQCELL CAT-NiAl

    LINQCELL CAT-NiAl

    • Low overpotential for hydrogen evolution reaction
    • Platinum-group metal (PGM)-free catalyst
    • Optimized as cathode for alkaline water electrolyzers
  • LINQCELL NWM-ANO

    LINQCELL ANO-NiAl

    • Low overpotential for oxygen evolution reaction
    • Platinum-group metal (PGM)-free catalyst
    • Optimized as anode for alkaline water electrolyzers
  • LINQCELL ALK-PCS

    LINQCELL ALK-PCS500

    • Low internal resistance
    • High gas barrier properties
    • Optimized separator for large-scale and high-pressure alkaline water electrolyzers
  • LOCTITE D125 F

    LOCTITE D125 F

    • Low exotherm
    • High speed dispensing
    • Low cure temperature
  • LINQSOL EMC-1533 | Black Epoxy Molding Compound

    LINQSOL EMC-1533 | Black Epoxy Molding Compound

    • Green molding compound
    • Designed for transistor outline (TO) and double decawatt (D2PAK) packages
    • Excellent workability, low water absorption, low modulus, and excellent thermal stability
  • LINQSOL EMC-9012H | Black Epoxy Mold Compound

    LINQSOL EMC-9012H | Black Epoxy Mold Compound

    • Green epoxy molding compound
    • Designed for Ball Grid Array (BGA) packages and Quad Flat No Leads (QFN) Packages
    • High glass transition temperature, low stress, and excellent reliability performance
  • LINQSOL EMC-G833 | Black Epoxy Mold Compound

    LINQSOL EMC-G833 | Black Epoxy Mold Compound

    • Green epoxy molding compound
    • Designed for Quad Flat No Leads(QFN), Quad Flat (QFP) packages and DFN Packages
    • Excellent reliability performance
  • LINQSOL EMC-G833R | Black Epoxy Mold Compound

    LINQSOL EMC-G833R | Black Epoxy Mold Compound

    • Green epoxy molding compound
    • Designed for Quad Flat No Leads(QFN) and Quad Flat (QFP) packages
    • Excellent reliability performance (MSL 1)
  • LPK-SZBICE | Blue Ice Spongepack

    LPK-SZBICE | Blue Ice Spongepack

    • Shape-Retaining Design
    • Long-Lasting Cooling (0ºC to 8ºC) for several days
    • Reusable & Durable
  • LOCTITE ABLESTIK 968-4

    LOCTITE ABLESTIK 968-4

    • Electrically Insulating
    • B-Stageable
    • Screen printable
  • LINQCELL VRB-AEM50

    LINQCELL VRB-AEM50

    • 50um - Low ohmic resistance
    • Excellent oxidative stability and chlorine resistance
    • Designed as ion exchange membranes for redox flow batteries
  • LINQCELL VRB-AEM30

    LINQCELL VRB-AEM30

    • 30um - Ultra low ohmic resistance
    • Excellent oxidative stability and chlorine resistance
    • Designed as ion exchange membranes for redox flow batteries
  • LINQCELL CAT-NiMoAl

    LINQCELL CAT-NiMoAl

    • Low overpotential for hydrogen evolution reaction
    • Platinum-group metal (PGM)-free catalyst
    • Optimized as cathode for alkaline water electrolyzers
  • OPTOLINQ TMC-2100H | Transparent Mold Compound

    OPTOLINQ TMC-2100H | Transparent Mold Compound

    • Optimal spiral flow
    • Low moisture absorption
    • Superior moldability and reliability
  • OPTOLINQ TMC-2100IR | Transparent Molding Compound

    OPTOLINQ TMC-2100IR | Transparent Molding Compound

    • Low moisture absorption
    • Superior moldability and reliability
    • For IR Applications
  • Hysol GR910-LB| Black Epoxy Mold Compound

    Hysol GR910-LB| Black Epoxy Mold Compound

    • Halogen free
    • High fluidity to avoid W/S issue
    • Designed for BGA/LGA
  • RCS 550 | Rubber Cleaning Sheets

    RCS 550 | Rubber Cleaning Sheets

    • Low torque, suitable for intricate cavities and air vents
    • No mold abrasion & corrosion
    • Minimal odor
  • RCS 560 | Rubber Cleaning Sheets

    RCS 560 | Rubber Cleaning Sheets

    • High torque, high cleaning efficiency for deep residues
    • No mold abrasion & corrosion
    • Minimal odor
  • TMC-G373H | Transparent Epoxy Molding Compound

    TMC-G373H | Transparent Epoxy Molding Compound

    • Exceptional moldability with waxed formulation
    • Low moisture absorption even at high temperature and high humidity conditions
    • Excellent solder resistance for reliability
  • EMC-G274 | Epoxy Molding Compound

    EMC-G274 | Epoxy Molding Compound for Photocouplers

    • Good moldability
    • Designed for photocoupler / optocoupler devices
    • Excellent mechanical integrity
  • EMC-G208 | Epoxy Molding Compound

    EMC-G208 | Epoxy Molding Compound

    • High Tg
    • Good moldability
    • Low stress & water absorption
  • WMC-G279 | White Epoxy Molding Compound

    WMC-G279 | White Epoxy Molding Compound

    • White transmitting EMC for optocouplers
    • Balanced moldability and cycle efficiency
    • Low stress
  • EMC-G845 | Epoxy Molding Compound

    EMC-G845 | Black Epoxy Molding Compound

    • Green epoxy molding compound
    • Designed for QFN & QFP packages
    • Satisfies JEDEC MSL 3 reliability
  • EMC-G836 | Epoxy Molding Compound

    EMC-G836 | Epoxy Molding Compound

    • For QFN & QFP packages
    • Meets JEDEC MSL 3 reliability requirements
    • High spiral flow
  • LOCTITE ABLESTIK 958-7 | Electrically Conductive Adhesive

    LOCTITE ABLESTIK 958-7 | Electrically Conductive Adhesive

    • Electrically conductive
    • Good adhesion to gold
    • Heat cure
  • MCL-T33 | Melamine Transfer Cleaning Tablet

    MCL-T33 | Melamine Transfer Cleaning Tablet

    • Transfer grade
    • Designed for semiconductor molds
    • High adhesive strength
  • EMC-G194 | Black Epoxy Molding Compound

    EMC-G194 | Black Epoxy Molding Compound

    • Good moldability
    • Low stress
    • High adhesion
  • LOCTITE 3296 | UV-curable Epoxy Adhesive

    LOCTITE 3296 | UV-curable Epoxy Adhesive

    • Fast UV cure
    • High Tg and low CTE
    • Low shrinkage during & after cure
  • Sn10Pb90 on 13 in Tape & Reel

    Sn10Pb90 on 13" Tape & Reel

    • Sn10Pb90 alloy on tape & reel
    • Suitable for BGA and flip chip packaging techniques
    • Compatible with almost all existing pick and place feeders
  • TFP1200 | 1200um Titanium Fiber Paper

    TFP1200 | 1200um Titanium Fiber Paper

    • 1.20mm - 1200um - 47.2mil
    • 50 - 60% Porosity
    • Electrode and Support structure
  • TPP500 | 500um Sintered Titanium Powder

    TPP500 | 500um Sintered Titanium Powder

    • 0.50mm - 500um - 20mil
    • 30–40% Porosity
    • Gas Diffusion and Porous Transport Layer for PEM Water Electrolyzers and Fuel Cells
  • LE-8011U | Optically Clear Epoxy Resin

    LE-8011U | UV-Resistant Clear Epoxy Resin

    • High thermal stability with a Tg> 160°C
    • Strong resistance to UV degradation
    • High light transmittance
  • OPTOLINQ TMC-688H | Transparent Mold Compound

    OPTOLINQ TMC-688H | Transparent Mold Compound

    • Low Lumen Decay
    • High Glass Transition Temperature
    • Superior moldability and reliability
  • ABP 2100ANP

    LOCTITE ABP 2100ANP | PFAS-Free Die Attach Adhesive

    • Formulated for Pb-free applications
    • High hot/wet adhesion
    • Excellent dispensability
  • MCL-T27 | Melamine Transfer Cleaning Pellets

    MCL-T27 | Melamine Transfer Cleaning Pellets

    • Enhanced workability
    • Surface restoration
    • Operational efficiency
  • WMC-G261 | White Epoxy Molding Compound for Optocouplers

    WMC-G261 | White Epoxy Molding Compound for Optocouplers

    • Excellent reflectance
    • Ideal spiral flow
    • Superior moldability and reliability
  • BMC-G241 | Black Optocoupler Epoxy Molding Compound

    BMC-G241 | Black Optocoupler Epoxy Molding Compound

    • Good reflectance
    • Heat-resistant
    • Ideal spiral flow
  • GR900C-Q1L4 | QFN Epoxy Molding Compound

    GR900 | QFN Epoxy Molding Compound

    • Low stress and moisture absorption
    • High adhesion
    • Low moisture absorption
  • LOCTITE 3626M | Surface Mount Adhesive

    LOCTITE 3626M | Surface Mount Adhesive

    • Heat-cured
    • For SMD components to PCB
    • Compatible with syringe and stencil print
  • LOCTITE ABLESTIK ABP 2053SNP

    LOCTITE ABLESTIK ABP 2053SNP

    • Formulated without intentionally added PFAS
    • One-component
    • Low stress
  • PI-6324-001 | Insulating Polyimide Ink

    PI-6324-001 | Insulating Polyimide Ink

    • Thermal Curable
    • Heat Resistance
    • Low Temperature Curing
  • LINQSOL EMC-G375 | Thermally Conductive Mold Compound

    LINQSOL EMC-G375 | Thermally Conductive Mold Compound

    • Thermally conductive molding compound
    • Designed for fullpack TO power packages and bridge rectifier packages
    • Excellent mechanical integrity
  • OPTOLINQ TMC-688L | Transparent Mold Compound

    OPTOLINQ TMC-688L | Transparent Mold Compound

    • Low lumen decay
    • Superior moldability and reliability
    • For low stress molding applications
  • LINQSOL EMC-G374

    LINQSOL EMC-G374

    • Ultra-high glass transition temperature (272 °C)
    • Designed for high-power SiC and GaN devices
    • High degradation temperature, and excellent thermal stability
  • ALPHA NF3000 Water-Soluble Flux

    ALPHA NF3000 Water-Soluble Flux

    • Water-soluble formulation
    • Organic activating system
    • Wide thermal window
  • ALPHA SC-7525 Cleaner

    ALPHA SC-7525 Cleaner

    • IPA alternative
    • High solvency
    • Suitable for manual & immersive methods
  • KESTER 5744 Solder Saver

    KESTER 5744 Solder Saver

    • Effectively removes dross
    • Low-fuming and remains stable at soldering temperatures.
    • Can be easily skimmed off the pot after use.
  • KESTER 186 Soldering Flux

    KESTER 186 Soldering Flux

    • Approved under MIL-F-14256 as Rosin Mildly Activated.
    • High thermal stability
    • Excellent electrical reliability
  • KESTER 951 Soldering Flux

    KESTER 951 Soldering Flux

    • Zero-halogen, non-rosin formula
    • High Surface Insulation Resistance (SIR)
    • Minimizes defects
  • KESTER 977 Soldering Flux

    KESTER 977 Soldering Flux

    • Biodegradable at pH ≥ 2.0
    • Compatible with most solder masks and laminates
    • Does not degrade SIR
  • KESTER 979 Solder Flux

    KESTER 979 Solder Flux

    • Chemically compatible with most solder mask & laminates
    • Does not degrade SIR
    • Bellcore GR-78 Compliant
  • KESTER NF372-TB Soldering Flux

    KESTER NF372-TB Soldering Flux

    • Provides good solderability at atmospheric temperature
    • Zero-halogen & low solids formulation
    • Safe for rework
  • KESTER 985M Soldering Flux

    KESTER 985M Soldering Flux

    • Low-solid & halide-free
    • No-clean flux
    • Improves soldering performance
  • KESTER 5252M Cleaner

    KESTER 5252M Cleaner

    • Quickly air dries
    • Halogen-free formulation
    • Non-ionic
  • KESTER 959T Soldering Flux

    KESTER 959T Soldering Flux

    • Excellent wetting
    • Low rosin content
    • Non-corrosive
  • KESTER 2331-ZX Soldering Flux

    KESTER 2331-ZX Soldering Flux

    • Neutral pH
    • Minimal foaming
    • Low-odor emission
  • KESTER RF771 Rework Flux

    KESTER RF771 Rework Flux

    • High thermal stability
    • Leaves bright & shiny solder joints post-reflow
    • Classified as ORM0 per J-STD-004
  • KESTER 186 Flux-Pen

    KESTER 186 Flux-Pen

    • High thermal stability
    • Improves soldering performance
    • ROL1 per J-STD-004 & J-STD-004B
  • KESTER 951 Flux-Pen

    KESTER 951 Flux-Pen

    • Improves soldering performance
    • Non-corrosive tack-free residue
    • ORL0 per J-STD-004
  • KESTER 952-D6 Flux-Pen

    KESTER 952-D6 Flux-Pen

    • Residues almost colorless
    • Improves soldering performance
    • Reduced odor
  • KESTER 2331-ZX Flux-Pen

    KESTER 2331-ZX Flux-Pen

    • High activity
    • Chemically compatible with most masks and laminates
    • Neutral pH chemistry
  • KESTER TSF-6852 Tacky Soldering Flux

    KESTER TSF-6852 Tacky Soldering Flux

    • 8-hour stencil life
    • Leaves bright and shiny joints
    • ORH1 per J-STD-004
  • KESTER TSF-6522RH Tacky Soldering Flux

    KESTER TSF-6522RH Tacky Soldering Flux

    • High tack value
    • Long tack life
    • Can reflow in air or nitrogen
  • KESTER 952-S Soldering Flux

    KESTER 952-S Soldering Flux

    • Formulated for photovoltaic applications
    • High reliability ribbons
    • Halogen-free & low-solids
  • KESTER 2235 Soldering Flux

    KESTER 2235 Soldering Flux

    • Minimizes icicling and bridging
    • Compatible with most masks and laminates
    • High activity
  • ABchimie DVS Silicone Thinner

    ABchimie DVS Silicone Thinner

    • Specially formulated for silicone conformal coatings
    • Supports spray and dip application
    • Maintains viscosity in open-tank dip systems
  • HGP12 | High Thermal Conductivity Gap Pad

    HGP12 | High Thermal Conductivity Gap Pad

    • 0.13 Thermal Impedance
    • 12 Thermal Conductivity
    • Low oil bleeding & Low volatile
  • HGP12PT | High Thermal Conductivity Putty Pad

    HGP12PT | High Thermal Conductivity Putty Pad

    • 0.13 Thermal Impedance
    • 12 Thermal Conductivity
    • Low oil bleeding & Low volatile
  • ABchimie LDM High-Temperature Solder Mask

    ABchimie LDM High-Temperature Solder Mask

    • Dries at room temperature
    • Withstands temperatures up to 270°C
    • Can be completely removed by hand
  • ABchimie DVU Urethane Thinner

    ABchimie DVU Urethane Thinner

    • Formulated for urethane‑based conformal coatings
    • For dip coating and spray coating applications
    • Consistent, stable solvent composition
  • ABchimie R12230 Optically Clear Encapsulation Gel

    ABchimie R12230 Optically Clear Encapsulation Gel

    • Optically clear
    • Quick setting
    • Good heat stability
  • ABchimie DVP Permanent Coating Stripper

    ABchimie DVP Permanent Coating Stripper

    • Designed for controlled application
    • Strong solvency
    • Easy to apply and remove
  • ABchimie APS AC31 Acrylic Thinner

    ABchimie APS AC31 Acrylic Thinner

    • Formulated for acrylic conformal coatings
    • Provides stable evaporation behavior
    • Enables viscosity control
  • Humiseal Thinner 521EU

    Humiseal Thinner 521EU

    • RoHS Directive 2002/95/EC compliant
    • For use with HumiSeal conformal coatings
    • Ensures proper viscosity adjustment
  • ABchimie DVA BA Non-Toxic Acrylic Thinner

    ABchimie DVA BA Non-Toxic Acrylic Thinner

    • Non‑toxic solvent blend
    • For AVR80 BA acrylic coating
    • Easy to mix
  • ABchimie DVA XY Acrylic Thinner

    ABchimie DVA XY Acrylic Thinner

    • Designed for acrylic conformal coatings
    • Optimized for AVR80 XY
    • Ensures proper viscosity for dip, spray, and automated coating processes
  • Kester TSF-ULR18

    Kester TSF-ULR18

    • Ultra-low residue
    • No-clean formulation
    • High reliability
  • Kester TSF-6502JCR

    Kester TSF-6502JCR

    • 8-hour stencil life
    • Printing up to <16mil pitch
    • ROL1 & Bellcore GR-78 compliant
  • KESTER 5252 Cleaner

    KESTER 5252 Cleaner

    • Quickly air dries
    • Halogen-free formulation
    • Non-ionic
  • KESTER 182 Soldering Flux

    KESTER 182 Soldering Flux

    • High-purity composition
    • Meets IPC J-STD-002 and J-STD-003 requirements
    • Excellent electrical reliability
  • KESTER 958 Soldering Flux

    KESTER 958 Soldering Flux

    • Excellent for bare copper applications
    • Conformal coating compatible
    • Improves soldering performace
  • KESTER 2166-BN Soldering Flux

    KESTER 2166-BN Soldering Flux

    • Halide-free formulation
    • Superior surface insulation resistance
    • Easy residue removal
  • HumiSeal Thinner 64

    HumiSeal Thinner 64

    • RoHS Directive 2015/863/EU compliant
    • Ensures proper viscosity adjustment
    • For use with HumiSeal 2A64
  • HumiSeal Thinner 73

    HumiSeal Thinner 73

    • RoHS Directive 2015/863/EU compliant
    • Ensures proper viscosity adjustment
    • For use with 1B73 and 1A20
  • HumiSeal Thinner 503

    HumiSeal Thinner 503

    • RoHS Directive 2015/863/EU compliant
    • Ensures proper viscosity adjustment
    • Compatible with HumiSeal 1B12, 1B31, 1B66, and 1B73
  • HumiSeal Thinner 505

    HumiSeal Thinner 505

    • RoHS Directive 2015/863/EU compliant
    • Ensures proper viscosity adjustment
    • Compatible with HumiSeal 1R32 and 1R32A-2
  • HumiSeal Thinner 521

    HumiSeal Thinner 521

    • RoHS Directive 2015/863/EU compliant
    • Ensures proper viscosity adjustment
    • Compatible with multiple HumiSeal conformal coatings
  • HumiSeal Thinner 600

    HumiSeal Thinner 600

    • RoHS Directive 2011/65/EC compliant
    • Compatible with multiple HumiSeal conformal coatings
    • Specialty thinner
  • HumiSeal Thinner 602-245

    HumiSeal Thinner 602-245

    • RoHS Directive 2011/65/EU compliant
    • For acrylic conformal coatings
    • Ensures proper viscosity adjustment
  • HumiSeal Thinner 604

    HumiSeal Thinner 604

    • RoHS Directive 2011/65/EC compliant
    • Specialty thinner
    • For use with 1B31EPA and 1B73EPA
  • HumiSeal Thinner 673

    HumiSeal Thinner 673

    • RoHS Directive 2015/863/EU compliant
    • For use with acrylic conformal coatings
    • Ensures proper viscosity adjustment
  • HumiSeal Thinner 701

    HumiSeal Thinner 701

    • RoHS Directive 2011/65/EC compliant
    • For use with multiple HumiSeal conformal coatings
    • Ensures proper viscosity adjustment
  • HumiSeal Thinner 789

    HumiSeal Thinner 789

    • For use with LTX series of conformal coatings
    • Low odor
    • No aromatic compounds
  • HumiSeal Thinner 901

    HumiSeal Thinner 901

    • Low toxicity
    • BTX-free
    • Compatible with multiple coatings
  • HumiSeal Thinner 903

    HumiSeal Thinner 903

    • Slower evaporation rate
    • Smoother flow
    • Better leveling
  • HumiSeal Thinner 904

    HumiSeal Thinner 904

    • Faster evaporation rate
    • Smoother flow
    • Faster drying time
  • HumiSeal Thinner 905

    HumiSeal Thinner 905

    • For rapid cure applications
    • Fast evaporation rate
    • For faster recoat process
  • HumiSeal Thinner 999

    HumiSeal Thinner 999

    • Optimized viscosity control
    • RoHS compliant
    • High-purity solvent blend
  • HumiSeal Thinner 535

    HumiSeal Thinner 535

    • RoHS Directive 2015/863/EU compliant
    • Ensures proper viscosity adjustment
    • Compatible with 2A53 conformal coating
  • HumiSeal Stripper 1063

    HumiSeal Stripper 1063

    • Non-Acidic Polyurethane Removal
    • Controlled One-Hour Soak
    • Clear Low-Density Stripper
  • DOWFROST LC 25 Heat Transfer Liquid

    DOWFROST LC 25 Heat Transfer Liquid

    • Made with Dow PURAGUARD™ USP/EP grade PG (>99.8% purity)
    • Freeze protection to –10°C (14°F)
    • Formulated for high-efficiency heat transfer
  • ALPHA EF-8800HF No Clean Flux

    ALPHA EF-8800HF No Clean Flux

    • Robust soldering performance
    • Evenly spread, tack free residue
    • Halide-free
  • ALPHA SM-110 Solvent Cleaner

    ALPHA SM-110 Solvent Cleaner

    • High solvency
    • High flux loading capacity
    • Non-corrosive
  • LORD 7545 Two-Component Urethane Adhesive System

    LORD 7545 Two-Component Urethane Adhesive System

    • 1:1 mix ratio, 100% solids urethane adhesive
    • 1.5 to 65 minute selectable working time
    • Non-sag structural bonding with environmental and solvent resistance.
  • DOWSIL™ 1-2577 Conformal Coating

    DOWSIL™ 1-2577 Conformal Coating

    • One-part silicone conformal coating
    • UV indicator for inspection and quality control
    • High dielectric strength and electrical insulation
  • DOWSIL™ 3145 RTV Mil-A-46146 Adhesive/Sealant

    DOWSIL™ 3145 RTV Mil-A-46146 Adhesive/Sealant

    • Military-grade
    • High strength
    • Non-flowing paste
  • DOWSIL™ 7091 Adhesive Sealant

    DOWSIL™ 7091 Adhesive Sealant

    • Non-sag rheology
    • One-part moisture cure
    • Stable and flexible from -40 to 180℃
  • DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

    DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

    • Low viscosity for flow into small gaps and complex PCB assembly spaces
    • Soft, low-stress encapsulation during thermal cycling
    • UL 94 V-0 and UL RTI rated at 150°C
  • DOWSIL™ TC-2035 Thermally Conductive Adhesive

    DOWSIL™ TC-2035 CV Thermally Conductive Adhesive

    • 3.3 W/m·K thermal conductivity
    • Ultra-thin bondline thickness
    • Low volatile content
  • Frekote 700-NC GL

    Frekote 700-NC

    • No Chlorinated Solvents
    • High Gloss Finish
    • No Contaminating Transfer
  • ALPHA PoP707 Lead-Free No-Clean Solder Paste

    ALPHA PoP707 Lead-Free No-Clean Solder Paste

    • Fine particle dispersion (<10 µm)
    • ROL0 per IPC J‑STD‑004
    • Outstanding SIR performance
  • ALPHA OM-338-PT Paste Solder Flux

    ALPHA OM-338-PT Paste Solder Flux

    • Consistent printing down to 11 mil (0.28 mm)
    • Halide‑free (ROL0)
    • Meets IPC‑7095 Class 3 voiding
  • PERMABOND® MH052 Anaerobic Thread Sealant

    PERMABOND® MH052 Anaerobic Thread Sealant

    • BAM and DVGW approved anaerobic thread sealant for oxygen, natural gas, and LPG systems
    • Leak-tight sealing performance up to the burst pressure rating of the pipe
    • Particle-free anaerobic formulation resists shrinkage, cracking, and shredding unlike pipe dope and PTFE tape
  • 3M™ Scotch-Weld™ DP6310NS

    3M™ Scotch-Weld™ DP6310NS

    • 1:1 mix ratio by volume
    • Non-sag rheology
    • 9-minute work life
  • 3M™ Fastbond™ 2000NF

    3M™ Fastbond™ 2000NF

    • Quick bonding without heat
    • Immediate handling strength.
    • Post-formable and heat resistant
  • 3M™ Scotch-Weld™ Structural Polyurethane Adhesive DP609

    3M™ Scotch-Weld™ Structural Polyurethane Adhesive DP609

    • Rapid room-temperature curing
    • Flexible structural bonding
    • Approx. 9-minute work life at 23°C
  • 3M™ Scotch-Weld™ Urethane Adhesive DP6330NS

    3M™ Scotch-Weld™ Urethane Adhesive DP6330NS

    • 1:1 mix ratio
    • 15-minute work life
    • Non-sag rheology
  • 3M™ Scotch-Weld™ Low Odor Acrylic Adhesive DP8010

    3M™ Scotch-Weld™ Low Odor Acrylic Adhesive DP8010

    • Ability to structurally bond polyolefins without special surface preparation
    • Excellent water and humidity resistance
    • One step process
  • 3M™ Foam Fast Spray Adhesive 74

    3M™ Foam Fast Spray Adhesive 74

    • Used for bonding flexible urethane or latex foam
    • Provides excellent coverage.
    • Soft, non-dimpling glue lines.
  • 3M™ Repositionable Spray Adhesive 75

    3M™ Repositionable Spray Adhesive 75

    • Provides "tape-like" bonds
    • Bonds paper, cardboard, acetate, foil, fabrics, etc.
    • Extra-long tack range
  • 3M™ Super 77™ Universal Spray Adhesive

    3M™ Super 77™ Universal Spray Adhesive

    • High tack
    • High coverage
    • Fast drying
  • 3M™ Hi-Strength 90 Spray Adhesive

    3M™ Hi-Strength 90 Spray Adhesive

    • High strength
    • Contact-type adhesive
    • Fast-drying
  • 3M™ Citrus-Based Industrial Cleaner

    3M™ Citrus-Based Industrial Cleaner

    • No chlorinated or petroleum-based solvents
    • Gentle cleaning
    • Fresh citrus scent
  • 3M™ Double Sided Tape 9191

    3M™ Double Sided Tape 9191

    • Rubber Pressure Sensitive Adhesive
    • Double Sided Tape
    • High - Tack
  • 3M™ Transfer Tape 465

    3M™ Transfer Tape 465

    • Acrylic Adhesive
    • Excellent adhesion to paper stocks
    • Kraft Release Liner
  • 3M™ Double Sided Tape 415

    3M™ Double Sided Tape 415

    • Double Sided Acrylic Adhesive
    • Good adhesion to various substrates
    • Excellent for indoor / outdoor applications
  • Scotch® ATG Transfer Tape 904

    Scotch® ATG Transfer Tape 904

    • Adhesive Transfer Tape
    • No Carrier Film
    • Clean and instant bonding
  • Scotch® ATG Transfer Tape 924

    Scotch® ATG Transfer Tape 924

    • Thin 0.002 in. (0.05 mm) profile for low-profile bonding
    • Reverse wound construction for use with ATG hand-held dispensers
    • Provides consistent and controlled adhesive application
  • Scotch® ATG Transfer Tape 926

    Scotch® ATG Transfer Tape 926

    • Provides immediate and permanent bonds with high adhesion
    • Excellent performance up to 450 ºF (232 ºC)
    • Adheres to a variety of substrates (ABS, acrylic, PP, PE, etc.)
  • Scotch® ATG Transfer Tape 969

    Scotch® ATG Transfer Tape 969

    • Provides immediate and permanent bond
    • Designed to adhere to a variety of substrates
    • Conforms easily to curves and contours
  • 3M™ Double-Sided Paper Tape 9086

    3M™ Double-Sided Paper Tape 9086

    • Bonds to a wide variety of substrates
    • 0.5 mil tissue carrier
    • Double coated with 3.5 mil adhesive on each side
  • 3M™ Transfer Tape 9485PC

    3M™ Transfer Tape 9485PC

    • Utilizes a fiber-reinforced adhesive for roll stability
    • Resistance to humidity, water, solvent, and chemicals
    • The 5 mil (127µm) thick version of 3M™ Adhesive Transfer Tape 9482PC
  • 3M™ Removable and Repositionable Double-Sided Tape 9415PC

    3M™ Removable and Repositionable Double-Sided Tape 9415PC

    • Features a removable, repositionable, low-tack adhesive
    • Withstands temperatures as low as -20 °F (-29 °C) and as high as 158 °F (70 °C)
    • Ideal for temporary mounting of lightweight materials
  • 3M™ VHB™ Transfer Tape F9473PC

    3M™ VHB™ Transfer Tape F9473PC

    • Transparent, double sided, 10 mil (0.26 mm) VHB™ transfer tape
    • Short term temperature tolerance of up to 500 °F (260 °C)
    • Operating temperature tolerance of up to 300°F (149°C)
  • 3M™ VHB™ Tape 4910F

    3M™ VHB™ Tape 4910F

    • Clear Double Sided Tape
    • Acrylic Adhesive
    • Permanent Bonding for High Surface Energy Substrates
  • 3M™ VHB™ Tape 4912F

    3M™ VHB™ Tape 4912F

  • 3M™ VHB™ Tape 4991F

    3M™ VHB™ Tape 4991F

    • High-strength bonding
    • Conformable foam core
    • Multi-purpose adhesive
  • 3M™ Double Sided Urethane Foam Tape 4026

    3M™ Double Sided Urethane Foam Tape 4026

    • Provides strong holding power for long-term performance
    • Maintains bond integrity under elevated temperatures
    • Adapts to uneven or irregular surfaces
  • 3M™ Double Sided Urethane Foam Tape 4032

    3M™ Double Sided Urethane Foam Tape 4032

    • Provides durable, long-term holding power
    • Flexible and conformable for bonding on irregular surfaces
    • Foam structure reduces vibration and enhances stability
  • 3M™ Double Sided Foam Tape 9528

    3M™ Double Sided Foam Tape 9528

    • Rubber adhesive delivers quick “grab” for fast bonding
    • Adhesive on both sides for easy mounting and joining
    • Provides light conformability and consistent thickness
  • 3M™ VHB™ Tape GPH-110GF

    3M™ VHB™ Tape GPH-110GF

    • High Temperature Performance (Up to 230°C)
    • Permanent seal against water, moisture, etc.
    • 1.1 mm thickness
  • 3M™ VHB™ Tape GPH-160GF

    3M™ VHB™ Tape GPH-160GF

    • High Temperature Performance (Up to 230°C)
    • 1.6 mm thickness
    • Permanent seal against water, moisture, etc.
  • 3M™ VHB™ Tape GPH-060GF

    3M™ VHB™ Tape GPH-060GF

    • High Temperature Performance (Up to 230°C)
    • 0.6 mm thickness
    • Permanent seal against water, moisture, etc.
  • 3M™ VHB™ Tape 5925F

    3M™ VHB™ Tape 5925F

    • Double sided acrylic foam tape
    • 0.6 mm thickness
    • Excellent adhesion to multiple substrates
  • 3M™ VHB™ Tape 5962F

    3M™ VHB™ Tape 5962F

    • Double sided acrylic foam tape
    • 1.6 mm thickness
    • Bonding to multiple substrates
  • 3M™ Dual Lock™ Resealable Snap Tape SJ3540

    3M™ Dual Lock™ Resealable Snap Tape SJ3540

    • Black, interlocking mushroom-shaped heads (250 stem density per square inch)
    • Mates with Type 170, Type 250 or Type 400 stem densities
    • Strong fastener secures with an audible snap, verifying closure
  • 3M™ Dual Lock™ Reclosable Snap Tape SJ3550CF

    3M™ Dual Lock™ Reclosable Snap Tape SJ3550CF

    • Black, interlocking mushroom-shaped heads (250 stem density per square inch)
    • Mates with Type 170, Type 250 or Type 400 stem densities
    • Clear, acrylic, tape bonds well to a variety of substrates
  • 3M™ Dual Lock™ Resealable Snap Tape SJ3560

    3M™ Dual Lock™ Resealable Snap Tape SJ3560

    • Clear, interlocking mushroom-shaped heads (250 stem density per square inch)
    • Mates with Type 170, Type 250 or Type 400 stem densities
    • Clear, acrylic, tape bonds well to a variety of substrates
  • 3M™ Dual Lock™ Resealable Click Strap SJ3870

    3M™ Dual Lock™ Resealable Click Strap SJ3870

    • Black, interlocking mushroom-shaped heads (250 stem density per square inch)
    • Mates with Type 170, Type 250 or Type 400 stem densities
    • Black, modified acrylic
  • 3M™ Dual Lock™ Resealable Snap Tape SJ3540D

    3M™ Dual Lock™ Resealable Snap Tape SJ3540D

    • Black, interlocking mushroom-shaped heads (250 stem density per square inch)
    • Mates with Type 170, Type 250 or Type 400 stem densities
    • Features good temperature resistance of 120°F (49°C)
  • 3M™ Dual Lock™ Resealable Snap Tape SJ3551CF

    3M™ Dual Lock™ Resealable Snap Tape SJ3551CF

    • Black, interlocking mushroom-shaped heads (400 stem density per square inch)
    • Mates with Type 170 and Type 250 stem densities
    • Strong fastener secures with an audible snap
  • 3M™ Dual Lock™ Resealable Snap Tape SJ387B

    3M™ Dual Lock™ Resealable Snap Tape SJ387B

    • Black, interlocking mushroom-shaped heads (250 stem density per square inch)
    • Mates with Type 170, Type 250 or Type 400 stem densities
    • Strong fastener secures with an audible snap, verifying closure
  • 3M™ Resealable Loop and Hook Fastener SJ352D

    3M™ Resealable Loop and Hook Fastener SJ352D

    • Provide a firm adhesive bond to a wide variety of surfaces
    • Durable for thousands of closures
    • Best suited for indoor use
  • Scotch® ATG Transfer Tape Gun ATG700

    Scotch® ATG Transfer Tape Gun ATG700

    • Automatic liner rewind minimizes waste and eliminates cleanup
    • One-handed, trigger-controlled operation supports fast and consistent application
    • Delivers uniform adhesive thickness without oozing, glue lines, or overspray
  • 3M™ Scotchcast™ 260 Epoxy Powder Resin

    3M™ Scotchcast™ 260 Epoxy Powder Resin

    • Fast curing
    • Excellent electrical properties
    • Excellent flow • UL 1446 Electrical Insulation System (EIS) approval at class 120(E), 130(B), 155(F), and 180(H)
  • 3M Electrically Conductive Double-Sided Tape 9793KW Series

    3M Electrically Conductive Double-Sided Tape 9793KW Series

    • 0.02-0.20 ohm under 3M ETM-12 test conditions
    • Typical expected shielding effectiveness of 40-60 dB
    • Broad thickness and adhesion selection
  • 3M Electrically Conductive Double-Sided Tape 9793KT Series

    3M Electrically Conductive Double-Sided Tape 9793KT Series

    • Typical Z-axis electrical resistance`
    • Typical expected shielding effectiveness is 40-60 dB
    • Ten thicknesses from 130 to 500 µm
  • 3M EMI Absorber & Magnetic Shielding Material AB3000 Series

    3M EMI Absorber & Magnetic Shielding Material AB3000 Series

    • Broadband 1-10 GHz EMI Absorption
    • Configurable Thickness & Adhesive Options
    • Die-Cuttable Sheet Format
  • SIKAFLEX 232US

    SIKAFLEX 232US

    • High-Green-Strength Assembly Bonding
    • Non-Sag Gap-Filling Application
    • One-Part Moisture-Cure Processing
  • 3M 425 ALUMINUM FOIL TAPE

    3M 425 ALUMINUM FOIL TAPE

    • Aluminum Backing with Acrylic Adhesive
    • Great for Sealing
    • Low Moisture Vapor Permeability
  • 3M™ Scotch-Weld™ Structural Adhesive Film AF 30

    3M™ Scotch-Weld™ Structural Adhesive Film AF 30

    • Thermosetting Structural Adhesive Film
    • 5, 10, and 12 mil Thicknesses
    • Flexible Extremely-Low-Flow Film
  • 3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2U

    3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2U

    • High-Strength Structural Bonding
    • High- and Moderate-Tack Film Options
    • 60-Minute 250 deg F Cure
  • Loctite 495

    Loctite 495

    • One-Part Adhesive Form
    • Multi-Substrate Assembly Fixturing
    • Low-Viscosity Adhesive Application
  • Loctite 580 Pipe Sealant

    Loctite 580 Pipe Sealant

    • One-Component Sealing System
    • Low Pressure Sealing for Inactive Metals
    • Room-Temperature Sealing Cure
  • Loctite Ablestik 83C Conductive Epoxy Adhesive

    Loctite Ablestik 83C Conductive Epoxy Adhesive

    • Silver-Filled Epoxy Adhesive
    • 0.0004 ohm-cm Volume Resistivity
    • Electrical-Connection Epoxy Bonding
  • Loctite Ablestik 2116 Non-Conductive Adhesive

    Loctite Ablestik 2116 Non-Conductive Adhesive

    • Metal/Glass/Ceramic/Plastic Staking and Bonding
    • 30-Minute Pot Life
    • 415 V/mil Dielectric Strength
  • BONDERITE C-AK 6849 AERO

    BONDERITE C-AK 6849 AERO

  • BONDERITE C-AK ALUM ETCH 2 AERO

    BONDERITE C-AK ALUM ETCH 2 AERO

    • Cleaning and Etching
    • Uniform Surface Wetting
    • Aluminum Surface Treatment
  • BONDERITE C-AK ALUM ETCH 3 AERO

    BONDERITE C-AK ALUM ETCH 3 AERO

    • Surface Soil Removal
    • Aluminum Surface Etching
    • 0.05 to 0.10 mil/min Etch Rate
  • BONDERITE C-IC DEOXIDOZER

    BONDERITE C-IC DEOXIDOZER

    • Aluminum Deoxidizing, Desmutting, Etching
    • Prepares for Chromating
    • 1 to 10 Minute Application Rate
  • Loctite Ablestik CT 5047-2

    Loctite Ablestik CT 5047-2

    • Electrically Conductive Bonding
    • Room Temperature Curing
    • Electrical Connections Bonding
  • DOWSIL 3-4154 CLEAR DIELECTRIC GEL

    DOWSIL 3-4154 Dielectric Gel Kit

    • Electrically Insulating Material
    • 550 mPa s Mixed Viscosity
    • 180-Minute 80 deg C Cure
  • MOLYKOTE 3451 Chemical Resistant Bearing Grease

    MOLYKOTE 3451 Chemical Resistant Bearing Grease

    • Fluorosilicone Grease Formulation
    • 40 to 450 deg F Service Range
    • 340 kg Four-Ball Weld Load
  • DOWSIL 550 SILICONE FLUID

    DOWSIL 550 SILICONE FLUID

    • Silicone Fluid Formulation
    • High-Temperature Silicone-Fluid Stability
    • Low-Volatility Silicone Fluid
  • MOLYKOTE 7 RELEASE COMPOUND

    MOLYKOTE 7 RELEASE COMPOUND

    • 40 to 204 deg C Service Range
    • Release, Lubrication, Sealing, and Protection
    • 0.8% Evaporation at 200 deg C
  • DOWSIL 93-104 Ablative Material Kit

    DOWSIL 93-104 Ablative Material Kit

    • Protects surfaces from direct flame and extreme heat exposure
    • Forms a tough char with less than 0.1 mm/s penetration
    • Supports brush, roll, trowel, or molded application methods
  • MOLYKOTE D-321R AN-FR

    MOLYKOTE D-321R AN-FR

    • Room-Temperature Application Cure
    • Dry Film Lubricant Formulation
    • 180 to 450 deg C Service Range
  • MOLYKOTE EM-D110 GREASE

    MOLYKOTE EM-D110 GREASE

    • Compatible with Most Plastics
    • High-Viscosity PAO Oil
    • Silicone-Free Lubrication Formulation
  • MOLYKOTE G-2008 Synthetic Tool Gear Grease

    MOLYKOTE G-2008 Synthetic Tool Gear Grease

    • Fully Synthetic PAO-Based Grease with Lithium Thickener
    • Manual or Automated Dispensing
    • Sub-0.55 mm Four-Ball Wear
  • MOLYKOTE G-68 Plastic Gear Grease

    MOLYKOTE G-68 Plastic Gear Grease

    • Good Compatibility with Most Plastics
    • 0.014 Coefficient of Friction
    • Water-Resistant Grease Lubrication
  • MOLYKOTE G-N METAL ASSEMBLY PASTE

    MOLYKOTE G-N METAL ASSEMBLY PASTE

    • Heavy-Duty Assembly Paste
    • 0.08 Coefficient of Friction
    • Metal Interfaces Protection
  • MOLYKOTE HI-VAC SILICONE BASED HIGH VACUUM GREASE

    MOLYKOTE HI-VAC SILICONE BASED HIGH VACUUM GREASE

    • Low-Volatility Silicone Grease
    • Less Than 0.5% Bleed
    • Seals and Lubricates Vacuum and Pressure Systems
  • LAIRD ECCOSHIELD VY

    LAIRD ECCOSHIELD VY

    • Non-Hardening Conductive RF-Seam Compound
    • 0.001 ohm-cm Volume Resistivity
    • 40 to 288 deg C Service Range
  • ITW PLEXUS MA422

    ITW PLEXUS MA422

    • 10:1 Controlled Mixing
    • 17 to 20-Minute Working Window
    • 0.75 to 9.5 mm Gap Range
  • ITW PLEXUS MA832

    ITW PLEXUS MA832

    • 10:1 Controlled Mixing
    • 12 to 14-Minute Working Window
    • Glass-Bead Bondline Control
  • DowSil 3-6077 RTV Silicone Ablative

    DowSil 3-6077 RTV Silicone Ablative

    • 0.035 mm/s Ablation Penetration Rate
    • 2 to 3-Hour Working Window
    • Spray or Trowel Application
  • BONDRITE C-AK MIL-ETCH

    BONDRITE C-AK MIL-ETCH

    • Fine Satin or Frosted Etch on Aluminum
    • Low-Foam Alkaline Formulation
    • Scale- and Sludge-Reducing Sequestering Chemistry
  • COOLTHERM EP 6972 KIT

    COOLTHERM EP 6972 KIT

    • <0.0005 ohm-cm Volume Resistivity
    • 2.13 W/(m K) Thermal Conductivity
    • 1:1 Weight Mixing
  • FREKOTE 44-NC

    FREKOTE 44NC

    • Multi-Cycle Mold Release
    • Reduced Mold-Surface Contamination Risk
    • Non-Silicone Downstream-Compatible Formulation
  • FREKOTE RC321

    FREKOTE RC-321

    • Consistent Multi-Cycle Mold Release
    • Reduced Resin Adhesion to Mold Surfaces
    • Semi-Permanent Low-Residue Coating
  • ALPHA HITECH CU11-3127

    ALPHA HITECH CU11-3127

    • One-Component Capillary Underfill
    • 177 deg C Glass Transition
    • 20-Minute 140 deg C Cure
  • Dow XIAMETER PMX 200

    Dow XIAMETER PMX 200

    • 1,000 cSt Polydimethylsiloxane Fluid
    • Surface Tension of 21.2 dynes/cm
    • Dielectric Strength of 400 volts/mil
  • P/S 870® Class B Corrosion Inhibitive Sealant

    PS 870® Class B Corrosion Inhibitive Sealant

    • Corrosion-Resistant Joint Sealing
    • Long-Term Harsh-Environment Durability
    • Multi-Substrate Aerospace Sealing
  • Loctite FREKOTE R-110 55 GAL

    Loctite FREKOTE R-110

    • Multi-Cycle Mold Release
    • Reduced Resin Adhesion to Molds
    • Semi-Permanent Low-Residue Coating
  • ALPHA LONCO RF-800 FLUX GALLON YELLOW

    ALPHA LONCO RF-800 FLUX

    • Highly Active Low-Solids No-Clean Flux
    • Low Non-Tacky Residue
    • IPC J-STD-004 ROL0 Classification
  • KESTER TSF-8808

    KESTER TSF-8808

    • DI-Water-Cleanable Post-Reflow Residues
    • Multi-Alloy Air-or-Nitrogen Reflow
    • ORH0 Low-Volatility Soldering Flux
  • PERMABOND 105

    PERMABOND 105

    • 5 to 20-Second Fixture Time
    • Low-Viscosity Single-Component Adhesive
    • Hard-to-Bond Plastic and Rubber Bonding
  • PERMABOND 2011

    PERMABOND 2011

    • Thixotropic Application Control
    • 5 to 10-Second Fixturing Time
    • One-Part Moisture-Cure Adhesive
  • LAIRD TPUTTY 607

    LAIRD TPUTTY 607

    • 6.4 W/(m K) Thermal Interface
    • No-Mix Thermal Interface Processing
    • Automation-Oriented Dispensing and Vertical Stability
  • Teroson AL 6302 Heat Curing Sealant

    Teroson AL 6302 Heat Curing Sealant

  • 3M 1099

    3M 1099

    • Medium-Viscosity Application Control
    • Long-Term Durability by Resisting Weathering
    • Adhesion-Promoting Surface Treatment
  • 3M 1357

    3M 1357

    • High Initial Contact Strength
    • High Heat Resistance
    • Up to 30-Minute Bonding Window
  • 3M 30NF

    3M 30NF

    • Water-Dispersed Contact Adhesive
    • Heat-Resistant Laminate Bonding
    • Greenguard-Certified Wood and Laminate Bonding
  • 3M 427

    3M 427

    • Dead-Soft Aluminum Foil Backing
    • Moisture-Barrier Tape Applications
    • -54 to 149 deg C Temperature Resistance
  • 3M 467 MP

    3M 467 MP

    • 0.06 mm Thin Adhesive Construction
    • Peel and Shear on High-Energy Surfaces
    • Up to 204 deg C Short-Term Exposure
  • 3M 4926

    3M 4926

    • Conformable 0.4 mm Acrylic Foam
    • Multi-Purpose Acrylic Adhesive
    • 620 Kpa Overlap Shear Strength
  • 3M 550FC

    3M 550FC

    • One-Component Fast Moisture Cure
    • High Tensile Strength and Modulus
    • Water and Salt-Spray Resistance
  • 3M 76

    3M 76

    • High-Tack Industrial Formulation Excels in One-Surface Bonding
    • Polyethylene and Polypropylene Bonding
    • Controlled Variable Lace Spray Pattern
  • 3M 8417

    3M 8417

    • Transparent Self-Wound Polyester Film
    • Edge-Tear-Resistant Film Backing
    • -40 to 93 deg C Exposure Range
  • 3M 853

    3M 853

    • 0.06 mm Thin Tape Construction
    • Solvent-Resistant Tape Adhesive
    • Transparent Label-Protection Tape
  • 3M 950

    3M 950

    • 5 mil Adhesive 300 Construction
    • High Initial Adhesion and Holding
    • Multi-Substrate Pressure-Sensitive Bonding
  • 3M 966

    3M 966

    • Up to 232 deg C Short-Term Exposure
    • 10,000-Minute Static Shear
    • Metal and High-Energy-Plastic Bonding
  • 3M CA40H

    3M CA40H

    • Higher-Viscosity Controlled Dispensing
    • EPDM, Vinyl, and Aluminum Bonding
    • Alignment-Friendly Slower Set Time
  • 3M DP604NS

    3M DP604NS

    • 4-Minute Open Time
    • 1:1 Meter-Mix Processing
    • 51 to 121 deg C Service Range
  • 3M DP620NS

    3M DP620NS

    • 20-Minute Open Time
    • 1:1 Meter-Mix Processing
    • 19.9 MPa Aluminum Lap Shear
  • 3M DP640

    3M DP640

    • 40-Minute Working Window
    • Thixotropic Non-Sag Placement
    • 2,160 lb/in^2 Aluminum Overlap Shear
  • LOCTITE ABLESTIK 104

    LOCTITE ABLESTIK 104

    • Up to 230 deg C Service
    • Long Working Time
    • High Tensile Lap Shear Strength
  • LOCTITE ABLESTIK 16-1

    LOCTITE ABLESTIK 16-1

    • Electrically conductive
    • Room temperature or heat cure
    • Good adhesion
  • LOCTITE ABLESTIK 2101

    LOCTITE ABLESTIK 2101

    • 23 N/mm^2 Aluminum Lap Shear
    • High-Resistivity Electrical Insulation
    • Fuel, Oil, and Acid Resistance
  • LOCTITE ABLESTIK 2106T

    LOCTITE ABLESTIK 2106T

    • Shore D 72 within 60 Minutes
    • 410 V/mil Dielectric Strength
    • Metal-to-Masonry Multi-Substrate Bonding
  • LOCTITE ABLESTIK 2112

    LOCTITE ABLESTIK 2112

    • Critical Electronics/Aerospace Bonding
    • Non-Sag PCB Component Staking
    • Electrical Insulation and Environmental Resistance
  • LOCTITE ABLESTIK 2113

    LOCTITE ABLESTIK 2113

    • Low-Viscosity Optical Bonding
    • Fine-Detail Flow and Wetting
    • Electrically Insulating Cured Adhesive
  • LOCTITE ABLESTIK 2114

    LOCTITE ABLESTIK 2114

    • Optically Clear Bonding
    • 50 N/mm^2 Cured Tensile Strength
    • Broad Metal/Glass/Ceramic/Plastic Compatibility
  • ABLESTIK 2115

    ABLESTIK 2115

    • Shock- and Temperature-Cycling Resistance
    • Low-Viscosity Precision Optic Bonding
    • 60-Watt Laser-Energy Resistance
  • ABLESTIK 2135D

    ABLESTIK 2135D

    • Tough, Durable Epoxy for Bonding, Laminating, Sealing
    • 1,200 mPa s Mixed Viscosity
    • 2.7 x 10^13 ohm-cm Volume Resistivity
  • ABLESTIK 2143D

    ABLESTIK 2143D

    • Medium-Viscosity Application Control
    • 1 x 10^14 ohm-cm Volume Resistivity
    • Room-Temperature Adhesive Cure
  • ABLESTIK 2156

    ABLESTIK 2156

    • 0.84 W/(m K) Thermal Conductivity
    • Heat-Sensitive Component Staking
    • -70 to 100 deg C Operating Range
  • ABLESTIK 2158

    ABLESTIK 2158

    • Electrically Insulating Staking Epoxy
    • Flexible Mismatched-Adherend Bonding
    • 2 x 10^15 ohm-cm Volume Resistivity
  • ABLESTIK 2248

    ABLESTIK 2248

    • Thixotropic Application Control
    • 14.8 kV/mm Dielectric Strength
    • 1-Hour Working Window
  • ABLESTIK 2332-17U

    ABLESTIK 2332-17U

    • Solvent-Free Bonding Formulation
    • 90-Minute 100 deg C Cure
    • 24 N/mm^2 Aluminum Lap Shear
  • ABLESTIK 24

    ABLESTIK 24

    • Water-Clear Thin-Bondline Adhesive
    • 30-Minute Pot Life
    • Flexible Cured Adhesive
  • ABLESTIK 286

    ABLESTIK 286

    • 1.04 W/(m K) Thermal Interface
    • 30-Minute Working Window
    • Room-Temperature Thermal Interface Cure
  • ABLESTIK 2907

    ABLESTIK 2907

    • Electrically Conductive Bonding
    • Room-Temperature Adhesive Cure
    • Glass-to-Plastic Epoxy Bonding
  • ABLESTIK 293-1

    ABLESTIK 293-1

    • Difficult-Substrate General Assembly Bonding
    • 37.9 N/mm^2 Aluminum Lap Shear
    • 3.20 x 10^14 ohm-cm Volume Resistivity
  • ABLESTIK 293-21

    ABLESTIK 293-21

    • Strong Bonding to Difficult Metallic Substrates
    • 90-Minute 75 deg C Cure
    • 1.0 x 10^13 ohm-cm Volume Resistivity
  • ABLESTIK 2958

    ABLESTIK 2958

    • Electrically Conductive Bonding
    • 40,000 mPa s Mixed Viscosity
    • 15-Minute 100 deg C Cure
  • ABLESTIK 369-3

    ABLESTIK 369-3

    • 0.0005 ohm-cm Volume Resistivity
    • 4-Hour 74 deg C Cure
    • Two-Hour Working Window
  • ABLESTIK 506

    ABLESTIK 506

    • Flexible Cured Adhesive
    • 0.9 W/(m K) Thermal Conductivity
    • Reworkable Bonding Material
  • ABLESTIK 550

    ABLESTIK 550

    • Film-Format Bonding for Difficult Surfaces
    • 30-Minute 150 deg C Cure
    • 39 N/mm^2 Aluminum Lap Shear
  • ABLESTIK 568

    ABLESTIK 568

    • 2.5 x 10^14 ohm-cm Volume Resistivity
    • 2-Hour 95 deg C Cure
    • 3 mil Glass-Fabric-Supported Film
  • ABLESTIK 59C

    ABLESTIK 59C

    • 7 W/(m K) Thermal Conductivity
    • 55 to 260 deg C Service Range
    • Reworkable Bonding Material
  • ABLESTIK 60L

    ABLESTIK 60L

    • 50 ohm-cm Volume Resistivity
    • 30-Minute 25 deg C Cure
    • 55 to 130 deg C Service Range
  • ABLESTIK 77-1S

    ABLESTIK 77-1S

    • One-Component, Solvent-Free Epoxy for Attaching Surface-Mounted Devices
    • Smooth Non-Tailing Non-Sag Consistency
    • 91-Day Working Window
  • ABLESTIK 77-2LTC

    ABLESTIK 77-2LTC

    • One-Component, Solvent-Free Epoxy for Attaching Surface-Mount Devices
    • Smooth Non-Tailing Non-Sag Consistency
    • 2.5 x 10^14 ohm-cm Volume Resistivity
  • ABLESTIK 816H01

    ABLESTIK 816H01

    • 2.0 W/(m K) Thermal Interface
    • Three-Hour Working Window
    • Room-Temperature Thermal Interface Cure
  • ABLESTIK 8380

    ABLESTIK 8380

    • Reduced Tailing and Stringing in Smart-Card Assembly
    • 1-Minute 150 deg C Cure
    • 0.0005 ohm-cm Volume Resistivity
  • ABLESTIK 83CJ

    ABLESTIK 83CJ

    • 0.0004 ohm-cm Volume Resistivity
    • 45-Minute Working Window
    • Cold-Solder-Type Electrical Connections
  • ABLESTIK 84-1LMINB

    ABLESTIK 84-1LMINB

    • 0.0001 ohm-cm Volume Resistivity
    • Screen-Printable Epoxy Bonding
    • 30-Minute Working Window
  • ABLESTIK 85-1

    ABLESTIK 85-1

    • Gold-Filled Conductive Die-Attach Adhesive
    • 49 N/mm^2 Shear Strength
    • 1-Hour 150 deg C Cure
  • ABLESTIK 967-3

    ABLESTIK 967-3

    • 2 x 10^13 ohm-cm Volume Resistivity
    • 6-Hour 65 deg C Cure
    • 1:1 Meter-Mix Processing
  • ABLESTIK 976-1

    ABLESTIK 976-1

    • Electrically Conductive Thermal Interface
    • 2.1 W/(m K) Thermal Interface
    • 1:1 Meter-Mix Processing
  • ABLESTIK CF3366

    ABLESTIK CF3366

    • 0.0003 ohm-cm Volume Resistivity
    • 5.17 N/mm^2 Aluminum Lap Shear
    • Flexible Cured Adhesive
  • ABLESTIK CT5047-2

    ABLESTIK CT5047-2

    • Conductive Bonding for Temperature-Sensitive Electrical Connections
    • 24-Hour 25 deg C Cure
    • 2-Hour Working Window
  • ABLESTIK ECF 550

    ABLESTIK ECF 550

    • Conductive Grounding and RF-Shielding Film
    • Controlled Film Processing with Flexible Supply Formats
    • 20 N/mm^2 Lap Shear
  • ABLESTIK ECF561E-1

    ABLESTIK ECF 561E

    • Electrically Conductive Bonding
    • Flexible Cured Adhesive
    • 1.6 W/(m K) Thermal Conductivity
  • ABLESTIK ECF 568

    ABLESTIK ECF 568

    • Electrically Conductive Application
    • 2-Hour 95 deg C Cure
    • Sheet Stock or Die-Cut Preforms
  • ABLESTIK G909

    ABLESTIK G 909

    • High-Strength Structural Bonding
    • Thixotropic Non-Sag Placement
    • 90-Minute 100 deg C Cure
  • ABLESTIK KE 4238

    ABLESTIK KE 4238

    • Conductive Bonding for Heat-Sensitive Assemblies
    • 21 W/(m K) Thermal Conductivity
    • 2-Hour 60 deg C Cure
  • ABLESTIK KS 0004

    ABLESTIK KS 0004

    • 0.01 ohm-cm Volume Resistivity
    • 2-Hour 60 deg C Cure
    • Conductive Bonding and Encapsulation Utility
  • ABLESTIK KS 4008

    ABLESTIK KS 4008

    • 0.01 ohm-cm Conductive Bonding
    • Aircraft Static-Discharger Bonding
    • Room-Temperature or Heat Cure
  • AEROWAX HT

    AEROWAX HT

    • 82 to 88 deg C Melting Range
    • Chemical-Resistant Selective-Plating Maskant
    • UV-Detectable BIOACT-Removable Coating
  • ARALDITE 2021-1

    ARALDITE 2021-1

    • Rapid 9-Minute Strength Development
    • Broad Multi-Material Bonding
    • 27 MPa Aluminum Lap Shear
  • ARALDITE AY 8683

    ARALDITE AY 8683

    • Fast-Setting Polyurethane for Filter Bonding
    • 15-Minute Working Window
    • 475% Elongation with 100 Pli Peel
  • AXAREL 1000

    AXAREL 1000

    • MIL-PRF-680 Type I Approved Cleaner
    • 60 ppm Nonvolatile Residue
    • Multi-Soil Manual/Immersion Cleaning
  • AXAREL 2000

    AXAREL 2000

    • MIL-PRF-680 Type II Approval
    • Hand-Wipe, Immersion, or Vacuum Cleaning
    • Low-Odor Low-Residue Soil Removal
  • AXAREL 2200

    AXAREL 2200

    • Solder/Adhesive/Flux Residue Removal
    • Fast-Drying Low-Residue Cleaning
    • IPA-Replacement Electronics Cleaning
  • AXAREL 3000

    AXAREL 3000

    • High-Solvency Multi-Soil Cleaning
    • Fast-Drying Low-Residue Precision Cleaning
    • Vapor-Degreasing or Immersion Cleaning
  • AXAREL 32

    AXAREL 32

    • Water-Rinsable pH-Neutral Electronics Cleaning
    • Ionic/Flux/Oil Contamination Removal
    • Ambient to 71 deg C Defluxing
  • AXAREL 6100

    AXAREL 6100

    • Broad Multi-Soil Solvency
    • Hand-Wipe or Immersion Cleaning
    • 142 deg F Flash Point
  • AXAREL 9100

    AXAREL 9100

    • 96 deg C Flash Point
    • Multi-Soil Cleaning Removal
    • Polymer/Elastomer and Multi-Metal Compatibility
  • BIOACT 105

    BIOACT 105

    • High-Solvency Aerospace Soil Removal
    • Manual-Wipe or Immersion Cleaning
    • AMS 3167 Aerospace Conformance
  • BIOACT 108

    BIOACT 108

    • Targeted Aerospace Soil Removal
    • Manual or Immersion Cleaning
    • Multiple Aerospace Process Approvals
  • BIOACT 200

    BIOACT 200

    • Semi-Aqueous Ink/Paint/Resin Removal
    • 94 deg C High Flash Point
    • Immersion/Ultrasonic/Spray System Cleaning
  • BIOACT 280

    BIOACT 280

    • High-Melting Wax Removal
    • 88 to 96 deg C Immersion Cleaning
    • Aerospace Process Acceptance
  • BIOACT 280E

    BIOACT 280E

    • High-Melting Wax Removal
    • Multi-Polymer Cleaning Compatibility
    • Low-Odor Low-Volatility Cleaning
  • BIOACT EC-78

    BIOACT EC-78

    • RMA/No-Clean/Lead-Free Flux Removal
    • Low-Foaming Electronics Cleaning
    • Saponifier and Corrosion-Inhibitor Formulation
  • BIOACT EC-7M

    BIOACT EC-7M

    • USDA-Certified Cleaning Product
    • Solder-Flux, Paste, Oil, and Grease Removal
    • Reduced Solvent Loss
  • BIOACT EC-7R

    BIOACT EC-7R

    • 99% USDA-Certified Biobased Cleaner
    • Broad Electronics Residue Removal
    • Water-Rinsable Ambient Processing
  • BIOACT EC-88

    BIOACT EC-88

    • Broad Inline Defluxing
    • Non-Foaming High-Loading Wash Bath
    • 10 to 25% Aqueous Concentration
  • BIOACT SC-10E

    BIOACT SC-10E

    • Multi-Soil Electronics Cleaning
    • Fast-Evaporating No-Rinse Cleaning
    • Manual, Batch, or Immersion Cleaning
  • BIOACT SC-22

    BIOACT SC-22

    • Rinse-Free Immersion or Ultrasonic Cleaning
    • 62 deg C Flash Point
    • 0.5 mmHg Vapor Pressure
  • BONDERITE C-AD 4215

    BONDERITE C-AD 4215

  • BONDERITE C-AK 298

    BONDERITE C-AK 298

    • Non-Silicated Aluminum Immersion Cleaner
    • Multi-Soil Removal and Free Rinsing
    • 54 to 82 deg C Immersion Cleaning
  • BONDERITE C-AK 4215 NC-LT

    BONDERITE C-AK 4215 NC-LT

    • Low-Temperature Multi-Metal Cleaning
    • Fuel/Hydraulic Component Cleaning
    • Chromate-Free Low-Foam Noncorrosive Formulation
  • BONDERITE C-AK 4316

    BONDERITE C-AK 4316

    • Heat-Scale Conditioning for Multiple Alloys
    • Lower-Temperature Molten-Salt Bath Processing
    • Nonflammable Titration-Controlled Bath Maintenance
  • BONDERITE C-AK 4338LP1

    BONDERITE C-AK 4338LP1

    • Two-Part Alkaline-Permanganate System Component
    • Jet-Engine Heat-Scale Conditioning
    • Liquid-Concentrate Bath Make-Up
  • BONDERITE C-AK 4338LP2

    BONDERITE C-AK 4338LP2

    • High-Temperature Oxide-Scale Conditioning
    • Equal-Volume Two-Liquid Mixing
    • 15 to 25% Component Concentration
  • BONDERITE C-AK 5948-DPM

    BONDERITE C-AK 5948-DPM

    • Painted/Unpainted Aircraft Cleaning
    • Nonstaining Free-Rinsing Aluminum Cleaning
    • Phosphate/Chromate-Free Immersion/Ultrasonic Cleaning
  • BONDERITE C-AK 5948-R

    BONDERITE C-AK 5948-R

  • BONDERITE C-AK 909

    BONDERITE C-AK 909

    • Heavy-Soil Multi-Metal Degreasing
    • Immersion or Ultrasonic Cleaning
    • Caustic-Soda-Free Chelating Formulation
  • BONDERITE C-AK ALTREX

    BONDERITE C-AK ALTREX

    • Inhibited Non-Etching Aluminum Cleaning
    • BAC-5749 Medium-Duty Soak Qualification
    • Buffered Hard-Water Bath Control
  • BONDERITE C-AK ALUM

    BONDERITE C-AK ALUM

    • Removal of Light Soils with Immersion Etching
    • Promotes Uniform Wetting Through Low Surface Tension
    • 40 to 80 deg C Service Range
  • BONDERITE C-AK EC-202L

    BONDERITE C-AK EC

    • Multi-Soil Phosphate-Line Equipment Cleaning
    • Spray, Immersion, or Recirculation Cleaning
    • Two-Step Descaling Bath Control
  • BONDERITE C-AK ETCH

    BONDERITE C-AK ETCH 9HL

    • High-Copper Aluminum Chem-Mill Processing
    • Controlled Immersion Chemical Milling
    • Improved Line Definition and Etch Uniformity
  • BONDERITE C-AK LS

    BONDERITE C-AK LS

    • Rolling-Oil Steel-Strip Cleaning
    • Dip, Spray, or Electrolytic Cleaning
    • Oil-Separating Emulsion Behavior
  • BONDERITE C-AK MIL-ETCH

    BONDERITE C-AK MIL-ETCH

    • Uniform Fine Satin or Frosted Etch
    • Low-Foam Low-Mist Alkaline Etching
    • BAC 5786 Operating Conditions
  • BONDERITE C-AK VITKL

    BONDERITE C-AK VITKL

    • Ferrous/Titanium Tenacious-Soil Removal
    • Boeing BAC 5749 Compliance
    • Low-Foaming Quick-Rinse Bath Control
  • BONDERITE C-IC 2310

    BONDERITE C-IC 2310

    • Chromium-Free Aluminum Deoxidizing Cleaner
    • No-Heat Immersion/Spray Cleaning
    • MIL-W-6858C Deoxidizing Compliance
  • BONDERITE C-IC 33

    BONDERITE C-IC 33

    • Non-Flammable Bonding Formulation
    • Brush, Spray, or Immersion Application
    • Adhesion-Promoting Surface Treatment
  • BONDERITE C-IC 4409

    BONDERITE C-IC 4409

    • Ferrous/Nonferrous Alloy Cleaning and Deoxidizing
    • Hand-Wipe, Immersion, or Spray Processing
    • Water/Steam-Rinsable Rust Removal
  • BONDERITE C-IC 457

    BONDERITE C-IC 457

    • Heavy-Oxidation Aluminum/Magnesium Deoxidizing
    • Non-Flammable Phosphate-Free Formulation
    • Pre-Paint Surface Conditioning
  • BONDERITE C-IC 79

    BONDERITE C-IC 79

    • Phosphoric-Acid Oxidation/Corrosion Cleaner
    • Brush, Immersion, or Spray Application
    • Pre-Paint/Conversion-Coating Surface Preparation
  • BONDERITE C-IC ALDOX

    BONDERITE C-IC ALDOX

    • Chromate-Free Aluminum Deoxidizing and Desmutting
    • Boeing BAC 5765 Qualification
    • Ambient Spray or Immersion Processing
  • BONDERITE C-IC SMUTGO

    BONDERITE C-IC SMUTGO

    • Chromate-Free Acid Cleaner
    • Ambient Immersion or Spray Processing
    • Low Electrical Surface Resistance
  • BONDERITE C-SO 2382

    BONDERITE C-SO 2382

    • Aerospace NESHAP/AQMD Solvent Compliance
    • Fast-Evaporating Residue-Free Surface Prep
    • Noncorrosive Ferrous/Nonferrous Metal Cleaning
  • BONDERITE L-FG LS2127

    BONDERITE L-FG LS 2127

    • Up to 1649 deg C Service
    • Anti-Stick Non-Ferrous Tooling Coating
    • Brush, Spray, or Dip Application
  • BONDERITE L-FM PRETREAT

    BONDERITE L-FM PRETREAT

    • Heat-Treatment Scale Inhibition
    • Lubricating Protective Forming Coating
    • Fast-Drying Post-Treatment Descaling Aid
  • BONDERITE L-GP 460

    BONDERITE L-GP 460

    • High-Purity Graphite Anti-Seize Lubricant
    • High-Load Extreme-Pressure Lubrication
    • Up to 538 deg C Service
  • BONDERITE M-CR 1001

    BONDERITE M-CR 1001

    • Clear Aluminum Chromate Conversion Coating
    • Paint-Adhesion and Corrosion-Resistance Improvement
    • Spray or Immersion Application
  • BONDERITE M-ED 1000

    BONDERITE M-ED 1000

    • Nickel Acetate-Based Sealing Process
    • Reduced Smut, Powdering, and Yellowing
    • Commercial and Selected Military Anodizing Seal Processes
  • BONDERITE M-FE 101

    BONDERITE M-FE 101

    • One-Step Steel Cleaning and Phosphating
    • Improved Paint Adhesion, Coating Durability, and Corrosion Resistance
    • Steam Gun and High-Pressure Manual Applications
  • BONDERITE M-FE HMF-1080

    BONDERITE M-FE HMF-1080

    • Heavy-Metal-Free Multi-Metal Clean/Phosphate Process
    • Improved Paint Adhesion and Corrosion Resistance
    • Multi-Metal Spray-Tunnel Pretreatment
  • BONDERITE M-MN LUBRITE 2

    BONDERITE M-MN LUBRITE 2

    • Oil-Absorptive Phosphate Lubricating Coating
    • Rapid Break-In and Reduced Scuffing
    • Corrosion-Resistant Oil-Finishing Surface
  • BONDERITE S-FN 309

    BONDERITE S-FN 309

    • Fast-Drying PTFE Dry-Film Lubrication
    • Wood/Metal/Rubber/Plastic/Glass Surface Adhesion
    • Spray/Brush/Dip/Roller Application Methods
  • BONDERITE S-FN 310A

    BONDERITE S-FN 310A

    • PTFE Dry-Film Low-Friction Release
    • Longer Wear Life than Pure PTFE
    • 149 deg C Low-Temperature Cure
  • BONDERITE S-FN 330

    BONDERITE S-FN 330

    • Low-Friction Stick-Slip-Resistant Coating
    • 500-Hour Salt-Spray/Humidity Resistance
    • Up to 150 deg C Service
  • BONDERITE S-FN 333

    BONDERITE S-FN 333

  • BONDERITE S-FN GP 1904

    BONDERITE S-FN GP 1904

    • PTFE/Graphite Dry-Film Lubricant
    • Corrosion and Solvent Resistance
    • Multi-Substrate Dry Lubrication
  • BONDERITE S-OT 310B

    BONDERITE S-OT 310B

    • PTFE Dry-Film Low-Friction Lubrication
    • Oil, Solvent, and Chemical Resistance
    • Metal and Rubber Coating Process
  • BONDERITE S-ST 5351

    BONDERITE S-ST 5351

    • Ambient-Temperature Aerospace Coating Removal
    • Viscous Vertical-Surface Stripping
    • MIL-R-81294 Aerospace Approval
  • BONDERITE S-ST 5668

    BONDERITE S-ST 5668

    • Aircraft Polyurethane/Epoxy Coating Removal
    • Phenol-, Chromate-, Solvent-, and Acid-Free Formulation
    • MIL-R-83936B Specification Compliance
  • BOSTIK 1100 FS

    BOSTIK 1100 FS

    • 90-Minute Tack-Free Time
    • Plastic-to-Wood Urethane Bonding
    • +/-25% Joint Movement Capability and Temperature Resistance
  • BOSTIK 70-01A

    BOSTIK 70-01A

    • Permanently Elastic SMP Sealant with Temperature Resistance
    • Primerless Glass-to-Metal Bonding
    • Solvent-, Isocyanate-, and PVC-Free Formulation
  • BOSTIK 70-03A

    BOSTIK 70-03A

    • 2.5 MPa Lap Shear
    • Primerless Multi-Substrate Adhesion
    • Up to 120 deg C Service
  • BOSTIK 70-05A

    BOSTIK 70-05A

    • High-Strength Structural SMP Bonding
    • Primerless Multi-Substrate Adhesion
    • UV and Weather Resistance
  • BOSTIK 70-08A

    BOSTIK 70-08A

    • High-Green-Strength SMP Adhesive
    • Primerless Glass Bonding
    • Solvent-, Isocyanate-, and PVC-Free Formulation
  • BOSTIK 920

    BOSTIK 920

    • Flexible Cured Adhesive
    • Above- and Below-the-Waterline Sealing and Bonding
    • Plastic, Wood, and FRP Bonding
  • BOSTIK 940FS

    BOSTIK 940FS

    • 10-Minute Cure Cycle
    • Adhesion and Mechanical Performance of Polyurethane
    • Primerless Glass-to-Aluminum Bonding
  • BOSTIK BOSCODUR

    BOSTIK BOSCODUR

    • Solvent-Resistant Urethane Bonding
    • Effective Cross-Linker for Nitrile
    • 4 to 6-Hour Working Window
  • BOSTIK ISR70-03A

    BOSTIK ISR70-03A

    • Primerless Elastic Silyl-Modified-Polymer Bonding
    • Solvent-, Isocyanate-, and PVC-Free Formulation
    • Transportation and Industrial Assembly Bonding
  • BOSTIK L1096MR

    BOSTIK L1096MR

    • One- or Two-Component Contact Adhesive
    • Fast Tack and Heat Resistance
    • Multi-Substrate Brush/Knife/Roll-Coat Application
  • BOSTIK L4045

    BOSTIK L4045

    • Fast-Drying One-Part Nitrile Adhesive
    • Non-Staining Bonding Formulation
    • Flexible Cured Adhesive
  • BOSTIK L4145

    BOSTIK L4145

    • One-Part No-Curative Nitrile Adhesive
    • Oil, Water, and Plasticizer Resistance
    • BMS 5-30/BAC5010 Qualification
  • BOSTIK L7132K

    BOSTIK L7132K

    • Two-Part High-Green-Strength Laminating
    • Heat- and Creep-Resistant Bonding
    • BMS 5-127G Aerospace Qualification
  • BOSTIK L7132R

    BOSTIK L7132R

    • Two-Component High-Green-Strength Laminating
    • Heat- and Creep-Resistant Bonding
    • Wide Vacuum-Form Processing Window
  • BOSTIK LADH1531AC

    BOSTIK LADH1531AC

    • Sprayable neoprene contact adhesive
    • Excellent green strength
    • High water, oil & heat resistance
  • BOSTIK STR350A

    BOSTIK STR350A

    • Elastic Adhesive/Sealant Performance
    • -40 to 121 deg C Service
    • Primerless Multi-Substrate Adhesion
  • CLEANSAFE 50E

    CLEANSAFE 50E

    • 10% Aqueous Precision Cleaning
    • Multi-Metal Cleaning and Brightening
    • Above 101 deg C Flash Point
  • CLEANSAFE 787C

    CLEANSAFE 787C

    • Low-Foaming Lubrication Formulation
    • Multi-Soil Cleaning Removal
    • Ferrous and Non-Ferrous Alloys
  • CONAP DS-1831A
    No longer available

    CONAP DS-1831A

    • 15% Red Pigment Concentrate
    • Epoxy and Polyurethane System Compatibility
    • Filled and Unfilled Formulation Guidance
  • CONATHANE MR-5002

    CONATHANE MR-5002

    • Low-Viscosity Silicone Mold Release
    • Epoxy/Polyurethane/Polyester/Plastic Resin Release
    • 10 to 15-Minute Air Dry
  • CONATHANE MR-5012

    CONATHANE MR-5012

    • Low-Viscosity Silicone Mold Release
    • Epoxy/Polyurethane/Polyester Mold Compatibility
    • Wipe, Brush, or Spray Application
  • CONAP S-1

    CONAP S-1

    • AD-1146/AD-1147 Primer-Reducing Solvent
    • Brush, Dip, or Spray Application
    • 7 deg C Flash Point
  • CONAP S-13

    CONAP S-13

    • CE-1170 Conformal-Coating Reducing Solvent
    • Viscosity Adjustment and Cleanup
    • 27 deg C Flash Point
  • CONATHANE S-8

    CONATHANE S-8

    • CONATHANE Conformal-Coating Reducing Solvent
    • Dip and Spray Viscosity Adjustment
    • Evaporative-Loss Makeup and Process Cleanup
  • COOLTHERM 6053

    COOLTHERM 6053

    • Flexible Cured Material
    • Heat & Oxidation Resistance
    • Supplied in a 16-Ounce Aerosol Format
  • COOLTHERM 6250

    COOLTHERM 6250

    • 350 cP Low-Viscosity Curing Agent
    • High-Solids Adhesive/Encapsulation Curing Agent
    • Chemical-Resistant Cured Epoxy Systems
  • COOLTHERM 6732

    COOLTHERM 6732

    • Hardener Component Thermal Interface Material
    • 100:0.5 Controlled Mixing
    • Thermally Conductive Thermal Interface
  • COOLTHERM 6733

    COOLTHERM 6733

    • Solvent-Free RTV Silicone Encapsulation
    • Low-Stress No-Exotherm Room-Temperature Cure
    • -60 to 205 deg C Continuous Service
  • COOLTHERM EP-6010

    COOLTHERM EP-6010

    • 55 cP Application Viscosity
    • Low-Shrinkage Epoxy Curing Agent
    • Two-Year Shelf Life at 25 deg C
  • COOLTHERM MD-140

    COOLTHERM MD-140

    • 12 W/(m K) Thermal Conductivity
    • 72-Hour Working Window
    • Fast 120 to 180 deg C Cure
  • COOLTHERM PC10882

    COOLTHERM PC10882

    • Screen-Printable Coating Application
    • Thermal-Shock and Solvent-Resistant Cured Film
    • Above 500 V/mil Dielectric Strength
  • COOLTHERM SC-6730

    COOLTHERM SC-6730

    • Room-Temperature Thick-Section Cure
    • 3.0 to 10.0% Mix Concentration
    • Blue-Green Visual Mix Indicator
  • CYBERBOND 2241

    CYBERBOND 2241

    • Toughened Structural Bonding
    • Metal, Plastic, and Rubber Bonding
    • Up to 140 deg C Service
  • DEVCON FLEXANE 94

    DEVCON FLEXANE 94

    • 6,000 cP Castable Urethane
    • Replacement-Part and Flexible-Mold Fabrication
    • 19.3 MPa Cured Tensile Strength
  • DOWSIL 20

    DOWSIL 20

    • Heat-Stable Non-Carbonizing Parting Film
    • Solvent-Dilutable Release Formulation
    • Plastic/Adhesive/Elastomer Product Applications
  • DOWSIL 3-6548

    DOWSIL 3-6548

    • Fire-Resistant RTV Silicone Foam
    • 2x to 4x Liquid-Volume Expansion
    • Flexible Medium-Density Ozone/UV-Resistant Foam
  • DOWSIL 3-6559

    DOWSIL 3-6559

    • Adjustable 1 to 5 Wt% Addition Level
    • 4 to 12-Hour Cure Window
    • Surface/Environment Cure-Inhibition Management
  • DOWSIL 510

    DOWSIL 510

    • Available in Four Viscosities
    • High-Temperature Fluid Stability
    • Low-Volatility Process Fluid
  • DOWSIL 710

    DOWSIL 710

    • Up to 260 deg C Closed-System Service
    • Low-Volatility Oxidation-Resistant Fluid
    • High-Temperature Lubrication/Heat-Transfer Applications
  • DOWSIL DS-2025

    DOWSIL DS-2025

    • Cured Silicone Residue Removal
    • Up to 400 g/L Silicone Solubilization
    • Below 10 cP Low Viscosity
  • DOWSIL EC-6601

    DOWSIL EC-6601

    • 86 dB 1 kHz to 8.5 GHz Shielding
    • 2.7E-3 ohm-cm Volume Resistivity
    • One-Part Room-Temperature Moisture Cure
  • DOWSIL EG-4131

    DOWSIL EG-4131

    • Clear 1:1 Pdms Dielectric Gel
    • 650 cP Mixed Viscosity
    • 91.1% Transmission at 450 Nm
  • DOWSIL FS1265

    DOWSIL FS1265

    • 100% Active Fluorosilicone Foam Control
    • Chlorinated-Solvent-Insoluble Foam-Control Formulation
    • 300/1,000/10,000 mm^2/s Viscosity Grades
  • DOWSIL OS-125

    DOWSIL OS-125

    • Silicone-Contamination Cleaning Solvent Blend
    • Immersion, Spray, Rinse, or Wipe Cleaning
    • ppm-Level Residual Silicone
  • DOWSIL OS-20

    DOWSIL OS-20

    • Immersion, Spray, or Wipe Cleaning
    • Very-Low-Residue Complete Evaporation
    • 0 g/L US VOC-Exempt Solvent
  • DOWSIL Q2-1346

    DOWSIL Q2-1346

    • Low Sodium and Potassium Impurity Limits
    • Clear Liquid Supplied Free from Suspended Matter
    • Long 900-Day Shelf Life
  • DOWSIL RSN-0994

    DOWSIL RSN-0994

    • Heat-Resistant Electrical Varnish
    • At Least 49% Solids
    • AIEE Class 220 deg C Insulation
  • DOW XR-1541

    DOW XR-1541

    • E-Beam Patternable, Negative Tone
    • Etch Resistance Surface Treatment
    • High Purity Surface Treatment
  • DUROPTIX OE-6370

    DUROPTIX OE-6370

    • 1:1 Optical Encapsulant Mixing
    • 100% Transparent Optical Protection
    • 240-Minute 150 deg C Cure
  • DUROPTIX OE-6550

    DUROPTIX OE-6550

    • 1:1 Controlled Mixing
    • High Optical Transmittance
    • High Refractive Index
  • ECCOBOND F112

    ECCOBOND F112

    • Low-Viscosity Controlled Dispensing
    • Thermal-Shock and Impact Resistance
    • Low-Stress No-Pistoning Connections
  • ECCOBOND F123

    ECCOBOND F123

    • Fast Application Cure
    • Good Capillary Application
    • Thermal Shock Resistance
  • ECCOBOND F131

    ECCOBOND F131

    • Clear Fiber-Optic Assembly Epoxy
    • Room-Temperature or Accelerated Heat Cure
    • High-Tg Cured Epoxy
  • ECCOSORB AN-77

    ECCOSORB AN-77

    • Carbon Loaded, Multilayer Absorber
    • Broadband Free Space Absorber
    • Low-Weight RF Absorber
  • CONAP DS-1832

    CONAP DS-1832

    • Black Epoxy/Polyurethane Color Concentrate
    • 18% Heat-Stable Black Pigment
    • Filled/Unfilled Resin Addition Ranges
  • CONAP DS-1833

    CONAP DS-1833

    • Blue Epoxy/Polyurethane Color Concentrate
    • 50% Heat-Stable Blue Pigment
    • Filled/Unfilled Resin Addition Ranges
  • EPIBOND 1210

    EPIBOND 1210

    • Low-Outgassing Epoxy Bonding
    • 50 to 75-Minute Working Window
    • Flexible Cured Adhesive
  • FREKOTE 710-NC

    FREKOTE 710-NC

    • Reduced Cleaning Frequency
    • Thermally Stable Coating
    • Compatible with Multiple Epoxy Molding Compounds (EMCs)
  • FREKOTE 720-NC

    FREKOTE 720-NC

    • Colorless Low-VOC Mold Release
    • Solvent-Based Liquid Release Application
    • Industrial Mold-Release Processing
  • FREKOTE 770-NC

    FREKOTE 770-NC

    • High-Cycle Semiconductor Mold Release
    • Low-Residue Mold Release
    • Epoxy-Molding-Compound Temperature Compatibility
  • FREKOTE 800-NC

    FREKOTE 800-NC

    • Repeat-Cycle Mold Release
    • Low-Residue Mold Release
    • Semiconductor Epoxy-Molding Temperature Compatibility
  • FREKOTE 815-NC

    FREKOTE 815-NC

    • Durable, Consistent Mold Release for High-Cycle Applications
    • Precision Silicone Formulation Compatible with Semiconductor Molding
    • Improved Yield Mold Release
  • FREKOTE AC4368

    FREKOTE AC4368

    • Combined Mold Release and Conditioning
    • Multi-Resin Molding Compatibility
    • 5 to 10-Minute Solvent Evaporation
  • FREKOTE AQUALINE R-150

    FREKOTE R-150

    • Non-Flammable Mold Release Formulation
    • Natural/Synthetic Rubber Release and Slip
    • 60 to 200 deg C Mold Operation
  • FREKOTE B-15

    FREKOTE B-15

    • One-Part Polymeric Mold Sealing
    • 30-Minute Recoat Window
    • 24-Hour Full-Cure Sealing
  • FREKOTE EXITT-I

    FREKOTE EXITT-I

    • High-Gloss Molded-Part Finish Retention
    • Urethane-Elastomer Mold Release
    • Wipe, Brush, or Spray Application
  • FREKOTE FMS

    FREKOTE FMS

    • Composite-Mold Microporosity Sealing
    • High-Gloss Prepared Mold Surface
    • 20-Minute Final-Coat Cure at 20 deg C
  • FREKOTE FMS-100

    FREKOTE FMS-100

    • Room-Temperature Mold-Sealer Cure
    • Microporosity-Sealing Mold Preparation
    • High-Gloss Release-Ready Surface
  • FREKOTE HMT

    FREKOTE HMT

    • Hot-Mold Direct Application
    • Standalone or Touch-Up Release
    • Multiple Releases without Transfer Buildup
  • FREKOTE PMC

    FREKOTE PMC

    • Polyester-Mold Wax Removal
    • Multi-Soil Mold Cleaning
    • FREKOTE Sealer/Release Surface Preparation
  • FREKOTE R100

    FREKOTE R100

    • Multi-Cycle Mold Release
    • Reduced Resin Adhesion to Molds
    • Semi-Permanent Low-Residue Coating
  • FREKOTE R-120

    FREKOTE R-120

    • Semi-Permanent Rubber-Mold Release Coating
    • 4-Minute 150 deg C Cure
    • Multiple Releases with Low Transfer
  • FREKOTE R220

    FREKOTE R-220

    • High-Slip EPDM/Elastomer Release
    • 60 to 205 deg C Mold Operation
    • 4-Minute 149 deg C Cure
  • FREKOTE WOLO

    FREKOTE WOLO

    • Wipe Application Method
    • Mold Release and Sealing Capability
    • 15-Minute 20 deg C Cure
  • ARALDITE TDR 1100-11

    ARALDITE TDR 1100-11

    • Glass, Plastic, and Wood Bonding
    • 2:1 Meter-Mix Processing
    • 90-Minute Working Window
  • HARDENER HW 8680

    HARDENER HW 8680

    • 225% Cured Elongation
    • Polycarbonate, Nylon, and Primed-Metal Bonding
    • 1:1 Mix with 15-Minute Open Time
  • HARDENER HY 5049

    HARDENER HY 5049

    • High-Strength Structural Bonding
    • Documented Water/Ice/Tropical-Climate Resistance
    • Transparent Cured Bondline
  • HARDENER HY 8683

    HARDENER HY 8683

    • Fast-Setting Polyurea for Filter Bonding
    • 15-Minute Working Window
    • 475% Elongation with 100 Pli Peel
  • HUMISEAL 802

    HUMISEAL 802

    • UV40 Viscosity Adjustment
    • 2.78 Relative Evaporation Rate
    • 24-Month Shelf Life
  • INSULCURE 11B

    INSULCURE 11B

    • Heat-Curing INSULCAST Epoxy Curing Agent
    • 700 cP Application Viscosity
    • 3-Hour 100 deg C Cure
  • LAIRD GDS

    LAIRD ECCOSORB GDS

    • Thin Conformable Construction
    • High-Frequency RF Attenuation
  • LAIRD JCP-PP9

    LAIRD JCP-PP9

    • 60+ GHz Injection-Moldable Absorber
    • 76 to 81 GHz Automotive Radar Use
    • Polypropylene-Like Mechanical Integration
  • LAIRD LS-26

    LAIRD LS-26

    • High-Loss Microwave Absorption
    • Low-Density Urethane Foam
    • Very Flexible Absorber Foam
  • LAIRD MCS/SS6M

    LAIRD MCS/SS6M

    • 800 MHz to 6 GHz Absorption
    • Low-Outgassing Silicone Construction
    • Flexible Sheet with Optional PSA
  • LAIRD TPUTTY 502FG2

    LAIRD TPUTTY 502FG2

    • 3.0 W/(m K) Thermal Interface
    • Ultra-Soft 14 Shore 00 Material
    • Thermal Interface Material
  • LAIRD VY-81

    LAIRD VY-81

    • 80 to 90 dB EMI/RF Shielding
    • Non-Hardening High-Tack Shielding Compound
    • Conventional Caulking-Equipment Application
  • LENIUM ES

    LENIUM ES

    • Electronics Defluxing and Decontamination
    • Broad Multi-Soil Cleaning Range
    • Qualified Solvent-Replacement Scope
  • LENIUM FS

    LENIUM FS

    • Non-Flammable Vapor-Degreasing Cleaner
    • Multi-Soil Precision Cleaning
    • Multi-Material Cleaning Compatibility
  • LOCTITE 122S

    LOCTITE 122S

    • Thixotropic Application Control
    • Non-Staining Mold Release Formulation
    • Non-Flammable Mold Release Formulation
  • LOCTITE 190017

    LOCTITE 190017

    • Anaerobic Adhesive Technology
    • Above 100 deg C Flash Point
    • Clear Liquid Formulation
  • LOCTITE 2047

    LOCTITE 2047

    • One-Component Threadlocking System
    • Medium-Strength Thread Retention
    • Slow Cure Profile
  • LOCTITE 242

    LOCTITE 242

    • Medium-Strength Thread Retention
    • Vibration-Resistant Fastener Threadlocking
    • Thread Sealing Protection
  • LOCTITE 246

    LOCTITE 246

    • High-Strength Thread Retention
    • Vibration-Resistant Fastener Threadlocking
    • One-Component Threadlocking System
  • LOCTITE 262

    LOCTITE 262

    • One-Component Threadlocking System
    • High-Strength Thread Retention
    • Thixotropic Application Control
  • LOCTITE 263

    LOCTITE 263

    • High-Strength Thread Retention
    • Low-Viscosity Threadlocking Application
    • High-Temperature Thread Retention
  • LOCTITE 266

    LOCTITE 266

    • Oil-Tolerant Threadlocking Application
    • High-Strength Thread Retention
    • Thixotropic Application Control
  • LOCTITE 2701

    LOCTITE 2701

    • High-Strength Thread Retention
    • Low-Viscosity Threadlocking Application
    • Fluorescent Under UV Light
  • LOCTITE 271

    LOCTITE 271

    • High-Strength Thread Retention
    • Low-Viscosity Threadlocking Application
    • Large Threaded-Fastener Locking
  • LOCTITE 272

    LOCTITE 272

    • High-Strength Thread Retention
    • Medium-Viscosity Application Control
    • No Mixing Required
  • LOCTITE 277

    LOCTITE 277

    • M25 Bolt/Stud Threadlocking
    • High-Strength Thread Retention
    • Medium-Viscosity Threadlocking Application
  • LOCTITE 290

    LOCTITE 290

    • Wicking-Grade Thread Application
    • Low-Viscosity Threadlocking Application
    • High-Strength Thread Retention
  • LOCTITE 294

    LOCTITE 294

    • Wicking-Grade Thread Application
    • Low-Viscosity Threadlocking Application
    • High-Strength Thread Retention
  • LOCTITE 348

    LOCTITE 348

    • Room-Temperature Adhesive Cure
    • Non-Sag Placement Control
    • Hand-Mixable Bonding Material
  • LOCTITE 3614

    LOCTITE 3614

    • One-Component Heat-Cure Epoxy
    • SMD Attachment Applications
    • High Wet-Strength Processing
  • LOCTITE 382

    LOCTITE 382

    • One-Component Adhesive System
    • Clear Gel Formulation
    • Gap-Filling Cyanoacrylate Bonding
  • LOCTITE 4013

    LOCTITE 4013

    • Medium-Viscosity Cyanoacrylate Adhesive
    • ISO 10993 Biocompatibility
    • Disposable Medical-Device Assembly
  • LOCTITE 403

    LOCTITE 403

    • Low-Odor Bonding Processing
    • Low-Blooming Bonding Cure
    • High-Viscosity Placement Control
  • LOCTITE 404

    LOCTITE 404

    • Optically Clear Bondline
    • Fast Adhesive Cure
    • Low-Viscosity Adhesive Application
  • LOCTITE 4081

    LOCTITE 4081

    • Very-Low-Viscosity Cyanoacrylate Adhesive
    • Low-Odor Adhesive Cure
    • Disposable Medical-Device Assembly
  • LOCTITE 409

    LOCTITE 409

    • High-Viscosity Placement Control
    • to Plastics Bonding
    • Reduced Dripping and Migration
  • LOCTITE 410

    LOCTITE 410

    • Rubber-Toughened Cyanoacrylate Adhesive
    • Visible Cured Bondline
    • Dynamic/Impact-Loading Adhesive Bonding
  • LOCTITE 411

    LOCTITE 411

    • High-Viscosity Cyanoacrylate Gel
    • Controlled Non-Sag Application
    • High Peel Strength
  • LOCTITE 415

    LOCTITE 415

    • High-Viscosity Cyanoacrylate Adhesive
    • Documented MIL-A-46050C/A-A-3097 Qualification
    • Chemical and Environmental Resistance
  • LOCTITE 416

    LOCTITE 416

    • High-Viscosity One-Part Cyanoacrylate
    • Documented MIL-A-46050C/A-A-3097 Qualification
    • Multi-Material Plastic/Rubber/Metal Bonding
  • LOCTITE 422

    LOCTITE 422

    • High-Viscosity Cyanoacrylate Gel
    • Transparent Cured Bondline
    • Documented MIL-A-46050C/A-A-3097 Qualification
  • LOCTITE 426

    LOCTITE 426

    • Toughened Structural Bonding
    • Impact-Resistant Cyanoacrylate Bonding
    • Gel-Consistency Bonding Placement
  • LOCTITE 444

    LOCTITE 444

    • TAK PAK Accelerator Compatibility
    • One-Component Cyanoacrylate Adhesive
    • Documented A-A-3097 Qualification
  • LOCTITE 454

    LOCTITE 454

    • Thixotropic Application Control
    • High-Strength Structural Bonding
    • Moisture-Cure Bonding Processing
  • LOCTITE 455

    LOCTITE 455

    • Low-Odor Bonding Processing
    • Gel-Consistency Bonding Placement
    • Low-Blooming Bonding Cure
  • LOCTITE 496

    LOCTITE 496

    • Fast Bonding Cure
    • Medium-Viscosity Application Control
    • One-Component Adhesive System
  • LOCTITE 498

    LOCTITE 498

    • General-Purpose Cyanoacrylate Adhesive
    • Cured Thermal-Cycling Resistance
    • Cured Humidity Resistance
  • LOCTITE 499

    LOCTITE 499

    • Non-Sag Cyanoacrylate Gel
    • One-Component Adhesive System
    • Vertical/Overhead Adhesive Applications
  • LOCTITE 545

    LOCTITE 545

    • One-Component Sealing System
    • Thread Sealing and Locking
    • Assembly Lubricity Sealant Formulation
  • LOCTITE 554

    LOCTITE 554

    • High Solvent Resistance
    • Thread Sealing Up to 50mm
    • One-Component Sealing System
  • LOCTITE 566

    LOCTITE 566

    • Low-Strength Thread Sealing
    • Vibration-Resistant Thread Sealing
    • One-Component Sealing System
  • LOCTITE 567

    LOCTITE 567

    • High-Lubricity Thread Assembly
    • Anaerobic Thread Sealing
    • High-Temperature Service Sealant Formulation
  • LOCTITE 569

    LOCTITE 569

    • Low-Viscosity Sealing Application
    • Vibration-Resistant Thread Sealing
    • Broad Fluid Resistance
  • LOCTITE 592

    LOCTITE 592

    • High-Lubricity Thread Assembly
    • Immediate Low-Pressure Seal
    • Elevated Temperature Fluid Resistance
  • LOCTITE 609

    LOCTITE 609

    • High-Strength Cylindrical Retention
    • Low-Viscosity Retention Application
    • Vibration and Fluid Resistance
  • LOCTITE 620

    LOCTITE 620

    • High Temperature Retention
    • Gap-Filling Cylindrical Retention
    • High Mechanical and Fluid Resistance
  • LOCTITE 648

    LOCTITE 648

    • High-Strength Cylindrical Retention
    • Metal Compatibility Cylindrical Retention
    • Heat, Oil, and Contamination Resistance
  • LOCTITE 680

    LOCTITE 680

    • High-Strength Cylindrical Retention
    • Gap-Filling Cylindrical Retention
    • Heat and Fluid Resistance
  • LOCTITE 962T

    LOCTITE 962T

    • Thixotropic Application Control
    • High-Strength Joint Sealing
    • Heat-Resistant Sealing Service
  • LOCTITE LB 8008 C5-A

    LOCTITE LB 8008 C5-A

    • Copper-Based Anti-Seize Paste
    • Galling Prevention in Assembly
    • Against Corrosion and Oxidation Protection
  • LOCTITE CAT 14

    LOCTITE CAT 14

    • Powdered Anhydride Epoxy Hardener
    • Long Epoxy Working Life
    • 3-Hour Cure at 150 deg C
  • LOCTITE CAT 15

    LOCTITE CAT 15

    • Liquid Polyamide Epoxy Hardener
    • Two-Hour Pot Life
    • 80 deg C Accelerated Cure
  • LOCTITE CAT 15-LV

    LOCTITE CAT 15 LV

    • Low-Viscosity Epoxy Hardener
    • 120-Minute Working Time
    • Rigid/Semi-Rigid/Flexible Epoxy Systems
  • LOCTITE CAT 17M-1

    LOCTITE CAT 17M-1

    • Anhydride-Based Epoxy Hardener
    • Non-Flammable Curing Agent
    • Electronic/Industrial Resin Systems
  • LOCTITE CAT 21

    LOCTITE CAT 21

    • Low-Viscosity Polyoxyalkylene Amine Curative
    • One-Hour Pot Life
    • Large-Mass Epoxy Castings
  • LOCTITE CAT 23LV

    LOCTITE CAT 23LV

    • Low-Viscosity Polyamine Epoxy Catalyst
    • Water-Soluble Curing Agent
    • Low-VOC Amber Liquid
  • LOCTITE CAT 24LV

    LOCTITE CAT 24LV

    • Low-Viscosity Epoxy Curing Agent
    • Long Epoxy Pot Life
    • Low-Temperature Cured Epoxy Performance
  • LOCTITE CAT 27-1

    LOCTITE CAT 27-1

    • Low-CTE Cured Epoxy
    • Two-Hour Working Time
    • Chemical-Resistant Cured Epoxy
  • LOCTITE CAT 43

    LOCTITE CAT 43

    • Liquid Polyamine Epoxy Catalyst
    • Chemical-Resistant Cured Systems
    • LOCTITE Encapsulant Compatibility
  • LOCTITE CAT 50-2

    LOCTITE CAT 50-2

    • Low-Viscosity Liquid Catalyst
    • Dibutyltin Dilaurate Chemistry
    • Consistent Catalytic Activity
  • LOCTITE CAT B97

    LOCTITE CAT B97

    • Low/Medium-Viscosity Epoxy Catalyst
    • Encapsulation and Potting Systems
    • Adhesion and Electrical Insulation
  • LOCTITE CAT9

    LOCTITE CAT9

    • Modified Aliphatic Amine Hardener
    • Chemical-Resistant Cured Epoxy
    • -40 to 130 deg C Service
  • LOCTITE D124F-1

    LOCTITE D124F-1

    • One-Component Adhesive System
    • High Dot Profile
    • No-Stringing Bonding Application
  • LOCTITE EDAG 1415M

    LOCTITE EDAG 1415M

    • Silver-Filled Coating Application
    • Low-Resistance Coating Application
    • No Primer or Topcoat Required
  • LOCTITE EDAG 423SS

    LOCTITE EDAG 423SS

    • Graphite-Filled Conductive Ink
    • Low-Voltage Circuit Applications
    • Broad Screen-Printing Equipment Compatibility
  • LOCTITE EF562

    LOCTITE EF562

    • Foaming Epoxy Film Adhesive
    • Uniform Cell Structure
    • Dual-Cure Bonding Processing
  • LOCTITE H4500

    LOCTITE H4500

    • 15-Minute Working Time
    • High Impact and Peel Strength
    • Primerless Structural Bonding
  • LOCTITE LB8009

    LOCTITE LB8009

    • Steel Compatibility Paste Material
    • Improved Clamp Load Consistency
    • Non-Curing Assembly Formulation
  • LOCTITE LB8023

    LOCTITE LB8023

    • Calcium-Sulfonate Grease Formulation
    • High-Lubricity Thread Assembly
    • Galvanic Corrosion Prevention
  • LOCTITE LB8034

    LOCTITE LB8034

    • Synthetic PAO-Based Grease
    • Long-Life Equipment Lubrication
    • Water and Corrosion Resistance
  • LOCTITE LB8036

    LOCTITE LB8036

    • Non-Metallic Grease Material
    • High-Lubricity Thread Assembly
    • 29C to 1093C Service Temperature
  • LOCTITE LB8040

    LOCTITE LB8040

    • -43 deg C Freeze-and-Release Cooling
    • Fast Penetrating Lubricant
    • Corrosion-Protective Residual Film
  • LOCTITE LB8150

    LOCTITE LB8150

    • Graphite/Aluminum Anti-Seize Lubricants
    • Extreme-Pressure Additive Package
    • MIL-PRF-907-H Requirement Compliance
  • LOCTITE LB8700

    LOCTITE LB8700

    • Molybdenum Disulfide Anti-Seize Formulation
    • Galling Prevention in Assembly
    • Improved Clamp Load Consistency
  • LOCTITE LB8801

    LOCTITE LB8801

    • Non-Curing Silicone Grease Formulation
    • High and Low Temperature Stability
    • Metal and Plastic Compatibility
  • LOCTITE MR5412

    LOCTITE MR5412

    • Solvent-Based Neoprene Contact Adhesive
    • Fast Air-Dry Tack
    • Repositionable During Initial Assembly
  • LOCTITE SF 7840

    LOCTITE SF 7840

    • Biodegradable Aqueous Degreaser
    • Hazardous-Solvent-Free Aqueous Formulation
    • Non-Flammable Non-Caustic Cleaner
  • LOCTITE SF7090

    LOCTITE SF7090

    • Accelerates Cure of Loctite Anaerobic Adhesives
    • Solvent-Free Bonding Formulation
    • Passive Metals and Inert Materials
  • LOCTITE SF712

    LOCTITE SF712

    • Loctite SF712 | Cyanoacrylate Adhesive Activator
    • Fast Assembly Fixturing
    • Low-Viscosity Bonding Flow
  • LOCTITE SF7452

    LOCTITE SF7452

    • Cyanoacrylate Adhesive Cure Accelerator
    • Fast Assembly Fixturing
    • Low-Viscosity Bonding Flow
  • LOCTITE SF768

    LOCTITE SF768

    • Cyanoacrylate Residue Removal
    • Very-Low-Viscosity Solvent Cleaner
    • Surface Cleaning and Debonding
  • LOCTITE SICOMET 100

    LOCTITE SICOMET 100

    • 0.01 to 0.50 mm Gap Fill
    • Fast Moisture-Cure Fixturing
    • Strong Rubber/Plastic Adhesion
  • LORD 304-2

    LORD 304-2

    • High-Viscosity Placement Control
    • Rubber, Wood, and FRP Bonding
    • Durable Cured Performance with Environmental
  • LORD 306-2

    LORD 306-2

    • 306-1 Epoxy Hardener
    • 1 to 2-Hour Working Time
    • 24 to 48-Hour Room-Temperature Cure
  • LORD 4688

    LORD 4688

    • Low-Density Honeycomb-Core Syntactic Reinforcement
    • Thixotropic Application Control
    • 30-Minute Working Window
  • LORD 7100A

    LORD 7100A

    • High-Strength Structural Bonding
    • Primerless Bonding to Many Plastics
    • VOC-Free Weathering/Aging-Resistant Urethane
  • LORD 7100A/B

    LORD 7100A/B

    • High-Strength Structural Bonding
    • Without Priming Bonding
    • Solvent-, Weathering- and Aging-Resistant Cured System
  • LORD 7100B

    LORD 7100B

    • High-Strength Urethane Bonding
    • Primerless Bonding to Many Plastics
    • VOC-Free Weathering/Aging-Resistant Urethane
  • LORD 3135-B

    LORD 3135-B

    • Former Lord 7111-B Hardener
    • Low-Shrinkage Epoxy Bonding
    • Room-Temperature or Accelerated Heat Curing
  • LORD 7150A/B

    LORD 7150A/B

    • High-Strength Structural Bonding
    • Primerless Bonding to Many Plastics
    • Solvent-, Weathering- and Aging-Resistant Gray Cured System
  • LORD 7542A

    LORD 7542A

    • 1:1 Controlled Mixing
    • 4 to 30-Minute Working Window
    • 18.7 MPa Cured Tensile Strength
  • LORD 7542B

    LORD 7542B

    • 1:1 Fast-Cure Urethane Curative
    • 5 to 10-Minute Working Time
    • 30 to 60-Minute Handling Time
  • LORD 7542C

    LORD 7542C

    • 1:1 Medium-Work-Time Urethane Curative
    • 10 to 20-Minute Working Time
    • 60 to 120-Minute Handling Time
  • LORD 7545A/B

    LORD 7545A/B

    • Non-Sag Urethane Bonding
    • 3 to 5-Minute Working Window
    • 30-Minute Handling Time
  • LORD 7545A/D

    LORD 7545A/D

    • High-Strength Structural Bonding
    • Non-Sag Vertical Placement
    • Solvent and Weather Resistance
  • LORD 7550

    LORD 7550

    • Optically Clear Bonding
    • 3 to 5-Minute Working Window
    • Weathering/Humidity/Salt-Spray/UV Environmental Resistance
  • LORD 7650

    LORD 7650

    • One-Part Moisture-Cure Urethane
    • 15 to 30-Minute Solvent Flash
    • Multi-Material Foam/Fabric/Rubber/Plastic/Metal Bonding
  • LORD 7800

    LORD 7800

    • Rapid-Cure Urethane Bonding
    • Composite, SMC, Plastic, and Coated-Metal Bonding
    • Non-Sag Environmental Resistance
  • LORD ACCELERATOR 19GB

    LORD ACCELERATOR 19GB

    • Integrated 0.01 in (0.025 cm) Glass Beads
    • Room-Temperature Curing Paste Material
    • Non-Flammable Application Formulation
  • MOLYKOTE 1000

    MOLYKOTE 1000

    • No Intentional PFAS, Lead, or Nickel
    • -30 to 650 deg C Service Range
    • Consistent Friction and High Load Capacity
  • MOLYKOTE 106

    MOLYKOTE 106

    • Heat-Curing Dry Film Lubricant
    • High-Load Coating Application
    • 70 to 250 deg C Service Range
  • MOLYKOTE 112

    MOLYKOTE 112

    • Up to 232 deg C Service
    • Oil, Acid, and Alkali Resistance
    • Low-Volatility Joint Sealing
  • MOLYKOTE 1122

    MOLYKOTE 1122

    • High-Viscosity Lubricant Formulation
    • Robust High-Pressure Resistance and Wear Protection
    • High-Temperature Lubrication Protection
  • MOLYKOTE 3099

    MOLYKOTE 3099

    • Water-Repellent High-Voltage Insulator Coating
    • 800-Minute ASTM D2303 Arc Resistance
    • Hand, Pad, Brush, or Spray Renewal
  • MOLYKOTE 316

    MOLYKOTE 316

    • Effective, Heat-Stable Anti-Stick Silicone Film
    • FDA 21 CFR 175.300 Compliance
    • Oxidative Breakdown Resistance
  • MOLYKOTE 3179

    MOLYKOTE 3179

    • Dilatant Rheological Behavior
    • Non-Slumping Static-Flow Resistance
    • Novelty/Educational Toy-Market Use
  • MOLYKOTE 33

    MOLYKOTE 33

    • NLGI 2 Silicone Grease
    • Water-Resistant Light-Load Lubrication
    • 73 to 180 deg C Service Range
  • MOLYKOTE 3400A

    MOLYKOTE 3400A

    • 30-Minute 200 deg C Heat Cure
    • High-Load Dry-Film Wear Resistance
    • 500-Hour Red-Rust Resistance
  • MOLYKOTE 3452

    MOLYKOTE 3452

    • Multi-Solvent Chemical Resistance
    • Defined 8-Hour Exposure Testing
    • 400 kg Four-Ball Weld Load
  • MOLYKOTE 4

    MOLYKOTE 4

    • 54 to 200 deg C Service Range
    • 3 ohm-cm Volume Resistivity
    • Flowable Controlled Placement
  • MOLYKOTE 41

    MOLYKOTE 41

    • Silicone Oil Base and Carbon Black Thickener
    • 20 to 290 deg C Service Range
    • Water and Oxidation Resistance
  • MOLYKOTE 44

    MOLYKOTE 44

    • -40 to 200 deg C Service Range
    • 2.5% Bleed at 150 deg C
    • NLGI 2-3 Silicone Grease
  • MOLYKOTE 5

    MOLYKOTE 5

    • Nonconductive, Water-Repellent Silicone Paste
    • 54 to 232 deg C Service Range
    • Metal and Plastic Compatibility
  • MOLYKOTE 55

    MOLYKOTE 55

    • Silicone Base Oil and Lithium Soap Thickener
    • Heat-Stable Oxidation-Resistant Grease
    • D4/D5/D6 Cyclic-Siloxane Compliance
  • MOLYKOTE 557

    MOLYKOTE 557

    • Clear Nonstaining Wax-Like Film
    • 0.07 Coefficient of Friction
    • Federal Meat/Poultry Program Authorization
  • MOLYKOTE 7400

    MOLYKOTE 7400

    • Water-Based MoS2/Graphite Dry-Film Lubricant
    • High Load-Carrying Capacity
    • Air-Curing Lubricant Coating
  • MOLYKOTE 7415

    MOLYKOTE 7415

    • Molykote D-7405, D-7409, and D-7620 Anti-Friction Coatings
    • Low Evaporation Rate
    • PTFE- and PFAS-Free Formulation
  • MOLYKOTE BG20

    MOLYKOTE BG20

    • 45 to 180 deg C Service Range
    • 2,400 N Four-Ball Weld Load
    • Manual or Automated Dispensing
  • MOLYKOTE BG-555

    MOLYKOTE BG-555

    • Low-Noise Bearing Grease
    • Water-Washout and Corrosion Resistance
    • -40 to 150 deg C Service Range
  • MOLYKOTE BR-2

    MOLYKOTE BR-2

    • MoS2/Graphite Lithium Grease
    • High-Load Moderate/High-Speed Lubrication
    • Long-Term Industrial Lubrication
  • MOLYKOTE CU-7439

    MOLYKOTE CU-7439

    • Up to 650 deg C Service
    • High-Adhesion Copper Paste
    • Nondestructive Thread-Disassembly Support
  • MOLYKOTE D-10-GBL

    MOLYKOTE D-10-GBL

    • 15 to 20 um Dry Film
    • -40 to 340 deg C Service Range
    • 5,500 N Falex Load
  • MOLYKOTE D-321

    MOLYKOTE D-321

    • 5-Minute Cure Cycle
    • 180 to 450 deg C Service Range
    • 12,500 N Falex Load
  • MOLYKOTE D-708

    MOLYKOTE D-708

    • 700-Hour Cure Cycle
    • 60 to 240 deg C Service Range
    • 60-Minute 180 deg C Cure
  • MOLYKOTE D-7409

    MOLYKOTE D-7409

    • Heat-Curing Dry-Film Lubricant
    • High-Load Wear-Resistant Dry-Film Lubrication
    • Solvent and Oil Resistance
  • MOLYKOTE D-96

    MOLYKOTE D-96

    • Transparent Water-Based PTFE Dry Film
    • 100,000-Cycle No-Noise Pairing Result
    • -40 to 150 deg C Service Range
  • MOLYKOTE DX

    MOLYKOTE DX

    • 4,800 N Four-Ball Weld Load
    • 0.10 Press-Fit Friction Coefficient
    • -25 to 125 deg C Service Range
  • MOLYKOTE EM-30L

    MOLYKOTE EM-30L

    • -45 to 150 deg C Service Range
    • 3,730 N Four-Ball Weld Load
    • 0.4% Evaporation at 99 deg C
  • MOLYKOTE EM-50L

    MOLYKOTE EM-50L

    • Broad Plastic Compatibility
    • 100% Silicone-Free PAO Grease
    • Low-Seepage Long-Service Lubrication
  • MOLYKOTE E-PASTE

    MOLYKOTE E-PASTE

    • 560 kg Four-Ball OK Load
    • ABS, Polycarbonate, Nylon, Polyacetal Compatibility
    • -50 to 150 deg C Service Range
  • MOLYKOTE G-0010

    MOLYKOTE G-0010

    • Polyurea-Thickened Mineral-Oil Grease
    • Above 260 deg C Dropping Point
    • Corrosion-Preventive Bearing Grease
  • MOLYKOTE G-0050

    MOLYKOTE G-0050

    • FDA 21 CFR 178.3570 Compliance
    • 3,922 N Four-Ball Weld Load
    • Clean, White Color
  • MOLYKOTE G-0052

    MOLYKOTE G-0052

    • FDA 21 CFR 178.3570 Compliance
    • 6,080 N Four-Ball Weld Load
    • Water-Resistant Grease Lubrication
  • MOLYKOTE G-1033

    MOLYKOTE G-1033

    • FDA 21 CFR 178.3570 Compliance
    • 3,922 N Four-Ball Weld Load
    • Clean, White Color
  • MOLYKOTE G-1067

    MOLYKOTE G-1067

    • Low-Friction Plastic-Compatible PAO Grease
    • 50 to 120 deg C Service Range
    • Automotive Lubrication Applications
  • MOLYKOTE G-1502FM

    MOLYKOTE G-1502FM

    • Oil and Water Resistance
    • FDA 21 CFR 178.3570 Compliance
    • 40 to 149 deg C Service Range
  • MOLYKOTE G-3000

    MOLYKOTE G-3000

    • Dual-Mass-Flywheel High-Shear Grease
    • -40 to 180 deg C Service Range
    • 2,200 N Four-Ball Weld Load
  • MOLYKOTE G-3407

    MOLYKOTE G-3407

    • -40 to 200 deg C Service Range
    • Brake-Caliper Guide-Pin Lubrication
    • 120-Hour No-Rust Test Result
  • MOLYKOTE G-4500FM

    MOLYKOTE G-4500FM

    • 40 to 150 deg C Service Range
    • 18 kg Four-Ball Weld Load
    • NLGI 2 PAO/Aluminum-Complex Grease
  • MOLYKOTE G-4501

    MOLYKOTE G-4501

    • FDA 21 CFR 178.3570 Compliance
    • Lower-Consistency (NLGI 1) PAO Synthetic Grease
    • 40 to 150 deg C Service Range
  • MOLYKOTE G-4700

    MOLYKOTE G-4700

    • Extreme-Load Bearing Lubrication
    • PAO Synthetic Base Oil and Lithium Complex Thickener
    • Industrial Plastic/Elastomer Compatibility
  • MOLYKOTE G-5008

    MOLYKOTE G-5008

    • 350 V/mil Dielectric Strength
    • 2.0% Bleed at 204 deg C
    • NLGI 2-3 Silicone/PTFE Grease
  • MOLYKOTE G-5042

    MOLYKOTE G-5042

    • Effective Purple Silicone Grease
    • Siloxane Base Oil and Lithium Soap Thickener
    • Long-Term Silicone-Grease Lubrication
  • MOLYKOTE GN

    MOLYKOTE GN

    • Mineral-Oil Solid-Lubricant Assembly Paste
    • 0.08 Press-Fit Friction Coefficient
    • 2,800 N Four-Ball Weld Load
  • MOLYKOTE HP-300

    MOLYKOTE HP-300

    • Fully Fluorinated PFPE/PTFE Lubrication
    • 65 to 250 deg C Service Range
    • 3,300 N Four-Ball Weld Load
  • MOLYKOTE HP-870

    MOLYKOTE HP-870

    • Fully Fluorinated Formulation
    • -20 to 250 deg C Service Range
    • Chemical-Resistant PFPE/PTFE Grease
  • MOLYKOTE L-1268

    MOLYKOTE L-1268

    • Fully Synthetic ISO Vg 68 PAO Lubrication
    • 54 deg C Pour Point
    • Longer Oil-Drain Intervals
  • MOLYKOTE L13

    MOLYKOTE L13

    • Adjusts the Application Viscosity
    • Compatible Cleaning Solvent
    • Defined Range of Molykote Coatings
  • MOLYKOTE L-1468 FM

    MOLYKOTE L-1468 FM

    • ISO VG 68 PAO Chain Oil
    • Freezer-Chain Anti-Wear Lubrication
    • NSF H1 Registration
  • MOLYKOTE L-1668FM

    MOLYKOTE L-1668FM

    • ISO Vg 68 Mineral-Oil
    • Low Vapor Pressure
    • Carries NSF H1 Certification
  • MOLYKOTE LONGTERM 2 PLUS

    MOLYKOTE LONGTERM 2 PLUS

    • 3,800 N Four-Ball Weld Load
    • Heavily Loaded Metal-to-Metal Components Protection
    • 25 to 110 deg C Service Range
  • MOLYKOTE M-77

    MOLYKOTE M-77

    • Up to 400 deg C Service
    • Silicone Carrier Oil
    • Selected Metal, Plastic, Rubber, and Elastomer Contacts
  • MOLYKOTE P37

    MOLYKOTE P37

    • -30 to 1400 deg C Threaded-Connection Lubrication
    • 5,500 N Four-Ball Weld Load
    • Graphite/Zirconium-Dioxide High-Purity Paste
  • MOLYKOTE P-40

    MOLYKOTE P-40

    • Metal-Free Lubrication Paste
    • Assembly and Continuous Lubrication
    • -40 to 121 deg C Paste Service
  • MOLYKOTE PA-744

    MOLYKOTE PA-744

    • 10 to 20 um Screen-Printed Film
    • High-Wear High-Load Dry Lubrication
    • -75 to 300 deg C Service Range
  • MOLYKOTE PG54

    MOLYKOTE PG54

    • Long-Term Lubrication for Metal-to-Plastic
    • 50 to 180 deg C Service Range
    • Silicone Base Oil
  • MOLYKOTE TP-42

    MOLYKOTE TP-42

    • 3,000 N Four-Ball Weld Load
    • Water-Resistant Grease Lubrication
    • Stick-Slip, Galling, and Corrosion Protection
  • MOLYKOTE YM103

    MOLYKOTE YM103

    • PAO/PTFE Lubrication for Plastic-on-Plastic
    • 45 to 150 deg C Service Range
    • Automotive Lubrication Applications
  • MOLYKOTE Z-POWDER

    MOLYKOTE Z-POWDER

    • 98% MoS2 Solid Lubricant
    • 185 to 400 deg C Service Range
    • 0.048 Coefficient of Friction
  • PERMABOND 101

    PERMABOND 101

    • 2 to 3 mPa s Viscosity Range
    • 2 to 10-Second Fixturing Time
    • 25 kV/mm Dielectric Strength
  • PERMABOND 102

    PERMABOND 102

    • Low 70–90 mPa·s viscosity
    • 0.15 mm maximum gap fill
    • Typical fixture times of 5–15 seconds
  • PERMABOND 108

    PERMABOND 108

    • 400 to 600 mPa s Viscosity Range
    • 10-Second Fixturing Time
    • 25 kV/mm Dielectric Strength
  • PERMABOND 130UV

    PERMABOND 130UV

    • Rapid UV Bonding Cure
    • 200 mPa s Application Viscosity
    • Under 405 Nm LED Conditions
  • PERMABOND 200

    PERMABOND 200

    • 1,500 mPa s Application Viscosity
    • 15-Second Fixturing Time
    • 22 N/mm^2 Shear Strength
  • PERMABOND 2010

    PERMABOND 2010

    • Thixotropic Vertical-Surface Control
    • Up to 0.5 mm Gap Filling
    • 25 kV/mm Dielectric Strength
  • PERMABOND 2050

    PERMABOND 2050

    • Toughened Structural Bonding
    • 1,200 to 1,800 mPa s Viscosity Range
    • 5 to 15-Second Fixturing Time
  • PERMABOND 240

    PERMABOND 240

    • 15 to 20-Second Fixturing Time
    • Up to 0.4 mm Gap Filling
    • WRAS/MIL-A-46050C Qualification Scope
  • PERMABOND 268

    PERMABOND 268

    • 0.43 mm Maximum Gap Fill
    • 5 to 10-Second Handling Time
    • MIL-A-46050C Type II Class 3 Approval
  • PERMABOND 4C20

    PERMABOND 4C20

    • 400 to 600 mPa s Viscosity Range
    • 10-Second Fixturing Time
    • 25 kV/mm Dielectric Strength
  • PERMABOND 737

    PERMABOND 737

    • Toughened Structural Bonding
    • No-Mix Bonding Processing
    • High-Viscosity Gap Filling
  • PERMABOND 738

    PERMABOND 738

    • Toughened cyanoacrylate formulation
    • Approximately 5,000 mPa·s viscosity
    • Suited to dark assemblies
  • PERMABOND 790

    PERMABOND 790

    • 2 to 3-Second Handling Time
    • Surface-Insensitive Acidic-Substrate Bonding
    • Low-Viscosity Wicking Post-Assembly Bonding
  • PERMABOND 792

    PERMABOND 792

    • Fast Surface-Insensitive Acidic-Substrate Bonding
    • 2 to 3-Second Fixture Time
    • MIL-A-46050C/NSF S4 Compliance
  • PERMABOND 795

    PERMABOND 795

    • Moderate-Viscosity Surface-Insensitive Adhesive
    • 0.18 mm Maximum Gap Fill
    • MIL-A-46050C/CID A-A-3097 Compliance
  • PERMABOND 799

    PERMABOND 799

    • Up to 0.5 mm Gap Fill
    • 8-Second Fixture Time
    • MIL-A-46050C Type II Class 3 Compliance
  • PERMABOND 910

    PERMABOND 910

    • 10 to 15-Second Fixturing Time
    • 70 to 90 mPa s Viscosity Range
    • ISO 4587 Multi-Material Shear Strength
  • PERMABOND 919

    PERMABOND 919

    • Up to 250 deg C Service
    • 20-Second Fixturing Time
    • MIL-A-46050C Type V Class 1 Approval
  • PERMABOND 920

    PERMABOND 920

    • Post-Cured Service up to 250 deg C
    • 15 to 20-Second Steel Fixture
    • MIL-A-46050C Type V Class 2 Compliance
  • PERMABOND 922

    PERMABOND 922

    • Up to 250 deg C Service
    • Up to 0.4 mm Gap Filling
    • MIL-A-46050C Type V Class 3 Approval
  • PERMABOND 940

    PERMABOND 940

    • Non-Frosting Alkoxyethyl Formulation
    • Low-Odor Cyanoacrylate Bonding
    • Fast Multi-Substrate Fixturing
  • PERMABOND 943

    PERMABOND 943

    • Low-Odor Alkoxyethyl Formulation
    • Non-Frosting Non-Fogging Bonding
    • Fast Multi-Substrate Fixturing
  • PERMABOND ASC10

    PERMABOND ASC10

    • Anaerobic Cure on Passive Surfaces
    • Fast-Evaporating Non-Halogenated Surface Conditioner
    • Up to 30-Day Surface Activation
  • PERMABOND HH120

    PERMABOND HH120

    • High-Viscosity Non-Drip Threadlocking
    • MIL-S-46163A/MIL-S-22473E/ASTM D5363 Compliance
    • Vibration/Corrosion-Resistant Thread Retention
  • PERMABOND HH131

    PERMABOND HH131

    • High-Strength High-Temperature Threadlocking
    • DVGW/KTW-BWGL Approval Scope
    • Thread Lubrication and Vibration Resistance
  • PERMABOND HL126

    PERMABOND HL126

    • Water-Thin Wicking Threadlocker
    • Warm-Weld/Casting Porosity Sealing
    • MIL-S-22473E/MIL-S-46163A/ASTM D5363 Compliance
  • PERMABOND HM118

    PERMABOND HM118

    • Water-Thin Wicking Threadlocker
    • Warm-Weld/Casting Porosity Sealing
    • MIL-S-22473E/MIL-S-46163A/ASTM D5363 Compliance
  • PERMABOND HM160

    PERMABOND HM160

    • Medium-Viscosity High-Strength Retaining
    • Lighter Press-Fit Assembly Tolerances
    • MIL-R-46082B/ASTM D5363 Compliance
  • PERMABOND HM-162

    PERMABOND HM-162

    • 5-Minute Steel Handling Time
    • 30 MPa Shear Strength
    • High-Temperature Chemical Resistance
  • PERMABOND LH050

    PERMABOND LH050

    • Up to 1000 psi Instant Air Seal
    • PTFE Non-Shredding Pipe-Dope Alternative
    • UL Gas/Fuel/Sprinkler Classification
  • PERMABOND LM012

    PERMABOND LM012

    • Unfilled PFAS-Free Anaerobic Threadsealant
    • Sensitive High-Pressure Hydraulic-System Sealing
    • MIL-S-22473/ASTM D5363 Compliance Scope
  • PERMABOND LM113

    PERMABOND LM113

    • Low-Strength Easy-Disassembly Threadlocking
    • Medium-Viscosity Non-Drip Application
    • MIL-S-46163A/ASTM D5363 Compliance
  • 3M 05096

    3M 05096

    • Fine Small-Defect Filling
    • Smooth Feathered Edges
    • Low-Shrinkage Spot Repair
  • 3M 08463

    3M 08463

    • One-Hour Full Cure
    • Closed-Cell Cavity Filling
    • Direct Static-Mix Application
  • 3M 08681

    3M 08681

    • No-Activator One-Part Primer
    • Ten-Minute Drying Time
    • Multi-Interface Auto Glass Priming
  • 3M 08690

    3M 08690

    • Fast Strength Build-Up
    • High-Viscosity Bead Control
    • One-Part Moisture Cure
  • 3M 1181

    3M 1181

    • Conductive Adhesive Path
    • 66 dB Average Shielding
    • Solderable Die-Cut Construction
  • 3M 1205

    3M 1205

    • 155 deg C Continuous Operation
    • 6000 V Dielectric Minimum
    • Coil and Solder-Mask Versatility
  • 3M 1267

    3M 1267

    • Embossed Z-Axis Contact
    • 64 dB Average Shielding
    • Lined Die-Cut Handling
  • 3M 130C

    3M 130C

    • Self-Fusing Linerless Insulation
    • High Dielectric Strength
    • 69 kV Splicing Scope
  • 3M 1357L

    3M 1357L

    • Low-Viscosity Large-Area Application
    • Fast Ten-Minute Drying
    • Thirty-Minute Bonding Range
  • 3M 201

    3M 201

    • Rubber-based adhesive
    • Conformable crepe paper backing
    • Short-term heat resistance
  • 3M 205

    3M 205

    • Fast Contact-Type Adhesion
    • Lift-Resistant Paint Masking
    • Multiple Paint-System Compatibility
  • 3M 2084

    3M 2084

    • One-Part No-Mix Application
    • Five-Minute Tack-Free Time
    • Flexible Fluid-Resistant Seal
  • 3M 218

    3M 218

    • Crisp Fine-Line Separation
    • Solvent and Moisture Resistance
    • Bake-Cycle Heat Resistance
  • 3M 226

    3M 226

    • Chemical-Resistant Surface Protection
    • Three-Month Outdoor Clean Removal
    • Quick-Stick Hand-Tearable Handling
  • 3M 231/231A

    3M 231/231A

    • Instant-Adhesion Paint Masking
    • Clean Multiple-Bake Removal
    • Conformable Mini-Crepe Backing
  • 3M 232

    3M 232

    • Immediate High-Hold Adhesion
    • Clean Medium-Temperature Removal
    • One-Piece Sliver-Resistant Handling
  • 3M 233

    3M 233

    • Conformable Automotive Paint Masking
    • Defined ASTM Physical Strength
    • Short High-Temperature Exposure
  • 3M 2460

    3M 2460

    • Low-Ridge Precision Paint Lines
    • Delicate-Surface Low-Peel Handling
    • Twenty-One-Day Outdoor Removal
  • 3M 2517

    3M 2517

    • General-Purpose Web Splicing
    • Versatile Hand-or-Machine Handling
    • Short High-Temperature Bake Cycles
  • 3M 2929

    3M 2929

    • Moisture-Resistant Reinforced Backing
    • Quick Hand-Tear Handling
    • Fast Multi-Surface Contact
  • 3M 298X

    3M 298X

    • Precision Fiber-Protrusion Control
    • Lower Slurry Contamination
    • MT Connector Polishing Fit
  • 3M 301

    3M 301

    • Clean One-Piece Removal
    • Conformable Paint-Masking Control
    • Defined 107 deg C Exposure
  • 3M 305

    3M 305

    • Instant Acrylic Carton Closure
    • Split-Resistant BOPP Handling
    • Cold-Temperature Packaging Use
  • 3M 307EA

    3M 307EA

    • Self-Renewing Abrasive Cut
    • Conformable Contour Finishing
    • Predictable Robotic Finish Quality
  • 3M 3302

    3M 3302

    • Low-Resistance Conductive Bonding
    • Conformable EMI/RFI Shielding
    • UL 510 Recognized Construction
  • 3M 33428

    3M 33428

    • Defined 80+ Abrasive Grade
    • Seven-Inch Metalworking Coverage
    • Compatible 7/8-Inch Mounting
  • 3M 34383

    3M 34383

    • Hand-Tearable Foil Installation
    • Vapor-Barrier Sealing Performance
    • Broad -40 to 149 deg C Service
  • 3M 363

    3M 363

    • High-Tensile Reinforced Foil
    • 316 deg C Continuous Service
    • FAR 25.853(a) Requirements Met
  • 3M 37852

    3M 37852

    • Reduced-Adhesive Floor Removal
    • Fast Secure Surface Coverage
    • Contaminant-Trapping Paint-Booth Protection
  • 3M 3950

    3M 3950

    • Film Edge-Lift Protection
    • Water-Tight Interface Sealing
    • Defined 50-100 deg F Application
  • 3M 401

    3M 401

    • High-temperature performance
    • Clean removal
    • Comfortable crepe paper backing
  • 3M 4016

    3M 4016

    • High-Shear Permanent Mounting
    • Vibration-Damping Conformable Foam
    • Protected 104 deg C Holding
  • 3M 401M

    3M 401M

    • Fast High-Initial Substrate Grab
    • Fast Hand-Tearable Process Handling
    • Defined -40 to 65 deg C Service
  • 3M 40PR

    3M 40PR

    • Conductive Anti-Static Adhesion
    • Visible Static-Control Identification
    • 130 deg C Process Exposure
  • 3M 4116

    3M 4116

    • Fast Initial Multi-Substrate Tack
    • Breathable Contaminant-Trapping Seal
    • High-Density Vibration Damping
  • 3M 4200FC

    3M 4200FC

    • Fast Moisture-Cure Sealing
    • Non-Sag Marine Application
    • Flexible Bonds for Disassembly
  • 3M 433L

    3M 433L

    • High-Temperature Heat Shielding
    • Conformable Foil Surface Coverage
    • Linered Tape for Die-Cutting
  • 3M 444

    3M 444

    • Fast Initial Lamination Adhesion
    • Stable PET Converting Carrier
    • Foam and Gasket Attachment
  • 3M 4611

    3M 4611

    • High-Temperature Metal Bonding
    • Immediate Handling Without Cure
    • Firm Foam Fastener Replacement
  • 3M 470

    3M 470

    • Chemical-Resistant Plating Masks
    • Conformable Irregular-Surface Coverage
    • Clean-Removal Process Masking
  • 3M 470L

    3M 470L

    • Linered Die-Cut Plating Masks
    • Chemical-Resistant Process Protection
    • Conformable Curved-Surface Masking
  • 3M 471

    3M 471

    • Conformable Irregular-Surface Marking
    • Clean-Removal Paint Masking
    • Vivid Abrasion-Resistant Identification
  • 3M 4712

    3M 4712

    • Die-Cut Masking Conversion
    • Stretch-Conformable Surface Coverage
    • Clean-Removal Color Coding
  • 3M 483

    3M 483

    • Stretch-Conformable Irregular-Surface Sealing
    • Low Water-Vapor Transmission
    • Up to 12-Month Outdoor Removal
  • 3M 4905

    3M 4905

    • Low-Visibility Permanent Fastening
    • Immediate Contact-Bond Handling
    • High-Strength HSE Substrate Bonding
  • 3M 4950

    3M 4950

    • Immediate No-Cure Assembly Handling
    • Firm 1.1 mm Foam Bonding
    • High-Surface-Energy Permanent Attachment
  • 3M 50

    3M 50

    • All-Weather Pipe Corrosion Protection
    • Conformable High-Tack Pipe Wrapping
    • Primer-Controlled Metal Surface Adhesion
  • 3M 510

    3M 510

    • Conformable Diamond-Plate Slip Resistance
    • Mineral-Coated High-Friction Walking Surface
    • Soft-Mallet Irregular-Surface Conforming
  • 3M 528

    3M 528

    • Blasting-Media Impact Surface Protection
    • Clean One-Piece Tape Removal
    • Die-Cuttable Paper-Liner Masking Format
  • 3M 540

    3M 540

    • One-Part Moisture-Cure Joint Sealing
    • Elastic >600% Elongation Profile
    • 60 to 90 Minute Tack-Free Window
  • 3M 560

    3M 560

    • Single-Component Bond-and-Seal Application
    • Elastic Moisture-Cured Assembly Bonding
    • Panel and Body Bonding Fit
  • 3M 583

    3M 583

    • Controlled Electronic Film Bondlines
    • Heat-and-Pressure Thermal Bonding
    • PCB Glass-Fabric Splicing Fit
  • 3M 5925

    3M 5925

    • Immediate Painted-Surface Bonding
    • Conformable 0.6 mm Foam Attachment
    • 93 deg C Long-Term Use
  • 3M 5952

    3M 5952

    • 45-Mil Conformable Foam Bonding
    • Painted-Surface Permanent Attachment
    • Panel and Display Assembly Bonding
  • 3M 598X.5MIC

    3M 598X.5MIC

    • Fine Cerium Oxide Final Polishing
    • Polyester Film for Controlled Finishing
    • Fiber-Optic Ferrule Finishing Fit
  • 3M 604NS

    3M 604NS

    • Non-Sag Vertical Gap Filling
    • Rapid 4-Minute Working Window
    • Multi-Material Structural Bonding
  • 3M 665

    3M 665

    • Linerless Manual or Automated Dispensing
    • Repositionable Mounting with Clean Removal
    • Hot-Wire Cuttable Plastic Construction
  • 3M 69

    3M 69

    • High-Temperature Electrical Insulation
    • Glass-Cloth Coil and Motor Wrapping
    • No-Heat Adhesive Application
  • 3M 70

    3M 70

    • Instant Self-Fusing Cable Overwrap
    • Class H High-Temperature Insulation
    • Arc-Resistant High-Voltage Protection
  • 3M 7445

    3M 7445

    • Gentle Super Fine Surface Cleaning
    • Conformable Pad for Delicate Surfaces
    • Rust-Free Steel Wool Alternative
  • 3M 7447

    3M 7447

    • Very Fine Aluminum-Oxide Finishing
    • Nonwoven Pad for Surface Preparation
    • Cleaning, Blending and Light Deburring
  • 3M 7448

    3M 7448

    • Ultra Fine Silicon-Carbide Finishing
    • Conformable Access to Irregular Surfaces
    • Load-Resistant Long-Life Open Web
  • 3M 78

    3M 78

    • EPS and Insulation Material Bonding
    • Aerosol or Cylinder Spray Delivery
    • Foundation and Foam-Core Applications
  • 3M 784F

    3M 784F

    • Fast Medium-Pressure Metal Grinding
    • Flexible Wet-or-Dry Belt Grinding
    • Grinding Aid for Heat-Sensitive Alloys
  • 3M 7880

    3M 7880

    • Dot-Matrix Printable Polyester Facestock
    • Adhesion Across Metals and Plastics
    • Moisture- and Chemical-Resistant Labeling
  • 3M 79

    3M 79

    • Stable Glass-Cloth Coil Insulation
    • 600 V Electrical Tape Rating
    • High-Temperature Motor and Transformer Use
  • 3M 850

    3M 850

    • Low-Caliper High-Strength Process Tape
    • Quick-Stick Long-Hold Splicing
    • Visible or Transparent Marking Options
  • 3M 855

    3M 855

    • Clean-Removal High-Temperature Masking
    • Non-Silicone Adhesive for Repainting
    • High-Elongation Composite Bagging Tape
  • 3M 8561

    3M 8561

    • 14-Mil Indoor Erosion Protection
    • Conformable Curved-Surface Tape Protection
    • Paint-Compatible Removable Acrylic Adhesion
  • 3M 8657DL

    3M 8657DL

    • Dual-Liner Aircraft Wet-Area Installation
    • Tough Polyurethane Fluid-Barrier Protection
    • 82 deg C Wet-Area Service
  • 3M 865X

    3M 865X

    • Precision Silica Fiber-Optic Polishing
    • Film-Backed Controlled Fine Lapping
    • Multiple Formats for Polishing Sequences
  • 3M 8671

    3M 8671

    • Outdoor UV-Resistant Edge Protection
    • Acrylic Pressure-Sensitive Protective Layer
    • Converted Formats for Leading Edges
  • 3M 8672

    3M 8672

    • UV-Resistant Outdoor Surface Protection
    • 8-Mil Conformable Erosion Barrier
    • High-Peel Acrylic Surface Adhesion
  • 3M 8681HS

    3M 8681HS

    • Polyurethane Leading-Edge Erosion Protection
    • Conformable Curved-Surface Coverage
    • High-Shear Acrylic Attachment
  • 3M 890

    3M 890

    • High-Strength Filament Reinforcement
    • Heavy-Duty Bundling Support
    • Industrial Splicing and Securing
  • 3M 8934

    3M 8934

    • Glass-Reinforced Packaging Strength
    • Minimal-Rubdown Package Reinforcement
    • Transparent Reinforcement Preserves Graphics
  • 3M 8979

    3M 8979

    • Six-Month Outdoor Clean Removal
    • One-Year UV Exposure Resistance
    • Hand-Tear Conformable Repairs
  • 3M 898

    3M 898

    • High-Tensile Filament Reinforcement
    • Multi-Surface Synthetic-Rubber Adhesion
    • Consistent Curl-Resistant Dispensing
  • 3M 8992

    3M 8992

    • 204 deg C Process Masking
    • Clean One-Piece Mask Removal
    • Chemical-Process Masking Resistance
  • 3M 8992L

    3M 8992L

    • Linered Die-Cut Masking Format
    • High-Temperature Silicone Masking
    • Clean One-Piece Process Removal
  • 3M 9082

    3M 9082

    • 177 deg C Long-Term Bonding
    • Low-Outgassing Electronics Adhesion
    • Thin 0.05 mm Transfer Layer
  • 3M 90CA

    3M 90CA

    • Fast Tack Spray Bonding
    • Adjustable Lace Spray Pattern
    • Broad Assembly Material Compatibility
  • 3M 9379

    3M 9379

    • Thin Profile Transfer Bonding
    • Clear Low Visibility Construction
    • Fuel And Hydraulic Fluid Resistance
  • 3M 9472

    3M 9472

    • High Tack Transfer Bonding
    • Converter Friendly Fiber Reinforcement
    • Broad Substrate Peel Performance
  • 3M 9672

    3M 9672

    • High Tack Transfer Bonding
    • Heavy Liner Converting Support
    • Broad Substrate Peel Performance
  • 3M 987C

    3M 987C

    • Efficient Stock Removal
    • Stable Heavy Duty Backing
    • Durable Resin Bonded Construction
  • 3M A3-2

    3M A3-2

    • Fast Handling Strength Development
    • Controlled Non Sag Placement
    • Oily Surface Process Tolerance
  • 3M AC-130-2

    3M AC-130-2

    • Non Chromated Metal Preparation
    • Ambient Dry Process
    • Brush Spray Or Immersion Application
  • 3M AC-380

    3M AC-380

    • Fuel Tank Sealing Performance
    • Thixotropic Application Control
    • Selectable Assembly Work Life
  • 3M AC-730

    3M AC-730

    • Non Chromated Corrosion Inhibition
    • Flowable And Thixotropic Options
    • Selectable Application Life Grades
  • 3M AC-770-B-2-3

    3M AC-770-B-2-3

    • Low Density Fuselage Sealing
    • Controlled Thixotropic Placement
    • Extended Class B Work Life
  • 3M AF536

    3M AF536

    • Smooth Composite Surface Finish
    • Optional Lightning Protection Conductor
    • Drapeable Repositionable Layup
  • 3M CV45F

    3M CV45F

    • Conformable Panel Seam Bonding
    • Immediate Pressure Sensitive Handling
    • Stress Relaxing Acrylic Foam
  • 3M DP605NS

    3M DP605NS

    • Tough Flexible Urethane Bond
    • Five Minute Assembly Work Life
    • Non Sag Placement Control
  • 3M EC-1357

    3M EC-1357

    • Fast Interior Contact Assembly
    • Positioning Time Before Contact
    • Flexible Coating Method Selection
  • 3M EC-3500

    3M EC-3500

    • Low Density Core Splicing
    • Edge And Void Filling
    • Multi Step Panel Assembly
  • 3M EC-3515

    3M EC-3515

    • Lightweight Aerospace Void Filling
    • Honeycomb Edge Sealing Control
    • Flexible Ambient Or Heat Cure
  • 3M EC-3532

    3M EC-3532

    • Tough Impact Resistant Assembly
    • Rapid Non Sag Placement
    • Primed Multi Material Bonding
  • 3M EC-3549

    3M EC-3549

    • High Peel Structural Durability
    • Impact Resistant Urethane Bonding
    • Controlled Sag Resistant Placement
  • 3M EC-3587

    3M EC-3587

    • Structural Bonding And Fairing
    • Selectable Assembly Work Life
    • Sandable Non Sag Gap Filling
  • 3M EC-5816

    3M EC-5816

    • Flexible Abrasion-Resistant Protection
    • Spray Brush or Flow Application
    • 30-Minute Tack-Free Drying
  • 3M ES-2000

    3M ES-2000

    • Clear High-Gloss Edge Seal
    • Controlled 1:1 Duo-Pak Application
    • 25-Minute Tack-Free Time
  • 3M EZ250120

    3M EZ250120

    • Medium-Set Wood Assembly
    • Thin-Bondline Warm Application
    • Moisture-Curing One-Part Processing
  • 3M EZ250150

    3M EZ250150

    • Extended 2 to 4 Minute Open Time
    • Aluminum or Glass to Wood or Plastic
    • Flexible Cured Adhesive Layer
  • 3M PTFE5490

    3M PTFE 5490

    • Low-Friction Non-Stick Surface
    • Flat Extruded PTFE Backing
    • Clean-Removal Silicone Adhesive
  • 3M RP2110

    3M RP2110

    • Aircraft Erosion-Protection Repair
    • Controlled 1:1 Cartridge Dispensing
    • Ten-Minute Working Window
  • 3M SJ3526N

    3M SJ3526N

    • Quick Reclosable Hook Attachment
    • Rubber PSA for Low-Energy Plastics
    • Manual or Automated Installation
  • 3M SJ3571

    3M SJ3571

    • Reclosable Loop Fastening
    • Acrylic PSA Installation
    • Configurable Roll Conversion
  • 3M SJ5816

    3M SJ5816

    • Die-Cut Protective Conversion
    • Skid-Resistant Polyurethane Cushioning
    • High-Tack PSA Installation
  • 3M TE031

    3M TE031

    • 30-Second Handling Strength
    • Two-Minute Assembly Window
    • Flexible Plastic Bonding
  • ABLESTIK 3119

    ABLESTIK 3119

    • Low-Temperature Heat Cure
    • No-Mix Electronics Assembly
    • Extended Three-Week Pot Life
  • ABLESTIK 5074

    ABLESTIK 5074

    • Flexible Dissimilar-Material Bonding
    • Multiple Heat-Cure Options
    • Reworkable Non-Conductive Film
  • ABLESTIK 642-1

    ABLESTIK 642-1

    • Extended 8-Hour Assembly Window
    • Multiple Heat-Cure Schedules
    • Low-Outgassing Assembly Bonding
  • ABLESTIK 64C

    ABLESTIK 64C

    • Non-Silver Conductive Bonding
    • Room-Temperature or Heat Cure
    • Seawater-Exposure Assembly Fit
  • ABLESTIK CE 3511PHV

    ABLESTIK CE 3511PHV

    • Extended Dispensing Pot Life
    • No-Bleed Conductive Placement
    • Fast Hot-Plate Cure Option
  • ABLESTIK FS163

    ABLESTIK FS163

    • Equal-Weight BIPAX Mixing
    • Room-Temperature or Heat Cure
    • Broad-Material Industrial Bonding
  • ABLESTIK G757HF-D

    ABLESTIK G757HF-D

    • Automotive Headlamp Lens Bonding
    • Thixotropic Sag-Resistant Placement
    • Flexible -40 to 150 deg C Operation
  • ABLESTIK ICP9000

    ABLESTIK ICP9000

    • Semi-Sintering Power Die Attach
    • Extended 16-Hour Work Life
    • Thermal and Electrical Attach Path
  • ALPHA 100

    ALPHA 100

    • Non-Activated Type R Flux
    • IPC J-STD-004 ROL0 Classification
    • Extended 1,080-Day Shelf Life
  • ALPHA 2110

    ALPHA 2110

    • Aqueous Rosin Residue Removal
    • Multiple Cleaning Equipment Formats
    • Stable Silicone-Free Wash Solution
  • ALPHA 3355-11

    ALPHA 3355-11

    • VOC-Free Water-Soluble Fluxing
    • Flexible Multi-Method Application
    • Thorough Water-Residue Removal
  • ALPHA 425

    ALPHA 425

    • Controlled Flux Property Restoration
    • Specific-Gravity Maintenance Support
    • Long-Interval Process Inventory
  • ALPHA 611

    ALPHA 611

    • Dense Plated-Through-Hole Coverage
    • Controlled RMA Rosin Activity
    • Cleanable Critical-Assembly Residues
  • ALPHA 615

    ALPHA 615

    • Fast High-Activity RMA Wetting
    • Flexible Foam-or-Spray Processing
    • Cleanable High-Preheat Residues
  • ALPHA 615-15

    ALPHA 615-15

    • Low-Solids Surface-Mount Selection
    • Flexible Foam-or-Spray Processing
    • Defined Flux-Control Window
  • ALPHA 856

    ALPHA 856

    • Neutral Buffered Residue for Water Cleaning
    • Fast-Recovering Foam for Production Coverage
    • Defined Four-Hour Cleaning Window
  • ALPHA 857

    ALPHA 857

    • Foam and Spray Process Flexibility
    • Controlled Specific-Gravity Flux Consistency
    • Water-Washable Residues Without Rinse Aids
  • ALPHA 90IA

    ALPHA 90IA

    • High-Activity Difficult-Metal Soldering
    • Low-Temperature Light-Gauge Processing
    • Defined Acid-Wash Residue Removal
  • ALPHA CVP 520

    ALPHA CVP 520

    • Low-Temperature Reflow for Sensitive Assemblies
    • Extended Eight-Hour Stencil Life
    • Configurable Alloy and Powder Selection
  • ALPHA EF6000

    ALPHA EF6000

    • Low-Residue Rosin-Free No-Clean Flux
    • Broad Lead-Free and Tin-Lead Window
    • Reduced Solder-Ball and Bridging Tendency
  • ALPHA EF-6808HF

    ALPHA EF-6808HF

    • High-Density Hole-Fill Performance
    • Low-Bridging Wave Soldering
    • Transparent Pin-Testable Residue
  • ALPHA EF8300LR

    ALPHA EF8300LR

    • Greater Than 96% Hole Fill
    • Low-Bridging Cu-OSP Soldering
    • Halide-Free Tack-Free Residue
  • ALPHA EF-9301

    ALPHA EF-9301

    • Greater Than 95% Hole Fill
    • Low-Bridging SMT Soldering
    • Spray or Foam Fluxing
  • ALPHA HF-1

    ALPHA HF-1

    • Wide reflow profile window supporting air and nitrogen reflow with straight-ramp or soak profiles up to 300 °C.
    • ROL0, halide-free flux system with residue suitable to remain on the circuit board without cleaning.
    • Broad rework capability covering touch-up, hand soldering, BGA repair/re-balling, and QFN/LGA repair.
  • ALPHA K75I

    ALPHA K75I

    • ALPHA K75-I provides a high-purity isopropyl alcohol and de-ionized water extract solution designed for ionic cleanliness testing in compliance with MIL-P-28809.
    • ALPHA K99-I provides a dedicated isopropyl-alcohol-based make-up solution for restoring K75-I to the desired alcohol/water ratio.
    • The complementary K75-I/K99-I system supports regular alcohol-percentage adjustment to maintain the accuracy of the ionic test instrument procedure.
  • ALPHA NR200

    ALPHA NR200

    • Low-Residue Pin-Test Surface
    • Foam, Spray, or Wave Fluxing
    • High-SIR Tack-Free Surface
  • ALPHA NR330

    ALPHA NR330

    • VOC-Free Water-Based Processing
    • Low Bridging and Solder Balls
    • Non-Tacky Pin-Testable Residue
  • ALPHA SLS65

    ALPHA SLS65

    • Thermally Stable Bridge Control
    • Low Solder-Ball Tendency
    • Foam, Wave, or Spray Application
  • ALPHA SLS65C

    ALPHA SLS65C

    • Low-solids, no-clean flux formulated to reduce solder balling and solder bridging in wave and chip-wave soldering.
    • Very low level of non-tacky residue supports pin testing while allowing residues to remain on the board without cleaning.
    • Supports foam, wave, and spray application methods with documented Bellcore and IPC electrical test performance.
  • ALPHA SM351F

    ALPHA SM351F

    • Fast-Wetting Foam and Wave Flux
    • Tack-Free Pin-Testable Residue
    • Halide-Free Low-Solids Formulation
  • ARATHANE 7760-1

    ARATHANE 7760-1

    • Automated Non-Slump Dispensing
    • 630 V/mil Dielectric Strength
    • 0.8 W/m-K Thermal Conductivity
  • ARATHANE 7762-1

    ARATHANE 7762-1

    • Controlled 5 mil Bondline
    • Two-Hour Working Life
    • Automated Non-Slump Dispensing
  • BIOACT CCR-8

    BIOACT CCR-8

    • No-Heat Coating Removal
    • Manual or Immersion Cleaning
    • Controlled Solvent Evaporation
  • BONDERITE C-AK 319

    BONDERITE C-AK 319

    • Spray-or-Immersion Application Flexibility
    • Effective Across Wide Concentration Range
    • Multi-Metal Pre-Plating Surface Prep
  • BONDERITE C-AK 3878-LF-NC

    BONDERITE C-AK 3878-LF-NC

    • Chromate- and Chlorine-Free Formula
    • Vapor-Degreasing Fluid Replacement
    • Shop Soil and Cutting-Oil Removal
  • BONDERITE C-AK 4181-L

    BONDERITE C-AK 4181-L

    • Single-Step Rust and Corrosion Removal
    • Immersion, Electrolytic, or Ultrasonic Use
    • AMS-1379 Aerospace Specification Testing
  • BONDERITE C-AK 4338

    BONDERITE C-AK 4338

  • BONDERITE C-AK 5578-L

    BONDERITE C-AK 5578-L

    • Combined Cleaning and Titanium Etching
    • Pre-Bonding Surface Etch Preparation
    • Concentration-Controlled Process Flexibility
  • BONDERITE C-IC 4104

    BONDERITE C-IC 4104

    • Nitric Acid Descaling Enhancement
    • Multi-Alloy Pickling Compatibility
    • Alloy-Tailored Bath Formulation
  • BONDERITE C-MC 5884

    BONDERITE C-MC 5884

    • MIL-C-85704C Type I Qualification
    • GE and Pratt and Whitney Engine Listings
    • Ash-Free Water-Miscible Cleaning
  • BONDERITE C-SO 4460

    BONDERITE C-SO 4460

    • BMS 11-7G Wipe-Solvent Qualification
    • Rapid Residue-Free Evaporation
    • Multi-Metal Pretreatment Wiping
  • BONDERITE L-AD 42

    BONDERITE L-AD 42

    • Organosilicone Surfactant Foam Control
    • Free-Rinsing Low-Residue Chemistry
    • Polymer, Adhesive, and Latex Foam Control
  • BONDERITE L-GP-D148A

    BONDERITE L-GP-D148A

    • PTFE Dry-Film Lubricant Formation
    • Spray-Viscosity Thinning Compatibility
    • Room-Temperature Cure with Heat Acceleration
  • BONDERITE M-CR 120

    BONDERITE M-CR 120

    • Two-Step Aluminum Deoxidizing and Coating
    • Manual Brush-Applied Aluminum Treatment
    • Pre-Portioned Two-Component Kit Packaging
  • BONDERITE S-AD 103

    BONDERITE S-AD 103

    • Acid-Bath Corrosion Inhibition
    • Direct Liquid Addition to Acid Baths
    • Industrial Metal-Cleaning Bath Support
  • BOSTIK L1685MC

    BOSTIK L1685MC

    • Neoprene and Butyl Membrane Adhesion
    • Room-Temperature Contact Bonding
    • Broad Multi-Substrate Bonding Range
  • BOSTIK LIQ1096MR

    BOSTIK LIQ1096MR

    • Fast-Tack Contact Adhesion
    • One-Part or Two-Part Configuration Flexibility
    • Rubber-Gasket Installation Use
  • BOSTIK NSBT-16

    BOSTIK NSBT-16

    • Copper-Graphite Anti-Seize Protection
    • Up to 1800 deg F
    • Brush-Top Assembly Application
  • BOSTIK NSBT-16N

    BOSTIK NSBT-16N

    • Copper-Free High-Temperature Protection
    • Seizure and Galling Control
    • Aggressive-Service Assembly Lubrication
  • BOSTIK NSBT-8N

    BOSTIK NSBT-8N

    • Copper-Free Pure-Nickel Protection
    • Severe-Service Assembly Protection
    • Compact 8 oz Package
  • CHEMLOK 6411

    CHEMLOK 6411

    • 30-Minute Room-Temperature Dry
    • 12.7 to 25.4 um Film
    • Brush, Roll, Dip or Spray
  • CONATHANE AD-6415

    CONATHANE AD-6415

    • Two-Part Polyurethane Adhesive
    • 1:2 Cartridge or Bulk
    • Filtration Membrane Bonding
  • COOLTHERM EP-6252

    COOLTHERM EP-6252

    • Defined Epoxy Hardener Component
    • Electrical Encapsulation System Use
    • Component-Level Metering Control
  • CYBERBOND 2000

    CYBERBOND 2000

    • Low-Viscosity Wicking Bonding
    • Fast Preassembled-Part Fixing
    • Single-Component Drop Dispensing
  • CYBERBOND 2008

    CYBERBOND 2008

    • Fast EPDM and Elastomer Bonding
    • Low-Viscosity Close-Fit Wetting
    • Single-Component Rapid Assembly
  • CYBERBOND 2010

    CYBERBOND 2010

    • 20-Second General-Purpose Fixture
    • Controlled Low-Viscosity Application
    • 2,920 psi Stainless-Steel Shear
  • CYBERBOND 2075

    CYBERBOND 2075

    • High-Viscosity Gap-Filling Bonding
    • Controlled Joint Placement
    • Single-Component Fast Assembly
  • CYBERBOND 2077

    CYBERBOND 2077

    • Medium-Viscosity Placement Control
    • Fast Rubber-Compound Bonding
    • Metal, Plastic, and Rubber Fit
  • CYBERBOND 2150

    CYBERBOND 2150

    • High-Viscosity Bead Placement
    • Small-Gap Joint Filling
    • Single-Component Rapid Bonding
  • CYBERBOND 2999

    CYBERBOND 2999

    • Surface-Insensitive Porous-Material Bonding
    • Thixotropic Vertical-Surface Control
    • High-Viscosity Gap Filling
  • CYBERBOND 6001

    CYBERBOND 6001

    • Cyanoacrylate cure acceleration
    • Flexible application methods
    • Ultra-low viscosity
  • CYBERBOND 6020

    CYBERBOND 6020

    • Targeted Cyanoacrylate Residue Removal
    • Low-Viscosity Surface Treatment
    • Repeat-Application or Soak Removal
  • DEVCON SF5MIN

    DEVCON SF5MIN

    • Fast Five-Minute Metal Repair
    • Non-Sag Vertical Rebuilding
    • Machinable Steel-Filled Repairs
  • DOWSIL 520

    DOWSIL 520

    • Water-Dilutable 40% Active Emulsion
    • Deep Mineral-Substrate Penetration
    • Substrate-Specific Water Repellency
  • ECCOBOND LUX OGR146TUV

    ECCOBOND LUX OGR146TUV

    • UV and Shadow-Area Thermal Cure
    • Low-Refractive-Index Optical Bonding
    • Extended 91-Day Working Window
  • ELANTAS S-13

    ELANTAS S-13

    • Dedicated Resin-Reduction Function
    • Single-Product Solvent Blend
    • Controlled Formulation Adjustment
  • ELANTAS UF-3

    ELANTAS UF-3

    • Room-Temperature Foam Cure
    • Expanding Electronic Void Fill
    • Assembly-Conforming Foam Packaging
  • ENTHONE 20/A

    ENTHONE 20/A

    • Two-Hour Mixed-Ink Pot Life
    • Ambient or Heat Cure
    • Permanent Marking Application Flexibility
  • ENTHONE 45

    ENTHONE 45

    • M- and 50-Series Compatibility
    • Catalyst-Selected Cure Control
    • Permanent Marking System Integration
  • ENTHONE 50

    ENTHONE 50 Series

    • Ambient or Heat-Cure Flexibility
    • Multi-Method Permanent Marking
    • Chemical- and Thermal-Resistant Films
  • ENTHONE 77

    ENTHONE 77

    • Ambient or Heat-Cure Choice
    • One-Hour Ink Pot Life
    • Heat-Enhanced Adhesion Development
  • ENTHONE AD2001

    ENTHONE AD2001

    • Incremental 3 to 6% Thinning
    • Post-Induction Process Control
    • Extended Ink Pot Life
  • ENTHONE AD2002

    ENTHONE AD2002

    • Spray-Application Viscosity Control
    • Air-Pressure and Orifice Adjustment
    • Extended Catalyzed-Ink Pot Life
  • ENTHONE AD2003

    ENTHONE AD2003

    • Extended Marking-Ink Open Time
    • Incremental 3 to 6% Addition
    • In-Process Machine-Marking Adjustment
  • ENTHONE AD3002

    ENTHONE AD3002

    • Two to Four Percent Flow Adjustment
    • Crawling and Pinholing Control
    • Gentle Post-Induction Mixing
  • ENTHONE B13/28

    ENTHONE B13/28

    • Accelerated Three-Day Ambient Cure
    • One-Hour Processing Window
    • Nonconductive Black Ink Compatibility
  • ENTHONE B3

    ENTHONE B3

    • Four-Hour Ink Pot Life
    • Controlled Heat-Cure Processing
    • Faster Cure at Higher Temperature
  • ENTHONE M Series

    ENTHONE M Series

    • Five-Method Permanent Marking
    • One to 24-Hour Pot-Life Options
    • Humidity-Conditioned Electrical Insulation
  • EPOTEK 301-2

    EPOTEK 301-2

    • Low-Viscosity Capillary Processing
    • Extended 8-Hour Pot Life
    • Optical Encapsulation and Bonding
  • EPOTEK 360

    EPOTEK 360

    • Capillary-Flow Underfill Processing
    • Cure-Activated Color Inspection
    • High-Temperature Optical Epoxy
  • EPO-TEK 377

    EPO-TEK 377

    • Low-Viscosity Optical Processing
    • 24-Hour Mixed Pot Life
    • High-Transmission Fiber-Optic Epoxy
  • EPO-TEK 921-FL

    EPO-TEK 921-FL

    • Thermally Conductive Electrical Insulation
    • Six-Hour Mixed Pot Life
    • Adhesive, Seal, and Potting Versatility
  • EPOTEK H20E

    EPOTEK H20E

    • Electrically Conductive Die Attach
    • 2.5-Day Mixed Pot Life
    • Dispensable, Printable Silver Paste
  • EPOTEK H70E

    EPOTEK H70E

    • Thermal Conduction with Electrical Isolation
    • 56-Hour Mixed Pot Life
    • Rapid One-Minute Snap-Cure Option
  • EPOXYLITE MR101

    EPOXYLITE MR101

    • Thixotropic Minimal-Flow Masking
    • Fifteen-to-Thirty-Minute Air Dry
    • High-Temperature Dry-Film Stability
  • FREKOTE 710-LV

    FREKOTE 710-LV

    • Room-Temperature Semi-Permanent Release
    • High-Slip High-Gloss Finish
    • Controlled Two-Coat Application
  • FREKOTE PUR-100

    FREKOTE PUR-100

    • Water-Based Non-Flammable Release
    • Multiple Releases Per Application
    • Paint-Ready Molded Parts
  • LAIRD LS-30

    LAIRD LS-30

    • Compliant Polyurethane Foam Format
    • RF Isolation and Insertion Loss
    • Cavity Resonance Suppression
  • LAIRD MF-117

    LAIRD MF-117

    • Machinable RF Component Stock
    • 2.8 to 119 dB/cm Attenuation
    • Sheets, Rods and Bars
  • LAIRD PP-4

    LAIRD PP-4

    • 1.06 Low-Loss Dielectric Constant
    • 0.0001 Loss Tangent
    • Heat-Sealable Closed-Cell Foam
  • LAIRD RFLB/SS6M

    LAIRD RFLB/SS6M

    • Adhesive-Backed 0.51 mm Sheet
    • 10 MHz to 4 GHz Control
    • Greater Than 50 dB/cm Attenuation
  • LOCTITE 079

    LOCTITE 079

    • Serviceable Low-Strength Thread Locking
    • One-Part Anaerobic Application
    • Purple Visual Identification
  • LOCTITE 083

    LOCTITE 083

    • Medium-Strength Hand-Tool Removal
    • 8 N m Breakaway Torque
    • Controlled One-Part Application
  • LOCTITE 084

    LOCTITE 084

    • Low-Viscosity Thread Application
    • 6 N m Breakaway Torque
    • Medium-Strength Hand-Tool Removal
  • LOCTITE 087

    LOCTITE 087

    • High-Strength Coarse-Thread Retention
    • 11.3 to 28.3 N m Prevail Torque
    • One-Part Heat-Assisted Disassembly
  • LOCTITE 220

    LOCTITE 220

    • Wicking Preassembled Threadlocking
    • Low-Strength Hand-Tool Removal
    • UV-Visible Application Inspection
  • LOCTITE 222MS

    LOCTITE 222MS

    • Low-Migration Thixotropic Application
    • Easy Hand-Tool Disassembly
    • Small-Fastener Threadlocking Control
  • LOCTITE 2422

    LOCTITE 2422

    • High-Temperature Threadlocking Paste
    • Thixotropic Paste Application
    • Serviceable Medium-Strength Locking
  • LOCTITE 248

    LOCTITE 248

    • Clean Stick Application
    • Medium-Strength Metal Threadlocking
    • Active and Passive Metal Cure
  • LOCTITE 2620

    LOCTITE 2620

    • Elevated-Temperature Threadlocking Paste
    • Thixotropic Paste Placement
    • Medium-to-High Fastener Retention
  • LOCTITE 268

    LOCTITE 268

    • High-Strength Thread Retention
    • Self-Feeding Stick Control
    • Active and Passive Metal Cure
  • LOCTITE 2760

    LOCTITE 2760

    • Fast Anaerobic Cure
    • High-Strength Heavy-Duty Locking
    • Reduced Liquid Migration
  • LOCTITE 3092

    LOCTITE 3092

    • 5 mm Gap Filling
    • Non-Sag Vertical Bonding
    • Fast Instant Fixturing
  • LOCTITE 380

    LOCTITE 380

    • Rubber-Toughened Shock Resistance
    • Black Bondline Identification
    • Fast Multi-Substrate Fixturing
  • LOCTITE 4014

    LOCTITE 4014

    • Very-Low-Viscosity Precision Bonding
    • Fast Mixed-Material Fixturing
    • Heat-Conditioned Bond Strength
  • LOCTITE 408

    LOCTITE 408

    • Low-Odor Low-Blooming Bonding
    • Very-Low-Viscosity Joint Wetting
    • Rapid Porous-Material Fixturing
  • LOCTITE 420

    LOCTITE 420

    • Very-Low-Viscosity Capillary Bonding
    • Fast Close-Fitting Assembly
    • Broad Metal-Plastic-Rubber Bonding
  • LOCTITE 4210

    LOCTITE 4210

    • Elastomer-Toughened Impact Resistance
    • Low-Viscosity Thin-Gap Bonding
    • Fast Multi-Substrate Fixturing
  • LOCTITE 425

    LOCTITE 425

    • Fast Plated-Fastener Fixturing
    • Low-Strength Serviceable Retention
    • Pre- or Post-Applied Locking
  • LOCTITE 430

    LOCTITE 430

    • Low-Viscosity Metal Bonding
    • Fast Thin-Gap Fixturing
    • Broad Rubber-Plastic Compatibility
  • LOCTITE 4307

    LOCTITE 4307

    • Rapid UV Surface Cure
    • Humidity Secondary Cure
    • Fluorescent Application Inspection
  • LOCTITE 431

    LOCTITE 431

    • Medium-Viscosity Application Control
    • Rapid Multi-Material Bonding
    • Strong Shear-Oriented Performance
  • LOCTITE 435

    LOCTITE 435

    • Rubber-Toughened Peel Resistance
    • Low-Viscosity Rapid Bonding
    • Porous-Material Bonding Range
  • LOCTITE 438

    LOCTITE 438

    • Black Rubber-Toughened Bonding
    • Enhanced Shock and Peel Resistance
    • Low-Viscosity Multi-Material Assembly
  • LOCTITE 460

    LOCTITE 460

    • Low-Odor Low-Blooming Cure
    • Very Fast Porous-Substrate Fixturing
    • Low-Viscosity Vapor-Controlled Bonding
  • LOCTITE 493

    LOCTITE 493

    • Very-Low-Viscosity Capillary Bonding
    • Fast Metal-Focused Fixturing
    • Broad Rubber-Plastic Bonding
  • LOCTITE 542

    LOCTITE 542

    • Low-Viscosity Fine-Thread Sealing
    • Anaerobic One-Part Application
    • Medium-Strength Serviceable Retention
  • LOCTITE 571

    LOCTITE 571

    • Medium-Viscosity Tapered-Thread Sealing
    • Anaerobic One-Part Retention
    • Fluid-Exposure Strength Retention
  • LOCTITE 635

    LOCTITE 635

    • High-Strength Cylindrical Retention
    • Medium-Viscosity Application Control
    • Anaerobic One-Part Metal Cure
  • LOCTITE 641

    LOCTITE 641

    • Serviceable Medium-Strength Retention
    • Controlled Medium-Viscosity Flow
    • Anaerobic One-Part Metal Cure
  • LOCTITE 662

    LOCTITE 662

    • Anaerobic-and-UV Dual Cure
    • Fast Exposed-Bead Fixturing
    • High-Strength Cylindrical Retention
  • LOCTITE 713

    LOCTITE 713

    • Pre- or Post-Applied Activation
    • Rapid 30-Second Drying
    • Short Controlled On-Part Window
  • LOCTITE 8060

    LOCTITE 8060

    • High-Temperature Anti-Seize Protection
    • Controlled Stick Application
    • Measured Assembly Torque Behavior
  • LOCTITE 88

    LOCTITE 88

    • Organic Air-Release Performance
    • Multi-Resin Formulation Scope
    • Vacuum De-Airing Process Support
  • LOCTITE ECI1016

    LOCTITE ECI1016

    • High-Speed Rotary Screen Printing
    • Low-Resistance Silver Conductive Traces
    • Two-Minute Hot-Air Drying
  • LOCTITE EDAG 33RO65A

    LOCTITE EDAG 33RO65A

    • High-Speed Conductive Printing
    • Graphite-Polyimide Temperature Stability
    • Low-Resistance Printed Conductivity
  • LOCTITE HC9872.1

    LOCTITE HC 9872.1

    • Low-density syntactic core costruction
    • Excellent moisture resistance
    • Compatible with 350°F epoxy prepregs
  • LOCTITE LB8017

    LOCTITE LB8017

    • Multi-Method Dry-Film Application
    • 400 deg C Sliding Service
    • 1315 deg C Anti-Seize Range
  • LOCTITE LB8504

    LOCTITE LB8504

    • Non-Metallic Conductive Anti-Seize
    • 482 deg C Operating Range
    • 0.13 Steel Fastener Torque Coefficient
  • LOCTITE NS5109

    LOCTITE NS5109

    • High-Temperature Flexible Sealing
    • High-Pressure Sealing up to 34 MPa
    • One-Part No-Mix Application
  • LOCTITE PC6231

    LOCTITE PC6231

    • Rapid 90-Minute Full Cure
    • Self-Leveling Low-Viscosity Fill
    • 10-15% Joint Movement Capability
  • LOCTITE SF7070

    LOCTITE SF7070

    • Low-Viscosity Precision Cleaning
    • 5-20 Minute Drying Window
    • Spray, Wipe, or Immersion Use
  • LOCTITE SF7471

    LOCTITE SF7471

    • Fast 30-70 Second Drying
    • Low-Temperature Cure Acceleration
    • Seven-Day On-Part Life
  • LOCTITE SF7649

    LOCTITE SF7649

    • Thirty-Day On-Part Life
    • Low-Temperature Cure Acceleration
    • Brush, Spray, or Pre-Applied Use
  • LOCTITE UK2073

    LOCTITE UK2073

    • Low-Energy Plastic Bonding
    • Nominal 2:1 Meter-Mix Processing
    • Elastic 300% Elongation
  • LOCTITE UK2173

    LOCTITE UK2173

    • Low-Energy Plastic Bonding
    • Nominal 2:1 Meter-Mix Processing
    • Elastic 300% Elongation
  • LOCTITE UK3173

    LOCTITE UK3173

    • Low-Viscosity Resin Handling
    • 45-Minute System Work Time
    • Flame-Retardant Potting System
  • LOCTITE UK3184

    LOCTITE UK3184

    • UK 3173 System Hardener
    • 45-Minute System Work Time
    • 24-Hour Room-Temperature Cure
  • LOCTITE UK3364

    LOCTITE UK3364

    • 60-120 Second Gel Time
    • 1:2 Volume Mix Ratio
    • Rigid Fiber-Optic Encapsulation
  • LORD 7542D

    LORD 7542D

    • Equal 1:1 Volume Mixing
    • 20-30 Minute Working Time
    • 70% Cured Elongation
  • MOLYKOTE BG-20

    MOLYKOTE BG-20

    • DN 750,000 High-Speed Operation
    • Medium-to-Heavy Load Lubrication
    • -45 to 180 deg C Service
  • MOLYKOTE G-1023

    MOLYKOTE G-1023

    • Steel/GFRP Friction Control
    • -45 to 120 deg C Service
    • Automatic Dispensing Compatible
  • MOLYKOTE G2008

    MOLYKOTE G2008

    • High-Speed Gear Lubrication
    • 30 cSt Synthetic Base Oil
    • -40 to 130 deg C Service
  • MOLYKOTE G684OZTUBES

    MOLYKOTE G684OZTUBES

    • Plastic Gear Friction Control
    • 75 mm2/s Base Oil
    • Brush-to-Central System Application
  • MOLYKOTE P-1042

    MOLYKOTE P-1042

    • 9,000 N Weld Load
    • Water-Emulsion Washout Resistance
    • High-Tack Metal Surface Adhesion
  • MOLYKOTE P-1900

    MOLYKOTE P-1900

    • 3,200 N Weld Load
    • Controlled 0.10 Bolt Friction
    • -30 to 300 deg C Service
  • MOLYKOTE P-3700

    MOLYKOTE P-3700

    • High-Purity Solid-Lubricant Paste
    • 3,000 N Weld Load
    • Controlled M12 Fastener Friction
  • MOLYKOTE P-74

    MOLYKOTE P-74

    • Metal-Free Anti-Seize Formulation
    • 4,800 N Weld Load
    • Controlled M12 Fastener Friction
  • PERMABOND 41

    PERMABOND 41

    • 30-Minute On-Part Life
    • Brush, Wipe, or Spray
    • No-Mix Acrylic Initiation
  • PERMABOND 43

    PERMABOND 43

    • 10 mPa s Low Viscosity
    • 30-Minute On-Part Life
    • Immediate No-Mix Assembly
  • PERMABOND 46

    PERMABOND 46

    • No-Mix Surface Activation
    • Two-Hour Assembly Window
    • Low-Viscosity Controlled Application
  • PERMABOND 4C40

    PERMABOND 4C40

    • Fast 5-10 Second Fixture
    • 0.43 mm Gap Filling
    • Medical-Device Cyanoacrylate Bonding
  • PERMABOND MM115

    PERMABOND MM115

    • 10-Minute Handling Strength
    • Controlled Medium-Strength Off-Torque
    • Serviceable Thread Locking and Sealing
  • PERMABOND MT382

    PERMABOND MT382

    • Self-Leveling Electronic Potting
    • Extended 20-50 Minute Pot Life
    • High-Elongation Modified Epoxy
  • PERMABOND PT328

    PERMABOND PT328

    • 15-20 Minute Pot Life
    • 5 mm Gap Filling
    • 12-18 MPa Steel Shear
  • PERMABOND QFS16

    PERMABOND QFS16

    • 5-Second Steel Set Time
    • Faster Cure Through Gaps
    • Reduced Plastic Stress Cracking
  • PERMABOND TA4246

    PERMABOND TA4246

    • 1-2 Minute Aluminum Fixture
    • 33-35 N/mm2 Steel Shear
    • No-Mix Initiator 46 System
  • PERMABOND TA4810

    PERMABOND TA4810

    • As-Received Metal Bonding
    • Non-Sag 2 mm Gap Filling
    • Fast Working-Strength Development
  • PLEXUS AO420

    PLEXUS AO420

    • Controlled 4-6 Minute Assembly
    • Broad 0.75-9.5 mm Gap Range
    • Balanced Strength and Elongation
  • PLEXUS MA1020

    PLEXUS MA1020

    • Very Low Cure Shrinkage
    • Fast 15-20 Minute Strength Build
    • Broad 0.75-9.5 mm Gap Range
  • PLEXUS MA2045

    PLEXUS MA2045

    • Extended 45-50 Minute Work Window
    • Vertical Non-Sag Placement
    • Deep 38 mm Gap Bonding
  • PLEXUS MA300/3000

    PLEXUS MA300/3000

    • Simple 1:1 Meter-Mix Processing
    • Fast 3-6 Minute Assembly
    • High-Strength Stiff Cured Bond
  • PLEXUS MA320

    PLEXUS MA320

    • Controlled 10-11 Minute Assembly
    • Broad 0.75-9.5 mm Gap Range
    • Flexible 40-80% Cured Elongation
  • PLEXUS MA420FS

    PLEXUS MA420FS

    • Rapid 1-2 Minute Work Window
    • Controlled 1-4 mm Gap Range
    • Robotic Plastic Assembly Fit
  • PLEXUS MA420W

    PLEXUS MA420W

    • Fast 3-4 Minute Assembly
    • Rapid 13.5-Minute Strength Build
    • Wide 0.25-9.5 mm Gap Range
  • PLEXUS MA425

    PLEXUS MA425

    • 30-35 Minute Working Time
    • Non-Sag Thixotropic Dispensing
    • 30-50% Typical Elongation
  • PLEXUS MA440

    PLEXUS MA440

    • Self-Leveling Two-Part System
    • 15 MPa Typical Tensile Strength
    • 121 deg C Air Service Limit
  • PLEXUS MA530

    PLEXUS MA530

    • 30-40 Minute Working Time
    • Up to 18 mm Gap Tolerance
    • 90-160% Typical Elongation
  • PLEXUS MA590

    PLEXUS MA590

    • 90-105 Minute Working Time
    • Up to 38.1 mm Gap Fill
    • >130% Typical Elongation
  • PLEXUS MA8105

    PLEXUS MA8105

    • Primerless Multi-Material Bonding
    • Easy 1:1 Mixing
    • Low-Odor Non-Filled Formulation
  • PLEXUS MA8120

    PLEXUS MA8120

    • Low-Halogen Primerless System
    • Broad Coated-Metal Adhesion
    • Salt-Spray Environmental Resistance
  • PLEXUS MA830

    PLEXUS MA830

    • 4-6 Minute Working Time
    • Fast Primerless Metal Assembly
    • 2,610-3,190 psi Tensile Strength
  • PLEXUS MA920

    PLEXUS MA920

    • Fast 4-6 Minute Working Window
    • Low-Odor Structural Bonding
    • Balanced Strength and Elongation
  • PRC-DESOTO PR 1775

    PRC-DESOTO PR 1775

    • Non-Chromate Corrosion Barrier
    • Selectable Class B Work Life
    • Fuel-Exposed Elastomeric Seal
  • PRC-DESOTO PR 1776M

    PRC-DESOTO PR 1776M

    • Low-Density Fuel-Tank Sealing
    • Multi-Grade Class B Work Life
    • Fuel-Resistant Elastomeric Seal
  • PRC-DESOTO PR 870B1/2

    PRC-DESOTO PR 870B1/2

    • Class B-1/2 Processing Window
    • Corrosion-Inhibitive Dissimilar-Metal Seal
    • High-Elongation Cured Seal
  • RESIN DESIGNS EMI-CSI-M3

    RESIN DESIGNS EMI-CSI-M3

    • Combined EMI Shielding and Sealing
    • No-Mix Precured Rope Installation
    • -40 to 150 deg C Operation
  • ROYAL HYDRA FAST-EN DC12623

    ROYAL HYDRA FAST-EN DC12623

    • One-part waterborne spray format
    • Wet or dry mating
    • Soft supple adhesive layer
  • ROYAL QT-2

    ROYAL QT-2

    • Accelerates curing of compatible instant adhesive
    • Supports curing on porous materials
    • Low-viscosity 3 cps acetone-based formulation
  • ROYAL RP-5

    ROYAL RP-5

    • Fast-setting general-purpose adhesive with 5-second fixture
    • Low 5 cps viscosity
    • Grit-blasted steel shear strength of 28 N/mm²
  • ROYAL WS-8010

    ROYAL WS-8010

    • Low-adhesion removable gasket
    • Two Class B work lives
    • Low-sag room-temperature cure
  • ROYAL WS-8020RC

    ROYAL WS-8020RC

    • Rapid room-temperature cure
    • Low-sag thixotropic application
    • Fuel and oil resistance
  • ROYAL WS-8032

    ROYAL WS-8032

    • Ultra-lightweight Class B system
    • Fast room-temperature cure
    • Low-sag extrusion handling
  • ROYAL WS-8032S

    ROYAL WS-8032S

    • Ultra-lightweight mixed density
    • Two Class B work lives
    • 360 deg F intermittent exposure
  • ROYAL WS-8035

    ROYAL WS-8035

    • Rapid-cure Class B profile
    • Lightweight cured specific gravity
    • Documented electrical resistivity
  • ROYAL WS-8070

    ROYAL WS-8070

    • Corrosion-inhibitive aerospace sealing
    • Non-sag extrusion handling
    • Two Class B work lives
  • ROYAL WS-8072

    ROYAL WS-8072

    • Selectable B-1/2 and B-2 work lives
    • Non-sag extrusion and spatula application
    • Corrosion-inhibitive aircraft sealing
  • SIKAFLEX 201

    SIKAFLEX 201

    • Long Four-Hour Skin Time
    • Non-Sag Industrial Joint Sealing
    • Sandable and Paintable Surface
  • SIKAFLEX 252

    SIKAFLEX 252

    • Dynamic-Stress Assembly Bonding
    • Non-Sag Gap-Filling Application
    • Electrically Non-Conductive Bondline
  • SIKAFLEX 255FC

    SIKAFLEX 255FC

    • Fast-Curing Direct Glazing
    • 20-Minute Glazing Open Time
    • Non-Sag Glazing Bead Application
  • SIKAFLEX 268

    SIKAFLEX 268

    • Accelerated Cure Process Option
    • Rail Cleaning-Agent Resistance
    • Exterior Rail Glazing and Assembly
  • SIKAFLEX 295UV

    SIKAFLEX 295UV

    • Organic-Glass Marine Bonding
    • Weather-Resistant Exterior Sealing
    • Defined 45-Minute Open Time
  • SIKAFLEX 715

    SIKAFLEX 715

    • Semi-Self-Leveling Roof Application
    • 30-Minute Skin Time
    • 500% Cured Elongation
  • SIKAFLEX P2G

    SIKAFLEX P2G

    • Primerless Automotive Glass Installation
    • 15-Minute Open Time
    • 5 MPa Tensile Strength
  • LOCTITE 4541

    LOCTITE 4541

    • Non-Drip Vertical Application
    • Fast Porous-Material Fixturing
    • Multi-Material Instant Bonding
  • 3M 100

    3M 100

    • Short-Term Exposure to 232 deg C
    • Metal and High-Surface-Energy Plastic Adhesion
    • Low-Outgassing Tape Construction
  • 3M 1099L

    3M 1099L

    • Approximately 40-Minute Open Time
    • Spray, Brush, or Roller Application
    • Water, Oil, and Fuel Resistance
  • 3M 1280

    3M 1280

    • 3.6 mil Polyester Tape
    • 33.9 N/100 mm Steel Adhesion
    • Low-Stretch PCB Masking
  • 3M 40

    3M 40

    • 0.025 mm Polyester Backing
    • Antistatic Handling of Static-Sensitive Electronics
    • Temperature Use Up to 130 deg C
  • 3M 4412N

    3M 4412N

    • 2.0 mm Sealing-Tape Thickness
    • Instantly Paintable Ionomer Backing
    • Immediate Seal Without Chemical Cure
  • 3M 4491

    3M 4491

    • Low-Viscosity Spray Application
    • Optional Heat-Cure Processing
    • Water, Fuel, and Oil Resistance
  • 3M 4693

    3M 4693

    • Approximate 20-Minute Open Bond Time
    • Polyolefin and Engineering-Plastic Bonding
    • Brush-Applied Room-Temperature Adhesive
  • 3M 48

    3M 48

    • 3 mil Unfused PTFE Tape
    • Typical -268 to 260 deg C Stability
    • Five-Year Shelf Life Under Stated Storage
  • 3M 5354

    3M 5354

    • Non-Curing Butyl Sealant Tape
    • Low Moisture-Vapor Transmission
    • Vertical, Overhead, and Corner Placement
  • 3M 590

    3M 590

    • 25 to 40-Minute Tack-Free Time
    • Polycarbonate and Acrylic Bonding
    • FMVSS 212 Crash Tested
  • 3M 800

    3M 800

    • 5 to 10-Minute Tack-Free Time
    • -54 to 93 deg C Service Range
    • Water, Oil, and Fuel Resistance
  • 3M 810

    3M 810

    • Visually Unobtrusive on Most Paper
    • 53% Renewable-Content Backing
    • Pen, Pencil, and Marker Writable
  • 3M 851

    3M 851

    • 4.0 Mil Tape Construction
    • Low-Stretch Polyester Backing
    • Undercut-Reducing Adhesive Coating
  • 3M 9690

    3M 9690

    • Dimensionally Stable PET Carrier for Die Cutting
    • 3M 300MP+ Acrylic Adhesive
    • 121 deg C Short-Term Exposure
  • 3M CA5

    3M CA5

    • 12 to 60-Second Handling Strength
    • 2,000 cP Uncured Viscosity
    • CID A-A-3097 Type II Class 3
  • 3M TE040

    3M TE040

    • 2-Minute Open Time
    • 40-Second Handling Strength
    • 7,000 cP Warm-Application Viscosity
  • ABLESTIK 2105

    ABLESTIK 2105

    • 20-Minute Pot Life
    • 6,000 mPa s Mixed Viscosity
    • 420 V/mil Dielectric Strength
  • ABLESTIK 2126

    ABLESTIK 2126

    • 30-Minute Pot Life
    • 40,000 mPa s Mixed Viscosity
    • -50 to 145 deg C Operation
  • ABLESTIK 2130

    ABLESTIK 2130

    • 20-Minute Pot Life
    • 12,000 mPa s Mixed Viscosity
    • 420 V/mil Dielectric Strength
  • ABLESTIK 2600BT

    ABLESTIK 2600BT

    • 20 W/(m K) Thermal Conductivity
    • 0.001 ohm-cm Volume Resistivity
    • 40 ppm/deg C CTE Below Tg
  • ABLESTIK 517-4-007/009

    ABLESTIK 517

    • Tack-Free Non-Conductive Film
    • 24-Hour Work Life at 25 deg C
    • 30-Minute 150 deg C Cure
  • ABLESTIK 539IA

    ABLESTIK 539IA

    • Polyester-Carrier Epoxy Film
    • 1-Month Work Life at 25 deg C
    • 1-Hour 150 deg C Cure
  • ABLESTIK 8177

    ABLESTIK 8177

    • 4-Minute 130 deg C Cure
    • 3.0 W/(m K) Thermal Conductivity
    • 0.0001 ohm cm Volume Resistivity
  • ABLESTIK 958

    ABLESTIK 958

    • Conductive And Non-Conductive Variants
    • Stress-Absorbing Die-Attach Options
    • 958-7 17 N/mm^2 Gold Lap Shear
  • ABLESTIK C990

    ABLESTIK C990

    • Silver-Filled Conductive Die Attach
    • Stamping-Compatible C 990 333
    • C 990 333 20-Second Hot-Plate Cure
  • ABLESTIK E3503-1

    ABLESTIK E3503-1

    • Thin-Bondline Thermal Adhesive
    • Electrically Non-Conductive Thermal Adhesive
    • Low-Temperature Heat Cure
  • ABLESTIK ECF506

    ABLESTIK ECF506

    • Glass-Fabric Bondline Control
    • 24-Hour Work Life at 25 deg C
    • 125 deg C Thermal Rework
  • ABLESTIK ECF 550X

    ABLESTIK ECF 550X

    • Three-Axis Electrical Conductivity
    • 2.1 W/(m K) Thermal Conductivity
    • 3-Day Work Life at 25 deg C
  • ABLESTIK XCE3104XL

    ABLESTIK XCE3104XL

    • 54,000 cP Viscosity
    • 2-Day Static Pot Life
    • 0.0005 ohm cm Volume Resistivity
  • ABLESTIK XCP3302NS

    LOCTITE ABLESTIK XCP 3302NS

    • 8-Hour Open Time After Dispense
    • 1.75 W/(m K) Thermal Conductivity
    • 0.0006 ohm cm Volume Resistivity
  • ALPHA EF-2100

    ALPHA EF-2100

    • 4.0 wt% Solids Content
    • ORL0 No-Clean Flux
    • Lead-Free Hole-Fill Performance
  • ALPHA EF-6103

    ALPHA EF-6103

    • 3.6 wt% Solids Content
    • Wave and Selective Soldering
    • 360-Day Shelf Life
  • ALPHA PF-2

    ALPHA PF-2

    • 1.9 wt% Solids Content
    • Spray-Only Flux Application
    • ORL0 Flux Classification
  • ALPHA PV-50

    ALPHA PV-50

    • Low-Solids Alcohol-Based Flux
    • Zero-Halogen No-Clean Chemistry
    • Low/No-Preheat Tabbing Process
  • ARADUR HW 5625-1

    ARADUR HW 5625-1

    • Curing-Accelerator Hardener Component
    • 3-Month Shelf Life, 5 to 25 deg C
    • Medium-Voltage Casting System Component
  • ARADUR HW 9029

    ARADUR HW 9029

    • Tan Paste Curing Agent
    • CW 9029 System Hardener
    • Electrical Insulation Casting Component
  • ARADUR HW 9102

    ARADUR HW 9102

    • Amine Hardener Component
    • Sealed Room-Temperature Storage
    • Room-Temperature-Cure Structural System
  • ARADUR HY 1235

    ARADUR HY 1235

    • Electrical Casting-System Hardener
    • Heat-Cure System Component
    • APG and Vacuum Casting Use
  • ARADUR HY 905

    ARADUR HY 905

    • Liquid Electrical Insulation Additive
    • Epoxy Resin System Component
    • Electrical Component Applications
  • ARADUR HY 906

    ARADUR HY 906

    • About 175 to 350 mPa s Viscosity
    • Room-Temperature Epoxy Compatibility
    • Two-Year Shelf Life
  • ARALDITE 2023-10

    ARALDITE 2023-10

    • 10-Minute Open Time
    • Up to 30 mm Gap Fill
    • 15.5 MPa Lap Shear
  • ARALDITE 2023-30

    ARALDITE 2023-30

    • Room-Temperature Methacrylate Cure
    • Up to 30 mm Gap Fill
    • 15.5 MPa Lap Shear
  • ARALDITE 2023-60

    ARALDITE 2023-60

    • 60-Minute Open Time
    • Up to 30 mm Gap Fill
    • 15.5 MPa Lap Shear
  • ARALDITE 2035

    ARALDITE 2035

    • Up to 204 deg C Service
    • 2:1 Volumetric Mix Ratio
    • 5500 psi Lap Shear
  • ARALDITE 2040

    ARALDITE 2040

    • 165% Elongation at Break
    • About 50000 cP Viscosity
    • 0.05 to 0.10 mm Bondline
  • ARALDITE 2053-05

    ARALDITE 2053-05

    • Five-Minute Open Time
    • At Least 50% Elongation
    • 17.6 MPa Lap Shear
  • ARALDITE 2053-15

    ARALDITE 2053-15

    • 15-Minute Open Time
    • 60% Elongation at Break
    • At Least 2175 psi Lap Shear
  • ARALDITE 2085

    ARALDITE 2085

    • Rapid Curing
    • Multi-Substrate Bonding
    • Elevated-Temperature Capability
  • ARALDITE AV4600

    ARALDITE AV4600

    • One-Component Heat-Cure Epoxy
    • Thixotropic Gap-Filling Paste
    • High Peel Strength
  • ARALDITE AV5308

    ARALDITE AV5308

    • Up to 10 mm System Non-Sag
    • Room-Temperature Epoxy System Cure
    • SMC and GRP Bonding
  • ARALDITE AV8504

    ARALDITE AV8504

    • Panel-Pin Aerospace Bonding
    • 10-Minute Minimum System Cure at 100 deg C
    • Sag-Resistant Toughened Epoxy System
  • ARALDITE AW9102

    ARALDITE AW9102

    • Approximately 80-Minute Pot Life at 25 deg C
    • 100:40 Resin-to-Hardener Weight Mix
    • 3,625 psi Steel Lap Shear
  • ARALDITE DY026

    ARALDITE DY026

    • 110 to 115 g/eq Epoxy Equivalent Weight
    • Difunctional Epoxy Reactive Diluent
    • Composite and Electrical Epoxy Formulations
  • AXAREL 4000

    AXAREL 4000

    • MIL-PRF-680 Type IV Cleaning
    • 147 deg F High-Flash Solvency
    • Low-Residue Heavy-Soil Removal
  • AXAREL 4100

    AXAREL 4100

    • Broad-Solvency Precision Cleaning
    • Fast, Low-Residue Drying
    • Manual or Immersion Processing
  • AXAREL 56

    AXAREL 56

    • Water-Rinsible Heavy-Soil Cleaning
    • Heated-Immersion Process Fit
    • Buffing-Compound and Grease Removal
  • AXAREL 850

    AXAREL 850

    • Low-Concentration Inline Defluxing
    • 1 mil Standoff Residue Removal
    • Non-Foaming Additive-Free Operation
  • AXAREL PD-680-II

    AXAREL PD-680-II

    • A-A-59601E Type II Degreasing
    • Full-Concentration Manual or Immersion Cleaning
    • Broad Oil and Grease Removal
  • BIOACT 145

    BIOACT 145

    • Non-Citrus CIC Removal
    • Spray, Immersion, or Hand Wipe
    • Pre-Finish Surface Preparation
  • BONDERITE C-AK 212

    BONDERITE C-AK 212

    • Silicate-Free Aluminum Cleaning
    • Low-Etch Oil and Oxide Removal
    • Spray or Immersion Processing
  • BONDERITE C-AK 305

    BONDERITE C-AK 305

    • Low-Foam Metal Strip Cleaning
    • Continuous Spray-Plant Processing
    • Controlled Alkaline Etching
  • BONDERITE C-AK 4848-257

    BONDERITE C-AK 4848-257

    • Aerospace Surface Preparation
    • Controlled Flood-and-Wipe Cleaning
    • 15-Minute Room-Temperature Drying
  • BONDERITE C-AK 6751-L

    BONDERITE C-AK 6751-L

    • Multi-Soil Metal Cleaning
    • Room-Temperature Water Rinsing
    • 30 to 60 deg C Operation
  • BONDERITE C-AK 6871

    BONDERITE C-AK 6871

    • Water-Dilutable Alkaline Concentrate
    • Painted or Unpainted Aircraft Cleaning
    • Spray or Foam Application
  • BONDERITE C-AK 9045-6

    BONDERITE C-AK 9045-6

    • Ready-to-Use Carbon Removal
    • 40 to 60 deg C Operation
    • Mechanically Agitated Tank Cleaning
  • BONDERITE C-AK 907

    BONDERITE C-AK 907

    • Steel Immersion Cleaning
    • Soil Redeposition Control
    • 1 to 5 Minute Processing
  • BONDERITE S-ST 5668-L

    BONDERITE S-ST 5668-L

    • Hot-Tank Paint Stripping
    • Liquid Coating Removal
    • Exact IDH 596959 Identification
  • BONDERITE C-MC 6802

    BONDERITE C-MC 6802

    • Platter Wax Removal
    • All-Metal Cleaning Capability
    • Chlorinated Hydrocarbon-Free Formulation
  • BONDERITE C-SO 263

    BONDERITE C-SO 263

    • Paint Equipment Residue Removal
    • Paint, Oil, and Grease Dissolution
    • Liquid Solvent Cleaning
  • BONDERITE L-AD42

    BONDERITE L-AD42

    • Surfactant Foam Control
    • 15 to 1000 ppm Dosing
    • Batch or Continuous Metering
  • BONDERITE L-GP 39SY201

    BONDERITE L-GP 39SY201

    • Visible Gear Alignment Pattern
    • Easy Brush Application
    • Homogeneous Lump-Free Paste
  • BONDERITE L-GP 6041

    BONDERITE L-GP 6041 CR

    • Extended Indoor Corrosion Protection
    • Non-Tacky Protective Film
    • Dip Spray or Hand Application
  • BONDERITE L-MR 9103

    BONDERITE L-MR 9103

    • Clear-View Machining Dilution
    • Oil-Rejecting Coolant Operation
    • Low-Foam Ferrous Metalworking
  • BONDERITE M-AD 131

    BONDERITE M-AD 131

    • Zinc-Phosphate Bath Acceleration
    • Near-Neutral pH Profile
    • Odorless Liquid Process Additive
  • BONDERITE M-AD 315

    BONDERITE M-AD 315

    • Controlled Silicofluoride Bath Adjustment
    • Defined 1.46 kg Addition Rate
    • Immersion or Spray Phosphating
  • BONDERITE M-AD 500

    BONDERITE M-AD 500

    • Dual Zinc and Iron Bath Adjustment
    • Controlled 1:4 Pre-Dilution
    • Stepwise pH Correction
  • BONDERITE M-AD40

    BONDERITE M-AD40

    • Strongly Alkaline Pretreatment Cleaning
    • Complete Water Solubility
    • Defined Low-Temperature Storage Boundary
  • BONDERITE M-FE 1070

    BONDERITE M-FE 1070

    • One-Step Cleaning and Conversion
    • Uniform Non-Metallic Phosphate Coating
    • Spray or Immersion Processing
  • BONDERITE M-FE 330SW

    BONDERITE M-FE 330SW

    • Three-Function Aluminum Pretreatment
    • Defined 60 to 120 deg F Window
    • Explicit High-Copper Alloy Exclusion
  • BONDERITE M-NT 601

    BONDERITE M-NT 601

    • Phosphate-Free Conversion Processing
    • Spray or Immersion Application
    • Multi-Metal Paint Preparation
  • BONDERITE M-ZN 1083

    BONDERITE M-ZN 1083

    • Spray-Process Metal Conversion
    • Industrial-Scale Drum Supply
    • Exact IDH 596526 Grade Mapping
  • BONDERITE S-AD 3305

    BONDERITE S-AD 3305

    • Non-Foaming Pickling-Bath Inhibition
    • Scale Removal Without Rate Loss
    • Reduced Acid Consumption
  • BONDERITE S-AD 50

    BONDERITE S-AD 50

    • Hydrochloric-Acid Pickling Inhibition
    • Non-Foaming Liquid Bath Additive
    • 1 to 6 g/L Process Concentration
  • BONDERITE S-FN 329

    BONDERITE S-FN 329

    • Room-Temperature Dry-Film Cure
    • 0.06 to 0.09 Static Friction
    • Spray, Dip, or Brush Application
  • BONDERITE S-FN 6767

    BONDERITE S-FN 6767

    • Oil-Based Corrosion Protection
    • Combined Lubrication and Rust Prevention
    • Liquid Protective-Lubricant Format
  • BONDERITE S-ST 6776

    BONDERITE S-ST 6776

    • Dip and High-Cling Variant Options
    • Epoxy and Polyurethane Paint Removal
    • Methylene-Chloride-Free Stripping Chemistry
  • BONDERITE S-ST 6776-LO

    BONDERITE S-ST 6776-LO

    • Vertical and Overhead Surface Cling
    • Ready-to-Use Spray or Manual Application
    • Epoxy and Polyurethane Paint Removal
  • BONDERITE S-ST 6813

    BONDERITE S-ST 6813 E

    • Multi-Coat Aerospace Paint Removal
    • Vertical and Overhead Surface Cling
    • Cold-Water Rinse Removal
  • BONDERITE S-ST 6930

    BONDERITE S-ST 6930

    • Hydrogen-Peroxide-Activated Paint Removal
    • Vertical and Overhead Surface Cling
    • High-Pressure Water-Rinse Removal
  • BOSTIK 70-07A

    BOSTIK 70-07A

    • Adjustable Spray-Texture Application
    • Elastic from -40 to 100 deg C
    • Primerless Adhesion on Listed Substrates
  • BOSTIK 915

    BOSTIK 915

    • 35% Dynamic Joint Movement
    • 685% Cured Elongation
    • 60-Minute Tooling Window
  • BOSTIK 940A

    BOSTIK 940A

    • Extended Open Time for Large Applications
    • UV-Resistant Marine Bonding and Sealing
    • Sandable and Paintable After Cure
  • BOSTIK F10-316

    BOSTIK F10-316

    • Fast-Curing Thermoset Film
    • Good Flow for Flexible Constructions
    • Fabric Foam Film and Foil Bonding
  • BOSTIK F10-634

    BOSTIK F10-634

    • Excellent Texture Retention
    • Flexible Heat- and Solvent-Resistant Cure
    • Controlled Aircraft Laminate Processing
  • BOSTIK F14-588

    BOSTIK F14-588

    • High-Shear Heat-Resistant Film Bonding
    • Plasticizer and Shrink Resistance
    • Flexible Decorative Film Lamination
  • BOSTIK FPA110-1FR

    BOSTIK FPA110-1FR

    • Heat-Activated Decorative Lamination
    • Platen or Vacuum-Bag Processing
    • Removable for Interior Refurbishment
  • BOSTIK L3050

    BOSTIK L3050

    • No Two-Part Mixing Required
    • Pressure-Sensitive Liquid Bonding
    • Untreated Polyethylene Bonding
  • BOSTIK LADH1211

    BOSTIK LADH1211

    • Sprayable One-Component Application
    • Unprimed Polyolefin Bonding
    • Pressure and Vacuum Forming
  • BOSTIK LADH1231

    BOSTIK LADH1231

    • Fast-Drying Spray Application
    • Green Strength with Creep Resistance
    • Pressure and Vacuum Forming
  • BOSTIK LADH1255

    BOSTIK LADH1255

    • No Two-Part Mixing Required
    • Moisture-Curing Bond Development
    • Automotive Interior Assembly
  • BOSTIK PA115

    BOSTIK PA115

    • 115 deg C Dry-Heat Activation
    • Uniform Fine-Filament Adhesive Coverage
    • Intermittent and Continuous Processing
  • BOSTIK PA145

    BOSTIK PA145

    • 141 deg C Dry-Heat Activation
    • Resists Cleaning and Home Laundering
    • Fabrics, Foam and Vinyl Bonding
  • BOSTIK PE103

    BOSTIK PE103

    • 100% Solids Web Adhesive
    • Moderate 105 deg C Activation
    • Uniform Fine-Filament Adhesive Coverage
  • BOSTIK PE120

    BOSTIK PE120

    • Uniform Filament Adhesive Coverage
    • Intermittent or Continuous Lamination
    • Textile and Urethane Foam Adhesion
  • BOSTIK SGH0005-03A

    BOSTIK SGH0005-03A

    • Quick-Tack Assembly Fixturing
    • Flexible Moisture-Cured Thermoset Bond
    • Steel, Wood and Plastic Bonding
  • BOSTIK SH4275

    BOSTIK SH4275

    • 20-71 g/m^2 Basis-Weight Options
    • Approx. 130 deg C Heat Activation
    • Industrial Filter and Textile Laminating
  • BOSTIK SPA110

    BOSTIK SPA110

    • 105 deg C Heat Activation
    • Dry Polyamide Web Lamination
    • Aerospace and Mobility Laminate Bonding
  • BOSTIK SPA145FR-A

    BOSTIK SPA145FR-A

    • Flame-Retardant Web Lamination
    • Controlled Adhesive Usage
    • Aerospace Interior Laminate Bonding
  • BOSTIK STR220A

    BOSTIK STR220A

    • Elastic SMP Joint Bonding
    • 30-Minute Skin Formation
    • Excellent UV and Weather Resistance
  • BOSTIK STR-350A

    BOSTIK STR-350A

    • Fast 15-Minute Skin Formation
    • High-Elongation Elastic Joint
    • Excellent UV Resistance

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